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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Metal core solder ball interconnector fan-out wafer level package
- Patent number 10,679,930
- Issue date Jun 9, 2020
- Hana Micron Inc.
- Hyun Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ball and electronic device
- Patent number 10,446,512
- Issue date Oct 15, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding electrode structure of flip-chip led chip and fabrication m...
- Patent number 10,276,750
- Issue date Apr 30, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,991,221
- Issue date Jun 5, 2018
- Renesas Electronics Corporation
- Jun Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,818,715
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jun Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structures and methods with a metal pillar
- Patent number 9,508,666
- Issue date Nov 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a plurality of metal posts
- Patent number 9,263,407
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder transfer substrate, manufacturing method of solder transfer...
- Patent number 9,238,278
- Issue date Jan 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure design for 3DIC testing
- Patent number 9,219,016
- Issue date Dec 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector design for packaging integrated circuits
- Patent number 8,901,735
- Issue date Dec 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector design for packaging integrated circuits
- Patent number 8,664,760
- Issue date Mar 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of multi-chip modules with proximity connectors using refl...
- Patent number 8,648,463
- Issue date Feb 11, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC packaging structures and methods with a metal pillar
- Patent number 8,610,285
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure and bonding structure
- Patent number 7,932,600
- Issue date Apr 26, 2011
- Taiwan TFT LCD Association
- Ngai Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor devices
- Patent number 7,186,637
- Issue date Mar 6, 2007
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a laminated structure
- Patent number 6,802,930
- Issue date Oct 12, 2004
- AU OPTRONICS CORPORATION
- Ling-Yi Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234357
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGWEON SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230145304
- Publication date May 11, 2023
- InnoLux Corporation
- Yi-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20180047696
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Jun YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
- Publication number 20140262470
- Publication date Sep 18, 2014
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Design for Packaging Integrated Circuits
- Publication number 20140131864
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures and Methods with a Metal Pillar
- Publication number 20140038405
- Publication date Feb 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AN...
- Publication number 20140010991
- Publication date Jan 9, 2014
- PANASONIC CORPORATION
- Daisuke Sakurai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Structure Design for 3DIC Testing
- Publication number 20130077272
- Publication date Mar 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Design for Packaging Integrated Circuits
- Publication number 20120306073
- Publication date Dec 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures and Methods
- Publication number 20120306080
- Publication date Dec 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Bump Structures Having Sidewall Protection Layers
- Publication number 20110304042
- Publication date Dec 15, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES
- Publication number 20110278718
- Publication date Nov 17, 2011
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE AND BONDING STRUCTURE
- Publication number 20090200686
- Publication date Aug 13, 2009
- TAIWAN TFT LCD ASSOCIATION
- Ngai Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of bonding semiconductor devices
- Publication number 20050025942
- Publication date Feb 3, 2005
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated structure
- Publication number 20040244906
- Publication date Dec 9, 2004
- AU Optoelectronic Corporation
- Ling-Yi Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated structure
- Publication number 20020076537
- Publication date Jun 20, 2002
- Unipac Optoelectronics Corporation
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated structure
- Publication number 20020074385
- Publication date Jun 20, 2002
- Unipac Optoelectronics Corporation
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS

being disposed next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal core solder ball interconnector fan-out wafer level package

Conductive ball and electronic device

Bonding electrode structure of flip-chip led chip and fabrication m...

Metal post bonding using pre-fabricated metal posts

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Packaging structures and methods with a metal pillar

Method for manufacturing a plurality of metal posts

Solder transfer substrate, manufacturing method of solder transfer...

Structure design for 3DIC testing

Connector design for packaging integrated circuits

Connector design for packaging integrated circuits

Assembly of multi-chip modules with proximity connectors using refl...

3D IC packaging structures and methods with a metal pillar

Electrical connecting structure and bonding structure

Method of bonding semiconductor devices

Method of making a laminated structure

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Metal Post Bonding Using Pre-Fabricated Metal Posts

Connector Design for Packaging Integrated Circuits

Packaging Structures and Methods with a Metal Pillar

SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AN...

Structure Design for 3DIC Testing

Connector Design for Packaging Integrated Circuits

Packaging Structures and Methods

Copper Bump Structures Having Sidewall Protection Layers

ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES

ELECTRICAL CONNECTING STRUCTURE AND BONDING STRUCTURE

Method of bonding semiconductor devices

Laminated structure

Laminated structure

Laminated structure