by flowing liquids

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H01L23/473

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/473by flowing liquids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Techniques for incorporating sensors into apparatuses and systems
- Patent number 12,148,538
- Issue date Nov 19, 2024
- Battelle Energy Alliance, LLC
- Isabella J. van Rooyen
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data center rack system with integrated liquid and dielectric immer...
- Patent number 12,144,145
- Issue date Nov 12, 2024
- OVH
- Ali Chehade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling apparatus for power module
- Patent number 12,144,147
- Issue date Nov 12, 2024
- Hyundai Motor Company
- Sang Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact power electronics module with increased cooling surface
- Patent number 12,136,585
- Issue date Nov 5, 2024
- Danfoss Silicon Power GmbH
- Stefan Behrendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shield of an integrated circuit package
- Patent number 12,137,545
- Issue date Nov 5, 2024
- Hewlett Packard Enterprise Development LP
- See Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Convectors
- Patent number 12,129,868
- Issue date Oct 29, 2024
- Pedro Arnulfo Sarmiento
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Metal-coated, polymer-encapsulated electronics modules and methods...
- Patent number 12,132,010
- Issue date Oct 29, 2024
- GM Global Technology Operations LLC
- Anthony M. Coppola
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Liquid cooling system
- Patent number 12,123,652
- Issue date Oct 22, 2024
- Cooler Master Co., Ltd.
- Yuan Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Hood for MEMS-based cooling systems
- Patent number 12,127,369
- Issue date Oct 22, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with cooling fins in a matrix form
- Patent number 12,127,382
- Issue date Oct 22, 2024
- Fuji Electric Co., Ltd.
- Yoshihiro Tateishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a pressure device acting on a swi...
- Patent number 12,112,994
- Issue date Oct 8, 2024
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Stefan Oehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure and electrical apparatus
- Patent number 12,107,033
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toyota Jidoshokki
- Toshiaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for operating an electric vehicle drive with improved...
- Patent number 12,107,027
- Issue date Oct 1, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,108,563
- Issue date Oct 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct cooling of a power converter by using a stamped plate
- Patent number 12,108,580
- Issue date Oct 1, 2024
- Audi AG
- Thomas Gradinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of electronics using co-located microjet nozzles...
- Patent number 12,100,643
- Issue date Sep 24, 2024
- JetCool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling apparatus
- Patent number 12,099,385
- Issue date Sep 24, 2024
- Cooler Master Co., Ltd.
- Shui Fa Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fluid heat exchanger
- Patent number 12,101,906
- Issue date Sep 24, 2024
- Coolit Systems, Inc.
- Geoff Sean Lyon
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package having liquid-cooling lid
- Patent number 12,087,664
- Issue date Sep 10, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and sink manufacturing method
- Patent number 12,082,369
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Masayoshi Tamura
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System and method for providing direct silicon footprint microfluid...
- Patent number 12,080,626
- Issue date Sep 3, 2024
- Georgia Tech Research Corporation
- Luis Daniel Lorenzini Gutierrez
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Lidded semiconductor package
- Patent number 12,080,614
- Issue date Sep 3, 2024
- Mediatek Inc.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management device for high heat flux applications including...
- Patent number 12,080,627
- Issue date Sep 3, 2024
- University of Sharjah
- Essam Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with cooler including heat dissipating substra...
- Patent number 12,074,091
- Issue date Aug 27, 2024
- Fuji Electric Co., Ltd.
- Takahiro Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of a power semiconductor module and a cooler
- Patent number 12,068,174
- Issue date Aug 20, 2024
- HITACHI ENERGY LTD
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...
- Publication number 20240387321
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387318
- Publication date Nov 21, 2024
- DENSO CORPORATION
- Ryota KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...
- Publication number 20240387325
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387326
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR LIQUID IMMERSION COOLING AND METHOD OF FO...
- Publication number 20240379498
- Publication date Nov 14, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER AND SEMICONDUCTOR DEVICE
- Publication number 20240379499
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Daiki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...
- Publication number 20240379497
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ASSEMBLY AND METHOD FOR PRODUCING A SEMICONDUC...
- Publication number 20240371727
- Publication date Nov 7, 2024
- MAGNA POWERTRAIN GMBH & CO KG
- Benjamin Pessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK AND FABRICATION METHOD
- Publication number 20240363489
- Publication date Oct 31, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK-INTEGRATED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING...
- Publication number 20240347416
- Publication date Oct 17, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HIGH EFFICIENCY TRANSISTOR COOLING
- Publication number 20240347422
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Daniel CHANEMOUGAME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR
- Publication number 20240347421
- Publication date Oct 17, 2024
- Microsoft Technology Licensing, LLC
- Vaidehi ORUGANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF
- Publication number 20240321683
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING
- Publication number 20240321698
- Publication date Sep 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321684
- Publication date Sep 26, 2024
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES
- Publication number 20240321682
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING COOLING STRUCTURE
- Publication number 20240312872
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240312869
- Publication date Sep 19, 2024
- Intel Corporation
- Tongyan Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE
- Publication number 20240312870
- Publication date Sep 19, 2024
- NIDEC CORPORATION
- Kazuhiro NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE
- Publication number 20240312871
- Publication date Sep 19, 2024
- NIDEC CORPORATION
- Kazuhiro NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES
- Publication number 20240312873
- Publication date Sep 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jesse Emmett GALLOWAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT
- Publication number 20240304518
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATING MEMBER AND COOLING DEVICE
- Publication number 20240297097
- Publication date Sep 5, 2024
- NIDEC CORPORATION
- Kazuhiro NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD PLATE WITH UNIFORM PLENUM FLOW
- Publication number 20240298423
- Publication date Sep 5, 2024
- International Business Machines Corporation
- Mark D. Schultz
- F28 - HEAT EXCHANGE IN GENERAL

by flowing liquids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Techniques for incorporating sensors into apparatuses and systems

Alignment mechanism

Data center rack system with integrated liquid and dielectric immer...

Package including multiple semiconductor devices

Cooling apparatus for power module

Compact power electronics module with increased cooling surface

Electromagnetic shield of an integrated circuit package

Device and method for a two phase heat transfer

Convectors

Metal-coated, polymer-encapsulated electronics modules and methods...

Liquid cooling system

Systems and methods for bidirectional message architecture for inve...

Hood for MEMS-based cooling systems

Semiconductor module with cooling fins in a matrix form

Power semiconductor module having a pressure device acting on a swi...

Cooling structure and electrical apparatus

Power module for operating an electric vehicle drive with improved...

Systems and methods for integrated gate driver for inverter for ele...

Power electronics assemblies having embedded power electronics devices

Direct cooling of a power converter by using a stamped plate

Thermal management of electronics using co-located microjet nozzles...

Cooling apparatus

Fluid heat exchanger

Semiconductor package having liquid-cooling lid

Heat sink and sink manufacturing method

System and method for providing direct silicon footprint microfluid...

Lidded semiconductor package

Thermal management device for high heat flux applications including...

Semiconductor device with cooler including heat dissipating substra...

Arrangement of a power semiconductor module and a cooler

Patents Applicationslast 30 patents

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...

SEMICONDUCTOR DEVICE

POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...

SEMICONDUCTOR DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

SEMICONDUCTOR PACKAGE FOR LIQUID IMMERSION COOLING AND METHOD OF FO...

COOLER AND SEMICONDUCTOR DEVICE

MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...

SEMICONDUCTOR MODULE ASSEMBLY AND METHOD FOR PRODUCING A SEMICONDUC...

CHIP STACK AND FABRICATION METHOD

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

HEATSINK-INTEGRATED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING...

INTEGRATED HIGH EFFICIENCY TRANSISTOR COOLING

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR

POWER MODULE WITH OVERLAPPING TERMINALS

SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF

CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING

CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION STRUCTURES

APPARATUS INCLUDING COOLING STRUCTURE

MICROFLUIDIC COOLING IN INTEGRATED CIRCUIT DEVICE

HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE

HEAT RADIATING MEMBER AND SEMICONDUCTOR MODULE

JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES

SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT

HEAT RADIATING MEMBER AND COOLING DEVICE

COLD PLATE WITH UNIFORM PLENUM FLOW