being non uniform along the layer connector

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CPC
H01L2224/29017

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29017being non uniform along the layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic apparatus
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- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
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Information Patent Grant
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- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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- Damien Lambert
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Information Patent Grant
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- Jurgen Burggraf
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Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
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- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
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Information Patent Grant
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- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate
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Information Patent Grant
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- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
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- NXP USA, INC.
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Information Patent Grant
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- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chips having improved solidity, semiconductor package...
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- Issue date Apr 26, 2016
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- Jong Hyun Nam
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Information Patent Grant
Embedded electrical component surface interconnect
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- Issue date Jan 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package systems and manufacturing methods thereof
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- Issue date Aug 18, 2015
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- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package systems having an opening in a substrate thereof and manufa...
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- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device, manufacturing program...
- Patent number 8,691,628
- Issue date Apr 8, 2014
- Kabushiki Kaisha Toshiba
- Yasuo Tane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems having a eutectic bonding material and manufacturin...
- Patent number 8,674,495
- Issue date Mar 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mounting structure of semiconductor package component and manufactu...
- Patent number 8,664,773
- Issue date Mar 4, 2014
- Panasonic Corporation
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, and semiconductor package and system each inclu...
- Patent number 8,519,470
- Issue date Aug 27, 2013
- Samsung Electronics Co., Ltd.
- Sun-won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method using multi-step adhesive curing for sealed se...
- Patent number 8,513,060
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
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- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, circuit board, electro-optic device, electron...
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- Shuichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting device and electrical connecting method
- Patent number 6,835,274
- Issue date Dec 28, 2004
- Sony Corporation
- Noriyuki Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connecting device and electrical connecting method
- Patent number 6,365,840
- Issue date Apr 2, 2002
- Sony Corporation
- Noriyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20240128291
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- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
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- JongBeom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE
- Publication number 20230352458
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- NICHIA CORPORATION
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CHIP-ON-FILM PACKAGE
- Publication number 20230326896
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- Chipbond Technology Corporation
- Sheng-Jen Wu
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ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS
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ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS
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POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...
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- SEMIKRON ELEKTRONIK GMBH & CO. KG
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- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
- Publication number 20180331063
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- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- Publication number 20160254243
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- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
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- Hitachi, Ltd
- Hisashi Tanie
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- G02 - OPTICS

being non uniform along the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package structure and method for forming the same

Electronic substrate and electronic apparatus

Power electronics assembly having an adhesion layer, and method for...

Electronic sandwich structure with two parts joined together by mea...

Micro-pillar assisted semiconductor bonding

Method for bonding substrates

Electronic devices with semiconductor die attached with sintered me...

Semiconductor device and method of manufacturing a semiconductor de...

Substrate

Electrode connection structure and electrode connection method

Electronic devices with semiconductor die coupled to a thermally co...

Package systems

Semiconductor chips having improved solidity, semiconductor package...

Embedded electrical component surface interconnect

Package systems and manufacturing methods thereof

Package systems having an opening in a substrate thereof and manufa...

Method of manufacturing semiconductor device, manufacturing program...

Package systems having a eutectic bonding material and manufacturin...

Mounting structure of semiconductor package component and manufactu...

Semiconductor chip, and semiconductor package and system each inclu...

Manufacturing method using multi-step adhesive curing for sealed se...

Electronic component mounting structure

Semiconductor device, circuit board, electro-optic device, electron...

Electrical connecting device and electrical connecting method

Electrical connecting device and electrical connecting method

Patents Applicationslast 30 patents

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

DISPLAY DEVICE

LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE

CHIP-ON-FILM PACKAGE

ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS

CHIP PACKAGING STRUCTURE AND METHOD FOR PREPARING THE SAME, AND MET...

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC SUBSTRATE AND ELECTRONIC APPARATUS

POWER ELECTRONICS ASSEMBLY HAVING AN ADHESION LAYER, AND METHOD FOR...

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...

Semiconductor Device and Manufacturing Method Thereof

METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...

SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...

Embedded Electrical Component Surface Interconnect

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD USING MULTI-STEP ADHESIVE CURING FOR SEALED S...

MOUNTING STRUCTURE OF SEMICONDUCTOR PACKAGE COMPONENT AND MANUFACTU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...

NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT MOUNTING STRUCTURE