TREA

Buried interconnects in the substrate or in the lid

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Industry

  • CPC
  • B81B2207/092
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/092Buried interconnects in the substrate or in the lid
Industries