Bump collar

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H01L2224/10156

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/10156Bump collar

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of flip-chip electronic device with carrier having he...
- Patent number 11,251,160
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,886,254
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,515,915
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 10,468,367
- Issue date Nov 5, 2019
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,269,739
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 10,256,210
- Issue date Apr 9, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip electronic device with carrier having heat dissipation el...
- Patent number 10,153,250
- Issue date Dec 11, 2018
- International Business Machines Corporation
- Stefano Oggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 9,935,067
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,820,391
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 9,795,036
- Issue date Oct 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 9,786,632
- Issue date Oct 10, 2017
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 9,530,747
- Issue date Dec 27, 2016
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structures and methods with a metal pillar
- Patent number 9,508,666
- Issue date Nov 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer structures in a mounting structure of a semiconductor...
- Patent number 9,337,118
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridisation of two microelectronic components using a U...
- Patent number 9,318,453
- Issue date Apr 19, 2016
- Commissariat a l'Energie Atomique et aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,216,898
- Issue date Dec 22, 2015
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder bump reflow by induction heating
- Patent number 9,190,375
- Issue date Nov 17, 2015
- GLOBALFOUNDRIES, INC.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level device packaging
- Patent number 9,117,715
- Issue date Aug 25, 2015
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 9,006,890
- Issue date Apr 14, 2015
- Intel Corporation
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder in cavity interconnection structures
- Patent number 8,936,967
- Issue date Jan 20, 2015
- Intel Corporation
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing stress buffer structures in a mounting str...
- Patent number 8,906,798
- Issue date Dec 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector design for packaging integrated circuits
- Patent number 8,901,735
- Issue date Dec 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector design for packaging integrated circuits
- Patent number 8,664,760
- Issue date Mar 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC packaging structures and methods with a metal pillar
- Patent number 8,610,285
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 8,587,134
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and semiconductor structure thereof
- Patent number 8,581,239
- Issue date Nov 12, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411330
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masatoshi SHOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230067356
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Byung Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL F...
- Publication number 20200091059
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...
- Publication number 20190244918
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...
- Publication number 20190043838
- Publication date Feb 7, 2019
- International Business Machines Corporation
- Stefano OGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20180211928
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20180151529
- Publication date May 31, 2018
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170373038
- Publication date Dec 28, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20170154862
- Publication date Jun 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP REFLOW BY INDUCTION HEATING
- Publication number 20150294948
- Publication date Oct 15, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR...
- Publication number 20150102487
- Publication date Apr 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Design for Packaging Integrated Circuits
- Publication number 20140131864
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures and Methods with a Metal Pillar
- Publication number 20140038405
- Publication date Feb 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DEVICE PACKAGING
- Publication number 20140021596
- Publication date Jan 23, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20130187265
- Publication date Jul 25, 2013
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20130134606
- Publication date May 30, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20130128484
- Publication date May 23, 2013
- Chaun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STRESS BUFFER STRUCTURES IN A MOUNTING STR...
- Publication number 20130109169
- Publication date May 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Design for Packaging Integrated Circuits
- Publication number 20120306073
- Publication date Dec 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures and Methods
- Publication number 20120306080
- Publication date Dec 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20120286420
- Publication date Nov 15, 2012
- Chien-Hung LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLDER IN CAVITY INTERCONNECTION STRUCTURES
- Publication number 20120241965
- Publication date Sep 27, 2012
- Chuan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Recessed Pillar Structure
- Publication number 20120012997
- Publication date Jan 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND MET...
- Publication number 20110309481
- Publication date Dec 22, 2011
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR...
- Publication number 20110186987
- Publication date Aug 4, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper ring solder mask defined ball grid array pad
- Publication number 20040188836
- Publication date Sep 30, 2004
- Intel Corporation
- Chung C. Key
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Bump collar

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing substrate structure with filling material f...

Manufacturing of flip-chip electronic device with carrier having he...

Packaged semiconductor devices and methods of packaging thereof

Flip-chip electronic device with carrier having heat dissipation el...

Methods of forming connector pad structures, interconnect structure...

Methods of forming connector pad structures, interconnect structure...

Solder in cavity interconnection structures

Mounting structure and method for manufacturing same

Methods of forming connector pad structures, interconnect structure...

Semiconductor package structure and method for forming the same

Flip-chip electronic device with carrier having heat dissipation el...

Methods of forming connector pad structures, interconnect structure...

Wiring board

Mounting structure and method for manufacturing same

Semiconductor package structure and method for forming the same

Solder in cavity interconnection structures

Packaging structures and methods with a metal pillar

Stress buffer structures in a mounting structure of a semiconductor...

Flip-chip hybridisation of two microelectronic components using a U...

Chip package and method for forming the same

Solder bump reflow by induction heating

Wafer-level device packaging

Solder in cavity interconnection structures

Solder in cavity interconnection structures

Methods of manufacturing stress buffer structures in a mounting str...

Connector design for packaging integrated circuits

Connector design for packaging integrated circuits

3D IC packaging structures and methods with a metal pillar

Semiconductor packages

Package structure and semiconductor structure thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL F...

METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

Methods of Forming Connector Pad Structures, Interconnect Structure...

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

Methods of Forming Connector Pad Structures, Interconnect Structure...

SOLDER BUMP REFLOW BY INDUCTION HEATING

STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR...

Connector Design for Packaging Integrated Circuits

Packaging Structures and Methods with a Metal Pillar

WAFER-LEVEL DEVICE PACKAGING

PACKAGE STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR PACKAGES

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

METHODS OF MANUFACTURING STRESS BUFFER STRUCTURES IN A MOUNTING STR...

Connector Design for Packaging Integrated Circuits

Packaging Structures and Methods

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SOLDER IN CAVITY INTERCONNECTION STRUCTURES

Recessed Pillar Structure

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND MET...

STRESS BUFFER STRUCTURES IN A MOUNTING STRUCTURE OF A SEMICONDUCTOR...

Copper ring solder mask defined ball grid array pad