being disposed in a single wiring level

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H01L2224/06138

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06138being disposed in a single wiring level

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses comprising semiconductor dies in face-to-face arrangements
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- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses comprising semiconductor dies in face-to-face arrangements
- Patent number 10,431,566
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
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- Issue date Jun 18, 2019
- Samsung Display Co., Ltd.
- Hae-Kwan Seo
- G02 - OPTICS
Information Patent Grant
Semiconductor logic device and system and method of embedded packag...
- Patent number 10,276,523
- Issue date Apr 30, 2019
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses comprising semiconductor dies in face-to-face arrangements
- Patent number 10,115,709
- Issue date Oct 30, 2018
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of same
- Patent number 9,704,805
- Issue date Jul 11, 2017
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die with corner IO pads
- Patent number 9,633,959
- Issue date Apr 25, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Shailesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of same
- Patent number 9,343,395
- Issue date May 17, 2016
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing electrical connections to spaced conductive lines
- Patent number 9,224,742
- Issue date Dec 29, 2015
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
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- Issue date Nov 24, 2015
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing electrical connections to spaced conductive lines
- Patent number 8,987,906
- Issue date Mar 24, 2015
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Identification mechanism for semiconductor device die
- Patent number 8,742,599
- Issue date Jun 3, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Colby G. Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing electrical connections to spaced conductive lines
- Patent number 8,735,285
- Issue date May 27, 2014
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing electrical connections to spaced conductive lines
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- Issue date Jan 14, 2014
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 8,450,856
- Issue date May 28, 2013
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing electrical connections to spaced conductive lines
- Patent number 8,383,504
- Issue date Feb 26, 2013
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing electrical connections to spaced conductive lines
- Patent number 8,043,964
- Issue date Oct 25, 2011
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
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- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...
- Publication number 20230395441
- Publication date Dec 7, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shifting Contact Pad for Reducing Stress
- Publication number 20230275047
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT WITH ROUTING STRUCTURE IN BONDING LAYER
- Publication number 20230005850
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- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
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Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements
- Publication number 20190304955
- Publication date Oct 3, 2019
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LOGIC DEVICE AND SYSTEM AND METHOD OF EMBEDDED PACKAG...
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- GENERAL ELECTRIC COMPANY
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements
- Publication number 20190013294
- Publication date Jan 10, 2019
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID BASED MULTI SIZE PAD PACKAGE
- Publication number 20180053740
- Publication date Feb 22, 2018
- QUALCOMM Incorporated
- Manoj KAKADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...
- Publication number 20150200177
- Publication date Jul 16, 2015
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE
- Publication number 20140232017
- Publication date Aug 21, 2014
- FREESCALE SEMICONDUCTOR, INC.
- COLBY G. RAMPLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES
- Publication number 20140225264
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES
- Publication number 20140094026
- Publication date Apr 3, 2014
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE
- Publication number 20140061952
- Publication date Mar 6, 2014
- Colby G. Rampley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME
- Publication number 20140021618
- Publication date Jan 23, 2014
- Hisao SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20130260551
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES
- Publication number 20130210230
- Publication date Aug 15, 2013
- Micron Technology, Inc.
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20120153498
- Publication date Jun 21, 2012
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES
- Publication number 20120009784
- Publication date Jan 12, 2012
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES
- Publication number 20100295183
- Publication date Nov 25, 2010
- Gurtej Sandhu
- H01 - BASIC ELECTRIC ELEMENTS

being disposed in a single wiring level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatuses comprising semiconductor dies in face-to-face arrangements

Apparatuses comprising semiconductor dies in face-to-face arrangements

Display device

Semiconductor logic device and system and method of embedded packag...

Apparatuses comprising semiconductor dies in face-to-face arrangements

Semiconductor device and manufacturing method of same

Integrated circuit die with corner IO pads

Semiconductor device and manufacturing method of same

Method for providing electrical connections to spaced conductive lines

Semiconductor device and method of forming the same

Method for providing electrical connections to spaced conductive lines

Identification mechanism for semiconductor device die

Method for providing electrical connections to spaced conductive lines

Method for providing electrical connections to spaced conductive lines

Semiconductor device and method of forming the same

Method for providing electrical connections to spaced conductive lines

Method for providing electrical connections to spaced conductive lines

Patents Applicationslast 30 patents

DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...

Shifting Contact Pad for Reducing Stress

ELEMENT WITH ROUTING STRUCTURE IN BONDING LAYER

Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements

SEMICONDUCTOR LOGIC DEVICE AND SYSTEM AND METHOD OF EMBEDDED PACKAG...

Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements

LAND GRID BASED MULTI SIZE PAD PACKAGE

WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC...

IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE

METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES

METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES

IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES

Semiconductor Device and Method of Forming the Same

METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES

METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES