being circular or elliptic

Industry

CPC
H01L2224/05555

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05555being circular or elliptic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with increased thermal radiation efficiency
- Patent number 12,113,050
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 12,113,003
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip having a through electrode and semiconductor pac...
- Patent number 12,027,482
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 11,973,045
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 11,881,446
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,824,027
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,791,286
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Youn-ji Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad modification
- Patent number 11,756,911
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Krishna Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,742,271
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Gyuho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for improving power delivery and signaling in s...
- Patent number 11,728,315
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Anthony D. Veches
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,616,033
- Issue date Mar 28, 2023
- Kioxia Corporation
- Noriyuki Moriyasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,545,451
- Issue date Jan 3, 2023
- Nepes Co., Ltd.
- Hyun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component with component interconnection element
- Patent number 11,527,497
- Issue date Dec 13, 2022
- Murata Manufacturing Co., Ltd.
- Heikki Kuisma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,527,502
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240387421
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Hyungsun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240379600
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-FA CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-SIZE DIE, RELATED DEVICES AND METHODS
- Publication number 20240371807
- Publication date Nov 7, 2024
- Skyworks Solutions, Inc.
- Junhyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240321800
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Wenchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240321850
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yusuke IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321792
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...
- Publication number 20240321794
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH
- Publication number 20240321793
- Publication date Sep 26, 2024
- Xilinx, Inc.
- Yun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
- Publication number 20240266267
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- PEI CHENG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL I/O DIE
- Publication number 20240243074
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240222303
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PAD
- Publication number 20240178169
- Publication date May 30, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...
- Publication number 20240153901
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153898
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Minseung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
- Publication number 20240145317
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Arranging Conductive Pads In Electronic Devices
- Publication number 20240120302
- Publication date Apr 11, 2024
- Intel Corporation
- Krishna Bharath Kolluru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120299
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- JIHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...
- Publication number 20240105527
- Publication date Mar 28, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105661
- Publication date Mar 28, 2024
- Unimicron Technology Corp.
- Yu-Shen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
- Publication number 20240071998
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240063250
- Publication date Feb 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sang Jo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20240063151
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS

being circular or elliptic

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with interconnectors of different density

Patterned and planarized under-bump metallization

Semiconductor package with increased thermal radiation efficiency

Semiconductor device with composite middle interconnectors

Bonded structures

Methods and devices for fabricating and assembling printable semico...

Semiconductor chip having a through electrode and semiconductor pac...

Methods of manufacturing semiconductor device with bump interconnec...

Pad structure design in fan-out package

Semiconductor structure and method for forming same

Silicon photonic interposer with two metal redistribution layers

Semiconductor device and method of manufacturing

Contact pad for semiconductor device

Multi-metal contact structure

Methods of manufacturing a semiconductor device including a joint a...

Semiconductor device with composite middle interconnectors

Semiconductor device including bond pad with fixing parts fixed ont...

Shielding structures

Conductive bump of a semiconductor device and fabricating method th...

Semiconductor package

Semiconductor device and semiconductor package

Metal pad modification

Semiconductor package

Methods and systems for improving power delivery and signaling in s...

Semiconductor device and method of making wafer level chip scale pa...

Bonded structures

Semiconductor device

Semiconductor package

Electrical component with component interconnection element

Contact pad for semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

REDUCED-SIZE DIE, RELATED DEVICES AND METHODS

DISPLAY DEVICE

ISOLATOR

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...

CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH

SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS

COAXIAL I/O DIE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING BONDING PAD

SEMICONDUCTOR PACKAGES

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES HAVING TEST PADS

Techniques For Arranging Conductive Pads In Electronic Devices

SEMICONDUCTOR PACKAGE

GALVANIC ISOLATION DEVICE

ELECTRONIC DEVICE, ELECTRONIC STRUCTURE AND METHOD OF MANUFACTURING...

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...