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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/665Bias feed arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power amplification device and an RF circuit module
- Patent number 12,334,884
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Mitsunori Samata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged power amplifier device
- Patent number 12,327,805
- Issue date Jun 10, 2025
- NXP USA, INC.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged power amplifier device with air cavity over die
- Patent number 12,328,107
- Issue date Jun 10, 2025
- NXP USA, INC.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged transistor amplifiers that include integrated passive devi...
- Patent number 12,315,829
- Issue date May 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- David Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency amplifier
- Patent number 12,301,179
- Issue date May 13, 2025
- Mitsubishi Electric Corporation
- Yoshinobu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with antenna and front end integrated circuit
- Patent number 12,279,353
- Issue date Apr 15, 2025
- Skyworks Solutions, Inc.
- George Khoury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including plurality of gate fingers with vario...
- Patent number 12,249,543
- Issue date Mar 11, 2025
- Sumitomo Electric Industries, Ltd.
- Kenya Nishiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,243,836
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Shunji Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier device and semiconductor die
- Patent number 12,206,371
- Issue date Jan 21, 2025
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van Der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid Doherty power amplifier module
- Patent number 12,199,571
- Issue date Jan 14, 2025
- Ampleon Netherlands B.V.
- Zhi Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based monolithic microwave integrated circuits ha...
- Patent number 12,191,821
- Issue date Jan 7, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,184,243
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Mikiko Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,183,648
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Mikiko Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic semiconductor device and hybrid semiconductor device
- Patent number 12,183,817
- Issue date Dec 31, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kaname Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier with a power transistor and an electrostatic discha...
- Patent number 12,166,455
- Issue date Dec 10, 2024
- NXP USA, INC.
- David Cobb Burdeaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier, power amplifier circuit, and power amplifier device
- Patent number 12,160,207
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier package
- Patent number 12,142,583
- Issue date Nov 12, 2024
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module and communication apparatus
- Patent number 12,136,614
- Issue date Nov 5, 2024
- Murata Manufacturing Co., Ltd.
- Yukiya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier device
- Patent number 12,119,311
- Issue date Oct 15, 2024
- Sumitomo Electric Device Innovations, Inc.
- Naoyuki Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channelized filter using semiconductor fabrication
- Patent number 12,119,313
- Issue date Oct 15, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier device packages incorporating internal couplers
- Patent number 12,113,482
- Issue date Oct 8, 2024
- MACOM Technology Solutions Holdings, Inc.
- Kenneth Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged RF power device with PCB routing outside protective member
- Patent number 12,100,630
- Issue date Sep 24, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of realizing a wide band impedance mat...
- Patent number 12,094,840
- Issue date Sep 17, 2024
- Sumitomo Electric Device Innovations, Inc.
- Masahiro Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,711
- Issue date Sep 10, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doherty amplifier
- Patent number 12,081,174
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Katsuya Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages with uniform components and methods of forming the...
- Patent number 12,074,149
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT DEVICE AND DOHERTY AMPLIFIER
- Publication number 20250192726
- Publication date Jun 12, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kohei MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIER CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20250183848
- Publication date Jun 5, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takashi SUMIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIER CIRCUIT AND SEMICONDUCTOR DEVICE
- Publication number 20250183849
- Publication date Jun 5, 2025
- SUMITOMO ELECTRONIC DEVICE INNOVATIONS, INC.
- Takashi SUMIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DIE
- Publication number 20250167143
- Publication date May 22, 2025
- MACOM Technology Solutions Holdings, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...
- Publication number 20250159787
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Darren Roger Frenette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...
- Publication number 20250159987
- Publication date May 15, 2025
- Hangzhou Geo-chip Technology Co., Ltd.
- Ruili WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END SYSTEMS WITH SELECTIVELY SHIELDED RADIO FREQUENCY MODULE
- Publication number 20250159788
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT, CRYSTAL, AND SYS...
- Publication number 20250159786
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Darren Roger Frenette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20250150113
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT COMPONENT
- Publication number 20250149472
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Hisatoshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIPLINE MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) INTERCONNE...
- Publication number 20250140717
- Publication date May 1, 2025
- Board of Trustees of the University of Arkansas
- Samir El-Ghazaly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE
- Publication number 20250118708
- Publication date Apr 10, 2025
- RICHWAVE TECHNOLOGY CORP.
- Kuang-Lieh Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH INTERLEAVED WIREBONDS
- Publication number 20250119102
- Publication date Apr 10, 2025
- NXP USA, Inc.
- Vikas SHILIMKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, HIGH FREQUENCY DEVICE, AND METHOD OF MANUFACT...
- Publication number 20250079352
- Publication date Mar 6, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Takuma MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING
- Publication number 20250079300
- Publication date Mar 6, 2025
- Intel Corporation
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRICAL DEVICES AND RELATED METHODS
- Publication number 20250070814
- Publication date Feb 27, 2025
- Skyworks Solutions, Inc.
- Andrew Martin KAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF PUSH-PULL POWER AMPLIFIER CHIP AND RF FRONT-END MODULE
- Publication number 20250070733
- Publication date Feb 27, 2025
- RADROCK (SHENZHEN) TECHNOLOGY CO., LTD.
- Yuan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022818
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Yoshiki NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF MODULE
- Publication number 20250022815
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY AMPLIFIER AND MATCHING CIRCUIT
- Publication number 20240413799
- Publication date Dec 12, 2024
- Mitsubishi Electric Corporation
- Eigo Kuwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER AMPLIFIER WITH GAN-ON-SI AND GAN-ON-SIC CIRCUITS
- Publication number 20240396500
- Publication date Nov 28, 2024
- MACOM Technology Solutions Holdings, Inc.
- Prity Kirit Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387416
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Koji TSUKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371711
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMEN...
- Publication number 20240371802
- Publication date Nov 7, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin MARBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...
- Publication number 20240363461
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsieh-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE
- Publication number 20240356501
- Publication date Oct 24, 2024
- ViaSat, Inc.
- Shih Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND SYSTEM
- Publication number 20240332118
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Kenji SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY POWER AMPLIFIER
- Publication number 20240291437
- Publication date Aug 29, 2024
- Ampleon Netherlands B.V.
- Yang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR RADIO FREQUENCY SWITCH...
- Publication number 20240291446
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Ying CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Bias feed arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplification device and an RF circuit module

Packaged power amplifier device

Packaged power amplifier device with air cavity over die

Dual-mode wireless charging device

Packaged transistor amplifiers that include integrated passive devi...

High frequency amplifier

Packaged module with antenna and front end integrated circuit

Semiconductor device including plurality of gate fingers with vario...

Semiconductor device

Devices and methods related to radio-frequency filters on silicon-o...

Power amplifier device and semiconductor die

Hybrid Doherty power amplifier module

Group III nitride-based monolithic microwave integrated circuits ha...

Semiconductor device

Semiconductor device and semiconductor module

Monolithic semiconductor device and hybrid semiconductor device

Power amplifier with a power transistor and an electrostatic discha...

Power amplifier, power amplifier circuit, and power amplifier device

Transistor with integrated passive components

Power amplifier modules including semiconductor resistor and tantal...

RF amplifier package

Radio frequency module and communication apparatus

Amplifier device

Channelized filter using semiconductor fabrication

Amplifier device packages incorporating internal couplers

Packaged RF power device with PCB routing outside protective member

Semiconductor device capable of realizing a wide band impedance mat...

Semiconductor device

Doherty amplifier

Device packages with uniform components and methods of forming the...

Patents Applicationslast 30 patents

CIRCUIT DEVICE AND DOHERTY AMPLIFIER

DOHERTY AMPLIFIER CIRCUIT AND SEMICONDUCTOR DEVICE

DOHERTY AMPLIFIER CIRCUIT AND SEMICONDUCTOR DEVICE

POWER AMPLIFIER DIE

PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...

RF FRONT-END CHIP, MANUFACTURING METHOD THEREOF, CIRCUIT STRUCTURE...

FRONT END SYSTEMS WITH SELECTIVELY SHIELDED RADIO FREQUENCY MODULE

PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT, CRYSTAL, AND SYS...

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

HIGH-FREQUENCY CIRCUIT COMPONENT

STRIPLINE MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) INTERCONNE...

FRONT-END CIRCUIT AND SEMI-CONDUCTOR DEVICE

POWER AMPLIFIER MODULE WITH INTERLEAVED WIREBONDS

SEMICONDUCTOR DEVICE, HIGH FREQUENCY DEVICE, AND METHOD OF MANUFACT...

MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING

PACKAGED ELECTRICAL DEVICES AND RELATED METHODS

RF PUSH-PULL POWER AMPLIFIER CHIP AND RF FRONT-END MODULE

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR MODULE

RF MODULE

HIGH FREQUENCY AMPLIFIER AND MATCHING CIRCUIT

HYBRID POWER AMPLIFIER WITH GAN-ON-SI AND GAN-ON-SIC CIRCUITS

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMEN...

Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...

MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND SYSTEM

DOHERTY POWER AMPLIFIER

BULK COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR RADIO FREQUENCY SWITCH...