Bonding techniques not provided for in B81C2203/031 - B81C2203/037

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B81C2203/038

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/038Bonding techniques not provided for in B81C2203/031 - B81C2203/037

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,993,512
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Segmented pedestal for mounting device on chip
- Patent number 11,542,153
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a microelectronic device comprising a memb...
- Patent number 11,511,990
- Issue date Nov 29, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Mathilde Cartier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vapor cells having one or more optical windows bonded to a dielectr...
- Patent number 11,366,430
- Issue date Jun 21, 2022
- Quantum Valley Ideas Laboratories
- Jaime Ramirez-Serrano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,274,037
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming hermetic seals in MEMS devices
- Patent number 11,161,737
- Issue date Nov 2, 2021
- Elbit Systems of America, LLC
- Arlynn W. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Segmented pedestal for mounting device on chip
- Patent number 11,084,715
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of making microfluidic devices
- Patent number 11,065,616
- Issue date Jul 20, 2021
- King Abdullah University of Science and Technology
- Ulrich Buttner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with discharge path, and method for producing...
- Patent number 11,027,968
- Issue date Jun 8, 2021
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component and method for producing same
- Patent number 10,974,958
- Issue date Apr 13, 2021
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Felix Schiebel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-mechanical sensor and method for manufacturing a micro-electr...
- Patent number 10,961,116
- Issue date Mar 30, 2021
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk Meinhold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D stack configuration for 6-axis motion sensor
- Patent number 10,941,033
- Issue date Mar 9, 2021
- Invensense, Inc.
- Dongyang Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 10,879,210
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vapor cells having one or more optical windows bonded to a dielectr...
- Patent number 10,859,981
- Issue date Dec 8, 2020
- Quantum Valley Ideas Laboratories
- Jaime Ramirez-Serrano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive micromachined ultrasonic transducers (CMUTs) and related...
- Patent number 10,850,306
- Issue date Dec 1, 2020
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of achieving universal interfacing using suspended and/or f...
- Patent number 10,807,864
- Issue date Oct 20, 2020
- The Regents of the University of Colorado, a Body Corporate
- Joseph J. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,766,768
- Issue date Sep 8, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectro-mechanical system device and method for electrostatic...
- Patent number 10,717,644
- Issue date Jul 21, 2020
- United Microeletronics Corp
- Linlin Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin MEMS die
- Patent number 10,626,011
- Issue date Apr 21, 2020
- HRL Laboratories, LLC
- Randall L. Kubena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS manufacturing method and MEMS manufacturing apparatus
- Patent number 10,605,824
- Issue date Mar 31, 2020
- Hitachi, Ltd.
- Shuntaro Machida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming hermetic seals in MEMS devices
- Patent number 10,584,027
- Issue date Mar 10, 2020
- Elbit Systems of America, LLC
- Arlynn W. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heater design for MEMS chamber pressure control
- Patent number 10,532,925
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 10,522,499
- Issue date Dec 31, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS actuation systems and methods
- Patent number 10,523,135
- Issue date Dec 31, 2019
- MEMS DRIVE, INC.
- Matthew Ng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 10,508,030
- Issue date Dec 17, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro devices formed by flex circuit substrates
- Patent number 10,512,164
- Issue date Dec 17, 2019
- Encite LLC
- Stephen A. Marsh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,450,190
- Issue date Oct 22, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240262681
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
- Publication number 20240043265
- Publication date Feb 8, 2024
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS
- Publication number 20240036345
- Publication date Feb 1, 2024
- Carl Zeiss SMT GMBH
- Stefan SCHUETTER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230382713
- Publication date Nov 30, 2023
- Vanguard International Semiconductor Corporation
- RAMACHANDRAMURTHY PRADEEP YELEHANKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVI...
- Publication number 20230357001
- Publication date Nov 9, 2023
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
- Publication number 20230092132
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220194783
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTACT LENS, METHOD FOR DETECTING A STRUCTURE-BORNE SOUND WITH THE...
- Publication number 20220057656
- Publication date Feb 24, 2022
- ROBERT BOSCH GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE COMPRISING A MEMB...
- Publication number 20210395079
- Publication date Dec 23, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Mathilde CARTIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD FOR BONDED SUBSTRATE
- Publication number 20210375628
- Publication date Dec 2, 2021
- Murata Manufacturing Co., Ltd.
- Ryunosuke Hino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEGMENTED PEDESTAL FOR MOUNTING DEVICE ON CHIP
- Publication number 20210331915
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20210221678
- Publication date Jul 22, 2021
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20210130167
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vapor Cells Having One or More Optical Windows Bonded to a Dielectr...
- Publication number 20210132549
- Publication date May 6, 2021
- Quantum Valley Ideas Laboratories
- Jaime Ramirez-Serrano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEGMENTED PEDESTAL FOR MOUNTING DEVICE ON CHIP
- Publication number 20200369515
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH DISCHARGE PATH, AND METHOD FOR PRODUCING...
- Publication number 20200299128
- Publication date Sep 24, 2020
- DENSO CORPORATION
- Megumi SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Forming Hermetic Seals in MEMS Devices
- Publication number 20200156932
- Publication date May 21, 2020
- Elbit Systems of America, LLC
- Arlynn W. SMITH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20200140268
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20200140267
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D STACK CONFIGURATION FOR 6-AXIS MOTION SENSOR
- Publication number 20200131027
- Publication date Apr 30, 2020
- InvenSense, Inc.
- Dongyang KANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20200079646
- Publication date Mar 12, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro Devices Formed by Flex Circuit Substrates
- Publication number 20200084892
- Publication date Mar 12, 2020
- ENCITE LLC
- Stephen A. Marsh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-MECHANICAL SENSOR AND METHOD FOR MANUFACTURING A MICRO-ELECTR...
- Publication number 20190345027
- Publication date Nov 14, 2019
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk MEINHOLD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Forming Hermetic Seals in MEMS Devices
- Publication number 20190169023
- Publication date Jun 6, 2019
- Eagle Technology, LLC
- Arlynn W. SMITH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20190055121
- Publication date Feb 21, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bonding techniques not provided for in B81C2203/031 - B81C2203/037

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual micro-electro mechanical system and manufacturing method thereof

Microelectromechanical structure with bonded cover

Segmented pedestal for mounting device on chip

Method for manufacturing a microelectronic device comprising a memb...

Seal for microelectronic assembly

Vapor cells having one or more optical windows bonded to a dielectr...

Dual micro-electro mechanical system and manufacturing method thereof

Seal for microelectronic assembly

Method for forming hermetic seals in MEMS devices

Segmented pedestal for mounting device on chip

Methods of making microfluidic devices

Semiconductor device with discharge path, and method for producing...

Micromechanical component and method for producing same

Micro-mechanical sensor and method for manufacturing a micro-electr...

3D stack configuration for 6-axis motion sensor

Bonded structures

Vapor cells having one or more optical windows bonded to a dielectr...

Capacitive micromachined ultrasonic transducers (CMUTs) and related...

Methods of achieving universal interfacing using suspended and/or f...

Encapsulated microelectromechanical structure

Microelectro-mechanical system device and method for electrostatic...

Thin MEMS die

MEMS manufacturing method and MEMS manufacturing apparatus

Method for forming hermetic seals in MEMS devices

Heater design for MEMS chamber pressure control

Bonded structures

MEMS actuation systems and methods

Seal for microelectronic assembly

Micro devices formed by flex circuit substrates

Encapsulated microelectromechanical structure

Patents Applicationslast 30 patents

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS

METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS

MICROMECHANICAL STRUCTURE WITH BONDED COVER

SEAL FOR MICROELECTRONIC ASSEMBLY

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...

PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVI...

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

SEAL FOR MICROELECTRONIC ASSEMBLY

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

CONTACT LENS, METHOD FOR DETECTING A STRUCTURE-BORNE SOUND WITH THE...

METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE COMPRISING A MEMB...

MANUFACTURING METHOD FOR BONDED SUBSTRATE

SEGMENTED PEDESTAL FOR MOUNTING DEVICE ON CHIP

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

Vapor Cells Having One or More Optical Windows Bonded to a Dielectr...

SEGMENTED PEDESTAL FOR MOUNTING DEVICE ON CHIP

SEMICONDUCTOR DEVICE WITH DISCHARGE PATH, AND METHOD FOR PRODUCING...

Method for Forming Hermetic Seals in MEMS Devices

SEAL FOR MICROELECTRONIC ASSEMBLY

SEAL FOR MICROELECTRONIC ASSEMBLY

3D STACK CONFIGURATION FOR 6-AXIS MOTION SENSOR

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

Micro Devices Formed by Flex Circuit Substrates

MICRO-MECHANICAL SENSOR AND METHOD FOR MANUFACTURING A MICRO-ELECTR...

Method for Forming Hermetic Seals in MEMS Devices

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE