Belt conveyor

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CPC
H01L2224/75651

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75651Belt conveyor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for connecting electronic assemblies
- Patent number 12,021,058
- Issue date Jun 25, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laned belt for cleaner
- Patent number 11,872,600
- Issue date Jan 16, 2024
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Grant
Electronic device
- Patent number 11,843,085
- Issue date Dec 12, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,545,606
- Issue date Jan 3, 2023
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,515,287
- Issue date Nov 29, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip front surface touchless pick and place tool or flip chip bonder
- Patent number 11,282,722
- Issue date Mar 22, 2022
- Yunjun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reel-to-reel laser reflow
- Patent number 11,257,783
- Issue date Feb 22, 2022
- LASERSSEL CO., LTD.
- Byung Rock Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 11,063,195
- Issue date Jul 13, 2021
- Innolux Corporation
- Shun-Yuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing plurality of electronic circ...
- Patent number 10,811,383
- Issue date Oct 20, 2020
- Pragmatic Printing Ltd.
- Neil Davies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conveying device
- Patent number 10,739,043
- Issue date Aug 11, 2020
- JTEKT Corporation
- Toshiyuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit pin positioning structure, fabrication method of soldered c...
- Patent number 10,679,961
- Issue date Jun 9, 2020
- Tarng Yu Enterprise Co., Ltd.
- Tsung-Chi Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices f...
- Patent number 10,636,770
- Issue date Apr 28, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for transfer of semiconductor devices
- Patent number 10,622,337
- Issue date Apr 14, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,615,153
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device on glass substrate
- Patent number 10,615,152
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,566,319
- Issue date Feb 18, 2020
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices
- Patent number 10,490,532
- Issue date Nov 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240363579
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Seungyeop Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240072230
- Publication date Feb 29, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES
- Publication number 20240047413
- Publication date Feb 8, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230223376
- Publication date Jul 13, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANED BELT FOR CLEANER
- Publication number 20230104821
- Publication date Apr 6, 2023
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Application
IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD
- Publication number 20230019546
- Publication date Jan 19, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210313501
- Publication date Oct 7, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210296551
- Publication date Sep 23, 2021
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip Front Surface Touchless Pick and Place Tool or Flip Chip Bonder
- Publication number 20210057242
- Publication date Feb 25, 2021
- Yunjun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20190348405
- Publication date Nov 14, 2019
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Application
METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20190237445
- Publication date Aug 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LIGHT DIFFUSION
- Publication number 20190139945
- Publication date May 9, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING RESIN LAYER FORMING APPARATUS
- Publication number 20190139928
- Publication date May 9, 2019
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATING STRUCTURE OF ELECTRONIC DEVICE USING TRANSFERRING ELEMEN...
- Publication number 20190103532
- Publication date Apr 4, 2019
- CENTER FOR INTEGRATED SMART SENSORS FOUNDATION
- Keon Jae Lee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING PLURALITY OF ELECTRONIC CIRC...
- Publication number 20190067243
- Publication date Feb 28, 2019
- PRAGMATIC PRINTING LTD
- Neil DAVIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method of Making the Same Using Surface Mount...
- Publication number 20190059160
- Publication date Feb 21, 2019
- Thin Film Electronics ASA
- Olle HAGEL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
CIRCUIT PIN POSITIONING STRUCTURE, FABRICATION METHOD OF SOLDERED C...
- Publication number 20180082974
- Publication date Mar 22, 2018
- Tarng Yu Enterprise co.,ltd
- TSUNG-CHI CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONVEYING DEVICE
- Publication number 20180073781
- Publication date Mar 15, 2018
- JTEKT Corporation
- Toshiyuki SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
- Publication number 20170012009
- Publication date Jan 12, 2017
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW APPARATUS
- Publication number 20170005063
- Publication date Jan 5, 2017
- Samsung Electronics Co., Ltd.
- Tae-gyu KANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PRODUCING IC CHIP PACKAGE
- Publication number 20140202641
- Publication date Jul 24, 2014
- SINFONIA TECHNOLOGY CO., LTD.
- Taichi INOUE
- H01 - BASIC ELECTRIC ELEMENTS

Belt conveyor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

System and method for connecting electronic assemblies

Laned belt for cleaner

Electronic device

Laser bonding apparatus for three-dimensional molded sculptures

Systems for direct transfer of semiconductor device die

Ultrasonic-assisted solder transfer

Electronic device and method for manufacturing the same

Device and method for reel-to-reel laser reflow

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Method and system for bonding a chip to a substrate

System for processing semiconductor devices

Chip front surface touchless pick and place tool or flip chip bonder

Device and method for reel-to-reel laser reflow

Method for improved transfer of semiconductor die

Electronic device and method for manufacturing the same

Apparatus for direct transfer of semiconductor device die

Apparatus and method for manufacturing plurality of electronic circ...

Systems and methods for improved delamination characteristics in a...

Conveying device

Semiconductor chip package with resilient conductive paste post and...

Circuit pin positioning structure, fabrication method of soldered c...

Apparatus and method for direct transfer of semiconductor devices f...

Method and apparatus for transfer of semiconductor devices

Apparatus for direct transfer of semiconductor device die

Semiconductor device on glass substrate

Semiconductor device processing method for material removal

Apparatus for direct transfer of semiconductor device die

Apparatus and method for direct transfer of semiconductor devices

Patents Applicationslast 30 patents

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC DEVICE

SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

LANED BELT FOR CLEANER

IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

Tools and Systems for Processing Semiconductor Devices, and Methods...

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

ULTRASONIC-ASSISTED SOLDER TRANSFER

Chip Front Surface Touchless Pick and Place Tool or Flip Chip Bonder

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

Apparatus and Method for Direct Transfer of Semiconductor Devices

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE

METHOD AND APPARATUS FOR LIGHT DIFFUSION

DIE BONDING RESIN LAYER FORMING APPARATUS

LAMINATING STRUCTURE OF ELECTRONIC DEVICE USING TRANSFERRING ELEMEN...

APPARATUS AND METHOD FOR MANUFACTURING PLURALITY OF ELECTRONIC CIRC...

Electronic Device and Method of Making the Same Using Surface Mount...

Tools and Systems for Processing Semiconductor Devices, and Methods...

CIRCUIT PIN POSITIONING STRUCTURE, FABRICATION METHOD OF SOLDERED C...

CONVEYING DEVICE

SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL

REFLOW APPARATUS

APPARATUS FOR PRODUCING IC CHIP PACKAGE