Bump and wire connectors

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H01L2224/73207

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73207Bump and wire connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board unit and semiconductor device
- Patent number 12,080,677
- Issue date Sep 3, 2024
- Kioxia Corporation
- Katsuya Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 12,051,684
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with metal inlay and bottom contacts
- Patent number 12,051,685
- Issue date Jul 30, 2024
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing light-emitting devices with metal inlays a...
- Patent number 12,051,686
- Issue date Jul 30, 2024
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for enhanced bondability
- Patent number 11,996,368
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 11,942,386
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having pixels with the same active layer and method...
- Patent number 11,942,025
- Issue date Mar 26, 2024
- Samsung Display Co., Ltd.
- Jin Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,756,946
- Issue date Sep 12, 2023
- Kioxia Corporation
- Tomoya Sanuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting diode lighting system with wirebonded hybridized device
- Patent number 11,756,947
- Issue date Sep 12, 2023
- Lumileds LLC
- Wan-Ying Sau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,749,665
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated ultrasonic transducers
- Patent number 11,730,451
- Issue date Aug 22, 2023
- EXO IMAGING, INC.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure for enhanced bondability
- Patent number 11,728,279
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,705,442
- Issue date Jul 18, 2023
- Kabushiki Kaisha Toshiba
- Atsushi Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single side modular 3D stack up SiP with mold cavity
- Patent number 11,621,218
- Issue date Apr 4, 2023
- Dialog Semiconductor (UK) Limited
- Shih-Wen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,581,260
- Issue date Feb 14, 2023
- Kore Semiconductor Co., Ltd.
- Chi-Ting Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 11,515,275
- Issue date Nov 29, 2022
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 11,488,878
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240377851
- Publication date Nov 14, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Satoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240347503
- Publication date Oct 17, 2024
- United Microelectronics Corp.
- Shing-Ren SHEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D GATE CONTROL CONNECTION OF A POWER MODULE WITH AT LEAST ONE CONT...
- Publication number 20240339434
- Publication date Oct 10, 2024
- II-VI Delaware, Inc.
- Erno TEMESI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND FLEXIBLE SUBSTRATE
- Publication number 20240332273
- Publication date Oct 3, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240265854
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Wan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
STACKED TIME-OF-FLIGHT MODULE
- Publication number 20240241231
- Publication date Jul 18, 2024
- Meta Platforms Technologies, LLC
- Jack Diepen Mumbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234373
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20240234231
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234288
- Publication date Jul 11, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
- Publication number 20240128215
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION
- Publication number 20240071886
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240047409
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Sang Sub Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI MODULE
- Publication number 20240038726
- Publication date Feb 1, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Koji OBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE
- Publication number 20240006434
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- KYONGSOON CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230420440
- Publication date Dec 28, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ULTRASONIC TRANSDUCERS
- Publication number 20230389897
- Publication date Dec 7, 2023
- Exo Imaging, Inc.
- Janusz Bryzek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PAD STRUCTURE FOR ENHANCED BONDABILITY
- Publication number 20230343719
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE
- Publication number 20230335482
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20230317693
- Publication date Oct 5, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING MODULE AND ELECTRONIC DEVICE
- Publication number 20230307428
- Publication date Sep 28, 2023
- Huawei Technologies Co., Ltd
- Zhongli JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SCALING AND STRETCHING PLATFORM FOR SERVER PROCESSOR AND...
- Publication number 20230240087
- Publication date Jul 27, 2023
- Invention And Collaboration Laboratory Pte. Ltd.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM PACKAGING STRUCTURE, AND METHOD FOR FORMING THE SAME
- Publication number 20230209842
- Publication date Jun 29, 2023
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD UNIT AND SEMICONDUCTOR DEVICE
- Publication number 20230086136
- Publication date Mar 23, 2023
- KIOXIA Corporation
- Katsuya MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS

Bump and wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip package and method of providing die-to-die interconnects...

Board unit and semiconductor device

Face-to-face semiconductor device with fan-out porch

Light-emitting device with metal inlay and bottom contacts

Methods of manufacturing light-emitting devices with metal inlays a...

Semiconductor device

Pad structure for enhanced bondability

Electronic devices in semiconductor package cavities

Display device having pixels with the same active layer and method...

Die attached leveling control by metal stopper bumps

Stacked microfeature devices and associated methods

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor packages with pass-through clock traces and associate...

Package-on-package assembly with wire bonds to encapsulation surface

Multi-chip package and method of providing die-to-die interconnects...

Wire bond wires for interference shielding

Semiconductor storage device

Light-emitting diode lighting system with wirebonded hybridized device

Face-to-face semiconductor device with fan-out porch

Integrated ultrasonic transducers

Package-on-package assembly with wire bond vias

Pad structure for enhanced bondability

Semiconductor device

Single side modular 3D stack up SiP with mold cavity

Package structure and manufacturing method thereof

Copper wire bond on gold bump on semiconductor die bond pad

Packaging mechanisms for dies with different sizes of connectors

Multi-die package with bridge layer

Chip integration module, chip package structure, and chip integrati...

Wire bond wires for interference shielding

Patents Applicationslast 30 patents

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

3D GATE CONTROL CONNECTION OF A POWER MODULE WITH AT LEAST ONE CONT...

OPTICAL MODULE AND FLEXIBLE SUBSTRATE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

STACKED TIME-OF-FLIGHT MODULE

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

SEMICONDUCTOR PACKAGE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...

MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

SEMICONDUCTOR PACKAGES

AI MODULE

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

IMAGE SENSOR PACKAGE INCLUDING A CHIP STACK STRUCTURE

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

INTEGRATED ULTRASONIC TRANSDUCERS

PAD STRUCTURE FOR ENHANCED BONDABILITY

FILM PACKAGE

DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF

PACKAGING MODULE AND ELECTRONIC DEVICE

INTEGRATED SCALING AND STRETCHING PLATFORM FOR SERVER PROCESSOR AND...

MEMORY SYSTEM PACKAGING STRUCTURE, AND METHOD FOR FORMING THE SAME

BOARD UNIT AND SEMICONDUCTOR DEVICE