Bonding an individual cap on the substrate

Industry

CPC
B81C2203/0109

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/0109Bonding an individual cap on the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS mirror and method of manufacture
- Patent number 12,078,799
- Issue date Sep 3, 2024
- STMicroelectron S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ingress protection mechanism
- Patent number 12,035,092
- Issue date Jul 9, 2024
- GM CRUISE HOLDINGS LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,981,559
- Issue date May 14, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a microelectromechanical sensor and microelect...
- Patent number 11,958,740
- Issue date Apr 16, 2024
- Robert Bosch GmbH
- Achim Kronenberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding method
- Patent number 11,945,714
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,897,760
- Issue date Feb 13, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,884,537
- Issue date Jan 30, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,834,330
- Issue date Dec 5, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 11,800,297
- Issue date Oct 24, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensing implant
- Patent number 11,707,230
- Issue date Jul 25, 2023
- ENDOTRONIX, INC.
- Harry Rowland
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed MEMS mirror and method of manufacture
- Patent number 11,675,186
- Issue date Jun 13, 2023
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package comprising multi-depth trenches
- Patent number 11,667,522
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMs using outgassing material to adjust the pressure level in a ca...
- Patent number 11,634,318
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor
- Patent number 11,579,033
- Issue date Feb 14, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS mirror arrangement for detecting a large angular range
- Patent number 11,531,196
- Issue date Dec 20, 2022
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus having a bondline structure and a diffusion barrier with...
- Patent number 11,505,451
- Issue date Nov 22, 2022
- Texas Instruments Incorporated
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of stress decoupling and particle filter on a single wa...
- Patent number 11,505,450
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging structure and packaging method for retinal prosthesis imp...
- Patent number 11,478,654
- Issue date Oct 25, 2022
- HANGZHOU NANOCHAP ELECTRONICS CO., LTD.
- Jiawei Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive micromachined ultrasonic transducer (CMUT) devices and m...
- Patent number 11,440,051
- Issue date Sep 13, 2022
- General Electric Company
- Yizhen Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sound producing package structure and method for packaging sound pr...
- Patent number 11,395,073
- Issue date Jul 19, 2022
- xMEMS Labs, Inc.
- Hai-Hung Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
- Publication number 20240381034
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240336474
- Publication date Oct 10, 2024
- AAC TECHNOLOGIES PTE. LTD
- Houming Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317580
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317578
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MA...
- Publication number 20240253978
- Publication date Aug 1, 2024
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240051818
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
- Publication number 20240043265
- Publication date Feb 8, 2024
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...
- Publication number 20230406697
- Publication date Dec 21, 2023
- ROBERT BOSCH GmbH
- Mohammad Abbasi Gavarti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INGRESS PROTECTION MECHANISM
- Publication number 20230396908
- Publication date Dec 7, 2023
- GM Cruise Holdings LLC
- Amanda Lind
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSING IMPLANT
- Publication number 20230380764
- Publication date Nov 30, 2023
- ENDOTRONIX, INC.
- Harry ROWLAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR
- Publication number 20230384164
- Publication date Nov 30, 2023
- MSG Lithoglas GmbH
- David Bunel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE
- Publication number 20230331546
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- FAN HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED MEMS MIRROR AND METHOD OF MANUFACTURE
- Publication number 20230324678
- Publication date Oct 12, 2023
- STMicroelectronics S.r.l
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230249961
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YUAN-CHIH HSIEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
- Publication number 20230232159
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR A MICROMECHANICAL SENSOR ELE...
- Publication number 20230219808
- Publication date Jul 13, 2023
- ROBERT BOSCH GmbH
- Andreas Prinzen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD
- Publication number 20230166964
- Publication date Jun 1, 2023
- Rohm Co., Ltd.
- Nobuhisa YAMASHITA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING
- Publication number 20230100911
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230076715
- Publication date Mar 9, 2023
- CHIP POSITION SYSTEM CO., LTD.
- RUEI CHI CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20230064645
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20230037849
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20230045563
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20230045257
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
- Publication number 20230016038
- Publication date Jan 19, 2023
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20230002217
- Publication date Jan 5, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Jae Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH OUT-OF-PLANE STOPPER STRUCTURE
- Publication number 20220380202
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l.
- Luca GUERINONI
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bonding an individual cap on the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reduced light reflection package

Hermetically sealed MEMS mirror and method of manufacture

Ingress protection mechanism

Enclosed cavity structures

Method for producing a microelectromechanical sensor and microelect...

Integrated digital force sensors and related methods of manufacture

Electronic device and corresponding method

MEMS device having a metallization structure embedded in a dielectr...

Enclosed cavity structures

Sensing module and manufacturing method thereof

Enclosed cavity structures

Semiconductor package with built-in vibration isolation, thermal st...

Enclosed cavity structures

Reduced light reflection package

MEMS device with particle filter and method of manufacture

Hermetically sealed optically transparent wafer-level packages and...

Pressure sensing implant

Hermetically sealed MEMS mirror and method of manufacture

Optical electronics device

MEMS package comprising multi-depth trenches

MEMs using outgassing material to adjust the pressure level in a ca...

Packaged die and assembling method

MEMS pressure sensor

MEMS mirror arrangement for detecting a large angular range

Apparatus having a bondline structure and a diffusion barrier with...

Integration of stress decoupling and particle filter on a single wa...

Packaging structure and packaging method for retinal prosthesis imp...

Capacitive micromachined ultrasonic transducer (CMUT) devices and m...

Inter-poly connection for parasitic capacitor and die size improvement

Sound producing package structure and method for packaging sound pr...

Patents Applicationslast 30 patents

TOP NOTCH SLIT PROFILE FOR MEMS DEVICE

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MA...

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS

REDUCED LIGHT REFLECTION PACKAGE

MEMS PRESSURE SENSOR

PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...

INGRESS PROTECTION MECHANISM

PRESSURE SENSING IMPLANT

INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR

MEMS STRUCTURE

HERMETICALLY SEALED MEMS MIRROR AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

TOP NOTCH SLIT PROFILE FOR MEMS DEVICE

METHOD FOR PRODUCING A BONDING PAD FOR A MICROMECHANICAL SENSOR ELE...

MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD

PARTIAL DICING PROCESS FOR WAFER-LEVEL PACKAGING

SENSING MODULE AND MANUFACTURING METHOD THEREOF

PROTECTIVE BONDLINE CONTROL STRUCTURE

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE

SEMICONDUCTOR DEVICES AND RELATED METHODS

MICROELECTROMECHANICAL DEVICE WITH OUT-OF-PLANE STOPPER STRUCTURE