being non uniform along the layer connector

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CPC
H01L2224/29017

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29017being non uniform along the layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode and display apparatus having the same
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- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,378
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic apparatus
- Patent number 11,676,929
- Issue date Jun 13, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masataka Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sandwich structure with two parts joined together by mea...
- Patent number 10,332,858
- Issue date Jun 25, 2019
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-pillar assisted semiconductor bonding
- Patent number 10,319,693
- Issue date Jun 11, 2019
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
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- Issue date Jul 4, 2017
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate
- Patent number 9,655,240
- Issue date May 16, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems
- Patent number 9,355,896
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chips having improved solidity, semiconductor package...
- Patent number 9,324,686
- Issue date Apr 26, 2016
- SK hynix Inc.
- Jong Hyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded electrical component surface interconnect
- Patent number 9,245,819
- Issue date Jan 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package systems and manufacturing methods thereof
- Patent number 9,112,001
- Issue date Aug 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package systems having an opening in a substrate thereof and manufa...
- Patent number 9,000,578
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device, manufacturing program...
- Patent number 8,691,628
- Issue date Apr 8, 2014
- Kabushiki Kaisha Toshiba
- Yasuo Tane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems having a eutectic bonding material and manufacturin...
- Patent number 8,674,495
- Issue date Mar 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mounting structure of semiconductor package component and manufactu...
- Patent number 8,664,773
- Issue date Mar 4, 2014
- Panasonic Corporation
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, and semiconductor package and system each inclu...
- Patent number 8,519,470
- Issue date Aug 27, 2013
- Samsung Electronics Co., Ltd.
- Sun-won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method using multi-step adhesive curing for sealed se...
- Patent number 8,513,060
- Issue date Aug 20, 2013
- Renesas Electronics Corporation
- Hiroaki Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
- Patent number 7,375,427
- Issue date May 20, 2008
- Seiko Epson Corporation
- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting device and electrical connecting method
- Patent number 6,835,274
- Issue date Dec 28, 2004
- Sony Corporation
- Noriyuki Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connecting device and electrical connecting method
- Patent number 6,365,840
- Issue date Apr 2, 2002
- Sony Corporation
- Noriyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240153839
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20240128291
- Publication date Apr 18, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240047444
- Publication date Feb 8, 2024
- LG Display Co., Ltd.
- JongBeom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE
- Publication number 20230352458
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- NICHIA CORPORATION
- Tetsuya ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20230275058
- Publication date Aug 31, 2023
- Sony Semiconductor Solutions Corporation
- MASATAKA MAEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...
- Publication number 20230197666
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- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220367311
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220045027
- Publication date Feb 10, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- SHOZO OCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20210159202
- Publication date May 27, 2021
- Sony Semiconductor Solutions Corporation
- MASATAKA MAEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...
- Publication number 20190043820
- Publication date Feb 7, 2019
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
- Publication number 20180331063
- Publication date Nov 15, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
- Publication number 20160254243
- Publication date Sep 1, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND...
- Publication number 20140217618
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- Harris Corporation
- Andrew Craig KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20140170849
- Publication date Jun 19, 2014
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
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SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...
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- SK HYNIX INC.
- Jong Hyun NAM
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Information Patent Application
SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...
- Publication number 20130328218
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- RENESAS ELECTRONICS CORPORATION
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Electrical Component Surface Interconnect
- Publication number 20130215583
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130193588
- Publication date Aug 1, 2013
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...
- Publication number 20130040426
- Publication date Feb 14, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROAKI NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...
- Publication number 20120299202
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- PANASONIC CORPORATION
- Atsushi YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...
- Publication number 20120149151
- Publication date Jun 14, 2012
- Kabushiki Kaisha Toshiba
- Yasuo TANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086126
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20120086127
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...
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- Samsung Electronics Co., Ltd.
- Sun-won KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110267796
- Publication date Nov 3, 2011
- Atsushi YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS

being non uniform along the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode and display apparatus having the same

Semiconductor package structure and method for forming the same

Electronic substrate and electronic apparatus

Power electronics assembly having an adhesion layer, and method for...

Electronic sandwich structure with two parts joined together by mea...

Micro-pillar assisted semiconductor bonding

Method for bonding substrates

Electronic devices with semiconductor die attached with sintered me...

Semiconductor device and method of manufacturing a semiconductor de...

Substrate

Electrode connection structure and electrode connection method

Electronic devices with semiconductor die coupled to a thermally co...

Package systems

Semiconductor chips having improved solidity, semiconductor package...

Embedded electrical component surface interconnect

Package systems and manufacturing methods thereof

Package systems having an opening in a substrate thereof and manufa...

Method of manufacturing semiconductor device, manufacturing program...

Package systems having a eutectic bonding material and manufacturin...

Mounting structure of semiconductor package component and manufactu...

Semiconductor chip, and semiconductor package and system each inclu...

Manufacturing method using multi-step adhesive curing for sealed se...

Electronic component mounting structure

Semiconductor device, circuit board, electro-optic device, electron...

Electrical connecting device and electrical connecting method

Electrical connecting device and electrical connecting method

Patents Applicationslast 30 patents

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

DISPLAY DEVICE

LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE

CHIP-ON-FILM PACKAGE

ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS

POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...

Semiconductor Device and Manufacturing Method Thereof

METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...

SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...

Embedded Electrical Component Surface Interconnect

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...

MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT MOUNTING STRUCTURE