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Liquid cooling device for memory module
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Publication number 20240145333
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Publication date May 2, 2024
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Celestica Technology Consultancy (Shanghai) Co. Ltd.
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Mingqing LUO
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H01 - BASIC ELECTRIC ELEMENTS
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POWER CONVERSION APPARATUS
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Publication number 20240105543
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Publication date Mar 28, 2024
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Hitachi, Ltd
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Hiroshi Kamizuma
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H01 - BASIC ELECTRIC ELEMENTS
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POWER SEMICONDUCTOR COMPONENT
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Publication number 20240096746
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Publication date Mar 21, 2024
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Hitachi Energy Switzerland AG
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Lluis SANTOLARIA
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP PROTECTION DEVICE
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Publication number 20240096748
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Publication date Mar 21, 2024
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Samsung Electronics Co., Ltd.
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Taejun JEON
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H01 - BASIC ELECTRIC ELEMENTS
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POWER MODULE THERMAL MANAGEMENT SYSTEM
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Publication number 20240096747
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Publication date Mar 21, 2024
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PC Krause and Associates, Inc.
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Jason WELLS
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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DUAL-SIDED COOLING JACKET
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Publication number 20240087985
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Publication date Mar 14, 2024
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US Hybrid Corporation
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Alex Nguyen
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H01 - BASIC ELECTRIC ELEMENTS
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POWER CONTROL APPARATUS
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Publication number 20240088013
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Publication date Mar 14, 2024
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DENSO CORPORATION
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Shintaro KOGURE
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B60 - VEHICLES IN GENERAL
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ALIGNMENT MECHANISM
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Publication number 20240061036
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Publication date Feb 22, 2024
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Delta Design, Inc.
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Jerry Ihor TUSTANIWSKYJ
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H01 - BASIC ELECTRIC ELEMENTS
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COLD PLATES INCORPORATING S-CELLS
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Publication number 20240063090
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Publication date Feb 22, 2024
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Toyota Motor Engineering & Manufacturing North America Inc.
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Feng Zhou
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H01 - BASIC ELECTRIC ELEMENTS
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