Buried interconnects in the substrate or in the lid

Industry

CPC
B81B2207/092

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/092Buried interconnects in the substrate or in the lid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical contacting and method for producing an electrical contac...
- Patent number 11,897,758
- Issue date Feb 13, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged environmental sensor
- Patent number 11,718,519
- Issue date Aug 8, 2023
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 11,691,870
- Issue date Jul 4, 2023
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 11,667,519
- Issue date Jun 6, 2023
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging structure and manufacturing method therefor
- Patent number 11,667,518
- Issue date Jun 6, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan Qin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 11,274,036
- Issue date Mar 15, 2022
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor, electronic device, and vehicle
- Patent number 11,231,438
- Issue date Jan 25, 2022
- Seiko Epson Corporation
- Fumiya Ito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module
- Patent number 11,040,872
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic system comprising a microelectromechanical system and a...
- Patent number 10,994,988
- Issue date May 4, 2021
- Thales
- Bertrand Leverrier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 10,934,158
- Issue date Mar 2, 2021
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 10,781,098
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 10,662,056
- Issue date May 26, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin MEMS die
- Patent number 10,626,011
- Issue date Apr 21, 2020
- HRL Laboratories, LLC
- Randall L. Kubena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 10,611,629
- Issue date Apr 7, 2020
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring-buried glass substrate, and inertial sensor element and iner...
- Patent number 10,609,817
- Issue date Mar 31, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryosuke Meshii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-chamber transducer module, apparatus including the multi-cham...
- Patent number 10,597,287
- Issue date Mar 24, 2020
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor component having two sensor functions
- Patent number 10,544,035
- Issue date Jan 28, 2020
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port multi-part surface mount silicon condenser microphone
- Patent number 10,477,301
- Issue date Nov 12, 2019
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrating MEMS structures with interconnects and vias
- Patent number 10,457,548
- Issue date Oct 29, 2019
- Intel Corporation
- Kevin Lai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a semiconductor module
- Patent number 10,435,292
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port multi-part surface mount MEMS microphone
- Patent number 10,321,226
- Issue date Jun 11, 2019
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,280,076
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing a semiconductor device including a microe...
- Patent number 10,202,275
- Issue date Feb 12, 2019
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-chamber transducer module, apparatus including the multi-cham...
- Patent number 10,189,703
- Issue date Jan 29, 2019
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic device housing bearing on the microelectronic device
- Patent number 10,173,890
- Issue date Jan 8, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Charles Souriau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for forming a buried lower electrode in conjuncti...
- Patent number 10,160,632
- Issue date Dec 25, 2018
- Robert Bosch GmbH
- Andrew Graham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ceramic substrate, bonded body, module, and method for manufacturin...
- Patent number 10,160,636
- Issue date Dec 25, 2018
- Mitsubishi Electric Corporation
- Nobuaki Konno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices with moving members and methods for making th...
- Patent number 10,087,069
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20220289560
- Publication date Sep 15, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL CONTACTING AND METHOD FOR PRODUCING AN ELECTRICAL CONTAC...
- Publication number 20210261404
- Publication date Aug 26, 2021
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED ENVIRONMENTAL SENSOR
- Publication number 20210163283
- Publication date Jun 3, 2021
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A MICROELECTROMECHANICAL STRUCTURE A...
- Publication number 20210155472
- Publication date May 27, 2021
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20200399117
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...
- Publication number 20200385260
- Publication date Dec 10, 2020
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR, ELECTRONIC DEVICE, AND VEHICLE
- Publication number 20200200791
- Publication date Jun 25, 2020
- SEIKO EPSON CORPORATION
- Fumiya ITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
- Publication number 20200039820
- Publication date Feb 6, 2020
- INFINEON TECHNOLOGIES AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20190256352
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- HUNG-HUA LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE
- Publication number 20190253791
- Publication date Aug 15, 2019
- KNOWLES ELECTRONICS, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE SUBSTRATE INTEGRATED DEVICES
- Publication number 20190169020
- Publication date Jun 6, 2019
- Intel Corporation
- Aleksandar ALEKSOV
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A MICROELECTROMECHANICAL STRUCTURE A...
- Publication number 20190152769
- Publication date May 23, 2019
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-CHAMBER TRANSDUCER MODULE, APPARATUS INCLUDING THE MULTI-CHAM...
- Publication number 20190127218
- Publication date May 2, 2019
- STMicroelectronics S.r.l.
- Marco Omar GHIDONI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW COST, LOW PROFILE, CERAMIC BUTTON SENSOR PACKAGING
- Publication number 20190106322
- Publication date Apr 11, 2019
- DunAn Sensing, LLC
- DANNY (DUY) DO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE PACKAGE
- Publication number 20180249242
- Publication date Aug 30, 2018
- KNOWLES ELECTRONICS, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC DEVICE HOUSING
- Publication number 20180037454
- Publication date Feb 8, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean-Charles SOURIAU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-CHAMBER TRANSDUCER MODULE, APPARATUS INCLUDING THE MULTI-CHAM...
- Publication number 20170313579
- Publication date Nov 2, 2017
- STMicroelectronics S.r.l.
- Marco Omar GHIDONI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170297902
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- HUNG-HUA LIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...
- Publication number 20170297906
- Publication date Oct 19, 2017
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE
- Publication number 20170264997
- Publication date Sep 14, 2017
- KNOWLES ELECTRONICS, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20170257687
- Publication date Sep 7, 2017
- Analog Devices, Inc.
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170233248
- Publication date Aug 17, 2017
- GlobalMEMS Co., Ltd.
- Hsi-Wen Tung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR COMPONENT HAVING TWO SENSOR FUNCTIONS
- Publication number 20170113924
- Publication date Apr 27, 2017
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE INCLUDING SUPPORT STRUCTURE AND METHOD OF MANUFACTURING
- Publication number 20160229684
- Publication date Aug 11, 2016
- MOTION ENGINE INC.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TECHNIQUES FOR THE CANCELLATION OF CHIP SCALE PACKAGING PARASITIC L...
- Publication number 20140339688
- Publication date Nov 20, 2014
- CAVENDISH KINETICS, INC.
- Roberto GADDI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...
- Publication number 20140230546
- Publication date Aug 21, 2014
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Housing for a Semiconductor Chip and Semiconductor Chip with a Housing
- Publication number 20140217523
- Publication date Aug 7, 2014
- EPCOS AG
- Michael Kubiak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140199830
- Publication date Jul 17, 2014
- Xintec Inc.
- Yu-Lin YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Buried interconnects in the substrate or in the lid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaging of microfluidic devices and microfluidic integrated syste...

Electrical contacting and method for producing an electrical contac...

Packaged environmental sensor

Semiconductor device including a microelectromechanical structure a...

Semiconductor device including a microelectromechanical structure a...

MEMS packaging structure and manufacturing method therefor

Semiconductor device and method of forming microelectromechanical s...

Microelectromechanical device with signal routing through a protect...

Inertial sensor, electronic device, and vehicle

Semiconductor module

Electronic system comprising a microelectromechanical system and a...

Semiconductor device including a microelectromechanical structure a...

Method of manufacturing semiconductor structure

Semiconductor device and method of forming microelectromechanical s...

Thin MEMS die

Microelectromechanical device with signal routing through a protect...

Wiring-buried glass substrate, and inertial sensor element and iner...

Multi-chamber transducer module, apparatus including the multi-cham...

Sensor component having two sensor functions

Top port multi-part surface mount silicon condenser microphone

Integrating MEMS structures with interconnects and vias

Method for producing a semiconductor module

Top port multi-part surface mount MEMS microphone

Semiconductor structure and manufacturing method thereof

Process for manufacturing a semiconductor device including a microe...

Multi-chamber transducer module, apparatus including the multi-cham...

Microelectronic device housing bearing on the microelectronic device

System and method for forming a buried lower electrode in conjuncti...

Ceramic substrate, bonded body, module, and method for manufacturin...

Semiconductor devices with moving members and methods for making th...

Patents Applicationslast 30 patents

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

Semiconductor Device and Method of Forming Microelectromechanical S...

ELECTRICAL CONTACTING AND METHOD FOR PRODUCING AN ELECTRICAL CONTAC...

PACKAGED ENVIRONMENTAL SENSOR

SEMICONDUCTOR DEVICE INCLUDING A MICROELECTROMECHANICAL STRUCTURE A...

Semiconductor Device and Method of Forming Microelectromechanical S...

MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...

INERTIAL SENSOR, ELECTRONIC DEVICE, AND VEHICLE

METHOD FOR PRODUCING A SEMICONDUCTOR MODULE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE

PACKAGE SUBSTRATE INTEGRATED DEVICES

SEMICONDUCTOR DEVICE INCLUDING A MICROELECTROMECHANICAL STRUCTURE A...

MULTI-CHAMBER TRANSDUCER MODULE, APPARATUS INCLUDING THE MULTI-CHAM...

LOW COST, LOW PROFILE, CERAMIC BUTTON SENSOR PACKAGING

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE PACKAGE

MICROELECTRONIC DEVICE HOUSING

MULTI-CHAMBER TRANSDUCER MODULE, APPARATUS INCLUDING THE MULTI-CHAM...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE

PACKAGES AND METHODS FOR PACKAGING

MICRO SENSOR AND MANUFACTURING METHOD THEREOF

SENSOR COMPONENT HAVING TWO SENSOR FUNCTIONS

MEMS DEVICE INCLUDING SUPPORT STRUCTURE AND METHOD OF MANUFACTURING

TECHNIQUES FOR THE CANCELLATION OF CHIP SCALE PACKAGING PARASITIC L...

MICROELECTROMECHANICAL DEVICE WITH SIGNAL ROUTING THROUGH A PROTECT...

Housing for a Semiconductor Chip and Semiconductor Chip with a Housing

CHIP PACKAGE AND METHOD FOR FORMING THE SAME