Bump and strap connectors

Industry

CPC
H01L2224/73255

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73255Bump and strap connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structures
- Patent number 11,211,310
- Issue date Dec 28, 2021
- Delta Electronics, Inc.
- Sheng-Che Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for power device
- Patent number 11,183,439
- Issue date Nov 23, 2021
- Actron Technology Corporation
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate with integrated inductive component
- Patent number 11,133,375
- Issue date Sep 28, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 10,892,210
- Issue date Jan 12, 2021
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with back-side integrated inductive component
- Patent number 10,692,964
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure having a via structure and fabrication th...
- Patent number 10,424,508
- Issue date Sep 24, 2019
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages for flip chip devices
- Patent number 10,269,687
- Issue date Apr 23, 2019
- NAVITAS SEMICONDUCTOR, INC.
- Daniel Marvin Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die power converter
- Patent number 9,842,797
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device and preparation method thereof
- Patent number 9,837,386
- Issue date Dec 5, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wireless module with active devices
- Patent number 9,698,143
- Issue date Jul 4, 2017
- Fairchild Semiconductor Corporation
- Allan Tungul Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,685,430
- Issue date Jun 20, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages for flip chip devices
- Patent number 9,613,891
- Issue date Apr 4, 2017
- NAVITAS SEMICONDUCTOR, INC.
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a plurality of semiconductor chips,...
- Patent number 9,460,938
- Issue date Oct 4, 2016
- Renesas Electronics Corporation
- Hiroyasu Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component having a lateral semiconductor device and a...
- Patent number 9,385,070
- Issue date Jul 5, 2016
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dual-chip packaging structure and preparation method thereof
- Patent number 9,184,117
- Issue date Nov 10, 2015
- Alpha and Omega Semiconductor Incorporated
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 9,136,154
- Issue date Sep 15, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor arrangement and method for manufacturing the same
- Patent number 9,099,441
- Issue date Aug 4, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless power device packages
- Patent number 8,987,878
- Issue date Mar 24, 2015
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, a method of manufacturing the same and an ele...
- Patent number 8,698,289
- Issue date Apr 15, 2014
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of manufacturing thereof
- Patent number 8,698,293
- Issue date Apr 15, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-spring chip attachment using ribbon bonds
- Patent number 8,614,514
- Issue date Dec 24, 2013
- Palo Alto Research Center Incorporated
- Vernon Powers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 8,598,035
- Issue date Dec 3, 2013
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package of a flipped MOSFET and its manufacturing method
- Patent number 8,481,368
- Issue date Jul 9, 2013
- Alpha & Omega Semiconductor, Inc.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 8,193,043
- Issue date Jun 5, 2012
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sealing body and partially exposed co...
- Patent number 8,022,518
- Issue date Sep 20, 2011
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 7,960,800
- Issue date Jun 14, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor package with plated connection
- Patent number 7,897,438
- Issue date Mar 1, 2011
- Alpha and Omega Semiconductor Incorporated
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with semiconductor chips and method for produc...
- Patent number 7,880,288
- Issue date Feb 1, 2011
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power semiconductor die packages with integrated heat-sink cap...
- Patent number 7,800,219
- Issue date Sep 21, 2010
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20240355773
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- KyungEun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STORAGE PACK, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE...
- Publication number 20240312881
- Publication date Sep 19, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Toshifumi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240038733
- Publication date Feb 1, 2024
- LX Semicon Co., Ltd.
- Tae Ryong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SCALING AND STRETCHING PLATFORM FOR SERVER PROCESSOR AND...
- Publication number 20230240087
- Publication date Jul 27, 2023
- Invention And Collaboration Laboratory Pte. Ltd.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187405
- Publication date Jun 15, 2023
- AOI ELECTRONICS CO., LTD.
- Katsuhiro TAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER DEVICE
- Publication number 20210074604
- Publication date Mar 11, 2021
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER DEVICE
- Publication number 20210050320
- Publication date Feb 18, 2021
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE FLIP CHIP PACKAGE WITH EXPOSED CLIP
- Publication number 20200235067
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20170200705
- Publication date Jul 13, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Xiaotian Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140327138
- Publication date Nov 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Hiroyasu Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140217596
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF
- Publication number 20140117523
- Publication date May 1, 2014
- Yueh-Se Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE WITH ACTIVE AND PASSIVE COMPONENTS
- Publication number 20140070329
- Publication date Mar 13, 2014
- Fairchild Semiconductor Corporation
- Allan Tungul Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE WITH ACTIVE DEVICES
- Publication number 20140071650
- Publication date Mar 13, 2014
- Fairchild Semiconductor Corporation
- Allan Tungul Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20140061884
- Publication date Mar 6, 2014
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package and Method of Manufacturing Thereof
- Publication number 20130313712
- Publication date Nov 28, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF
- Publication number 20120273932
- Publication date Nov 1, 2012
- Huawei Technologies Co., Ltd
- Hengchun MAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20120228696
- Publication date Sep 13, 2012
- TEXAS INSTRUMENTS INCORPORATED
- BRIAN ASHLEY CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS POWER DEVICE PACKAGES
- Publication number 20120104580
- Publication date May 3, 2012
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, A METHOD OF MANUFACTURING THE SAME AND AN ELE...
- Publication number 20110309487
- Publication date Dec 22, 2011
- RENESAS ELECTRONICS CORPORATION
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...
- Publication number 20110230046
- Publication date Sep 22, 2011
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET AND ITS MANUFACTURING METHOD
- Publication number 20110193208
- Publication date Aug 11, 2011
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAP...
- Publication number 20110059580
- Publication date Mar 10, 2011
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, A METHOD OF MANUFACTURING THE SAME AND AN ELE...
- Publication number 20100193934
- Publication date Aug 5, 2010
- Renesas Technology Corp.
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Dice with Backside Trenches Filled With Elastic Mater...
- Publication number 20100148325
- Publication date Jun 17, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Power Semiconductor Die Packages With Integrated Heat-Sink Cap...
- Publication number 20090166850
- Publication date Jul 2, 2009
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, a method of manufacturing the same and an ele...
- Publication number 20090001559
- Publication date Jan 1, 2009
- RENESAS TECHNOLOGY CORP.
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with plated connection
- Publication number 20080233679
- Publication date Sep 25, 2008
- Alpha and Omega Semiconductor, Inc.
- Leeshawn Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module With Semiconductor Chips And Method For Produc...
- Publication number 20080224300
- Publication date Sep 18, 2008
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Bump and strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structures

Package structure for power device

Semiconductor substrate with integrated inductive component

Package structures

Semiconductor die with back-side integrated inductive component

Interconnection structure having a via structure and fabrication th...

Electronic packages for flip chip devices

Stacked die power converter

Power device and preparation method thereof

Wireless module with active devices

Embedded package and method thereof

Electronic packages for flip chip devices

Electrode connection structure and electrode connection method

Semiconductor device including a plurality of semiconductor chips,...

Semiconductor component having a lateral semiconductor device and a...

Stacked dual-chip packaging structure and preparation method thereof

Substrateless power device packages

Power transistor arrangement and method for manufacturing the same

Substrateless power device packages

Semiconductor device, a method of manufacturing the same and an ele...

Multi-chip package and method of manufacturing thereof

Micro-spring chip attachment using ribbon bonds

Semiconductor dice with backside trenches filled with elastic mater...

Semiconductor package of a flipped MOSFET and its manufacturing method

High-power semiconductor die packages with integrated heat-sink cap...

Semiconductor device having a sealing body and partially exposed co...

Semiconductor dice with backside trenches filled with elastic mater...

Method of making semiconductor package with plated connection

Semiconductor module with semiconductor chips and method for produc...

High-power semiconductor die packages with integrated heat-sink cap...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE

POWER STORAGE PACK, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE...

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...

INTEGRATED SCALING AND STRETCHING PLATFORM FOR SERVER PROCESSOR AND...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE FOR POWER DEVICE

PACKAGE STRUCTURE FOR POWER DEVICE

ELECTRONIC DEVICE FLIP CHIP PACKAGE WITH EXPOSED CLIP

POWER DEVICE AND PREPARATION METHOD THEREOF

SEMICONDUCTOR DEVICE

POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

STACKED DUAL-CHIP PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF

WIRELESS MODULE WITH ACTIVE AND PASSIVE COMPONENTS

WIRELESS MODULE WITH ACTIVE DEVICES

STACKED DIE POWER CONVERTER

Multi-Chip Package and Method of Manufacturing Thereof

POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF

STACKED DIE POWER CONVERTER

SUBSTRATELESS POWER DEVICE PACKAGES

SEMICONDUCTOR DEVICE, A METHOD OF MANUFACTURING THE SAME AND AN ELE...

SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...

SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET AND ITS MANUFACTURING METHOD

HIGH-POWER SEMICONDUCTOR DIE PACKAGES WITH INTEGRATED HEAT-SINK CAP...

SEMICONDUCTOR DEVICE, A METHOD OF MANUFACTURING THE SAME AND AN ELE...

Semiconductor Dice with Backside Trenches Filled With Elastic Mater...

High-Power Semiconductor Die Packages With Integrated Heat-Sink Cap...

Semiconductor device, a method of manufacturing the same and an ele...

Semiconductor package with plated connection

Semiconductor Module With Semiconductor Chips And Method For Produc...