by flowing liquids

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H01L23/473

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/473by flowing liquids

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling plate assembly and server
- Patent number 12,295,123
- Issue date May 6, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-jun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on ceramics power module with low inductance and compact arran...
- Patent number 12,289,872
- Issue date Apr 29, 2025
- Volkswagen Aktiengesellschaft
- Rüdiger Kusch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-fractal heatsink system and method
- Patent number 12,288,731
- Issue date Apr 29, 2025
- FRACTAL HEATSINK TECHNOLOGIES LLC
- Alexander Poltorak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Conformal cooling assembly with substrate fluid-proofing for multi-...
- Patent number 12,288,733
- Issue date Apr 29, 2025
- Jetcool Technologies Inc.
- Bernard Malouin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for operating a power electronic converter, and power electr...
- Patent number 12,283,878
- Issue date Apr 22, 2025
- HITACHI ENERGY LTD
- Giulia Beanato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,283,490
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Wire bonded air heat sink
- Patent number 12,278,159
- Issue date Apr 15, 2025
- RAYTHEON TECHNOLOGIES CORPORATION
- James S. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip cooling platform based on micro-nano structure
- Patent number 12,278,164
- Issue date Apr 15, 2025
- Guangdong Ocean University
- Haowei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with injection-molded or laminated coole...
- Patent number 12,278,163
- Issue date Apr 15, 2025
- HITACHI ENERGY LTD
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip cooler with high pressure bearing capacity
- Patent number 12,278,116
- Issue date Apr 15, 2025
- NINGBO HALLEY HEAT EXCHANGE EQUIPMENT CO., LTD
- Dingjun Dai
- G12 - INSTRUMENT DETAILS
Information Patent Grant
Method for fabricating MEMS-based cooling systems
- Patent number 12,274,025
- Issue date Apr 8, 2025
- Frore Systems Inc.
- Suryaprakash Ganti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for integrated cold plate in XPUs and memory
- Patent number 12,266,545
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Laura Mirkarimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device
- Patent number 12,267,986
- Issue date Apr 1, 2025
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Jiang-Jun Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Cooling device
- Patent number 12,261,100
- Issue date Mar 25, 2025
- Mitsubishi Heavy Industries, Ltd.
- Hiroki Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of wide bandgap power electronic power stages
- Patent number 12,261,489
- Issue date Mar 25, 2025
- Deere & Company
- Brij N Singh
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Immersion cooling electronic devices
- Patent number 12,261,098
- Issue date Mar 25, 2025
- Hamilton Sundstrand Corporation
- Yongduk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro heat transfer arrays, micro cold plates, and thermal manageme...
- Patent number 12,255,123
- Issue date Mar 18, 2025
- Microfabrica Inc.
- Onnik Yaglioglu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Water-cooled electronic system
- Patent number 12,255,122
- Issue date Mar 18, 2025
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jet impingement cooling with bypass fluid portion for high power se...
- Patent number 12,255,124
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- John Mookken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor cooling assembly
- Patent number 12,255,121
- Issue date Mar 18, 2025
- Hamilton Sundstrand Corporation
- Sebastian Pedro Rosado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for a heat exchanger
- Patent number 12,250,795
- Issue date Mar 11, 2025
- Dana Canada Corporation
- Farbod Vakilimoghaddam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooler and semiconductor apparatus
- Patent number 12,249,556
- Issue date Mar 11, 2025
- Fuji Electric Co., Ltd.
- Kensuke Matsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material, method of manufacturing the same, and s...
- Patent number 12,243,803
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with adaptive curvature to mitigate thermal runaway for a...
- Patent number 12,238,856
- Issue date Feb 25, 2025
- Cisco Technology, Inc.
- Paul Ton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicle power module assembly
- Patent number 12,238,908
- Issue date Feb 25, 2025
- Ford Global Technologies, LLC
- Akash Changarankumarath Pradeepkumar
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
CHIP LIQUID-COOLING HEAT DISSIPATION STRUCTURE AND FABRICATION METH...
- Publication number 20250157884
- Publication date May 15, 2025
- ZTE Corporation
- Cheng TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE WITH EXTENDED CONDUCTIVE PLANE FOR HEAT DISSIPATION
- Publication number 20250157885
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kaleb A. WILSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157883
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Sungchan KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-SIDED DIRECT COOLED POWER MODULE
- Publication number 20250149417
- Publication date May 8, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...
- Publication number 20250140741
- Publication date May 1, 2025
- Intel Corporation
- Rajiv Mongia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING MODULE FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...
- Publication number 20250140637
- Publication date May 1, 2025
- Wistron Corporation
- Chu-Chia TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS CAPILLARY STRUCTURE
- Publication number 20250132226
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Seogwoo HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
WAFER SCALE ACTIVE THERMAL INTERPOSER FOR DEVICE TESTING
- Publication number 20250130276
- Publication date Apr 24, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE HAVING HOLLOW CAPILLARY STRUCTURE
- Publication number 20250125221
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Sungchan KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20250118622
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT
- Publication number 20250105081
- Publication date Mar 27, 2025
- DENSO CORPORATION
- Keita FUKUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR MULTIPLE DIES
- Publication number 20250096072
- Publication date Mar 20, 2025
- MICROSOFT TECHNOLOGY LICENSING, LLC
- Bharath RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT POWER MODULE COOLING
- Publication number 20250087558
- Publication date Mar 13, 2025
- PC Krause and Associates, Inc.
- Matthew Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
SANDWICHED MULTI-LAYER STRUCTURE FOR COOLING HIGH POWER ELECTRONICS
- Publication number 20250087557
- Publication date Mar 13, 2025
- Tesla, Inc.
- Aydin Nabovati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...
- Publication number 20250079263
- Publication date Mar 6, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AN...
- Publication number 20250079358
- Publication date Mar 6, 2025
- Tesla, Inc.
- Abel Misrak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20250079264
- Publication date Mar 6, 2025
- ZF Friedrichshafen AG
- Shaozhi Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER, EMBEDDED INTEGRATED DEVICE UNIT, HIGH-HEAT-DISSIPA...
- Publication number 20250079353
- Publication date Mar 6, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250069983
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER UNIT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A CO...
- Publication number 20250069988
- Publication date Feb 27, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED CHIP COOLING INFRASTRUCTURE
- Publication number 20250062189
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20250063772
- Publication date Feb 20, 2025
- Industrial Technology Research Institute
- Po-Chun Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCI...
- Publication number 20250054832
- Publication date Feb 13, 2025
- Rogers Germany GmbH
- Vitalij GIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20250054837
- Publication date Feb 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Thomas WORKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL

by flowing liquids

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a heat dissipation structure connected...

Liquid cooled interposer for integrated circuit stack

Liquid cooling plate assembly and server

Chip on ceramics power module with low inductance and compact arran...

Multi-fractal heatsink system and method

Conformal cooling assembly with substrate fluid-proofing for multi-...

Systems and methods for cooling system and power module for inverte...

Method for operating a power electronic converter, and power electr...

Integrated cooling assemblies for advanced device packaging and met...

Systems and methods for parameter drift correction for inverter for...

Wire bonded air heat sink

Chip cooling platform based on micro-nano structure

Power semiconductor module with injection-molded or laminated coole...

Chip cooler with high pressure bearing capacity

Method for fabricating MEMS-based cooling systems

Structures and methods for integrated cold plate in XPUs and memory

Cooling device

Systems and methods for cooling system and power module for inverte...

Cooling device

Packaging of wide bandgap power electronic power stages

Immersion cooling electronic devices

Micro heat transfer arrays, micro cold plates, and thermal manageme...

Water-cooled electronic system

Jet impingement cooling with bypass fluid portion for high power se...

Power semiconductor cooling assembly

Systems for a heat exchanger

Cooler and semiconductor apparatus

Thermal interface material, method of manufacturing the same, and s...

Heat sink with adaptive curvature to mitigate thermal runaway for a...

Vehicle power module assembly

Patents Applicationslast 30 patents

CHIP LIQUID-COOLING HEAT DISSIPATION STRUCTURE AND FABRICATION METH...

MEMORY MODULE WITH EXTENDED CONDUCTIVE PLANE FOR HEAT DISSIPATION

SEMICONDUCTOR DEVICE

SINGLE-SIDED DIRECT COOLED POWER MODULE

PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIEN...

COOLING MODULE FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH POROUS CAPILLARY STRUCTURE

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

WAFER SCALE ACTIVE THERMAL INTERPOSER FOR DEVICE TESTING

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

SEMICONDUCTOR DEVICE HAVING HOLLOW CAPILLARY STRUCTURE

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

Power, Signaling and Thermal Path Co-optimization

SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT

THERMAL MANAGEMENT SYSTEM FOR MULTIPLE DIES

DIRECT POWER MODULE COOLING

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

SANDWICHED MULTI-LAYER STRUCTURE FOR COOLING HIGH POWER ELECTRONICS

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...

METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AN...

SEMICONDUCTOR POWER MODULE

POWER CONVERTER, EMBEDDED INTEGRATED DEVICE UNIT, HIGH-HEAT-DISSIPA...

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

COOLER UNIT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A CO...

OPTIMIZED CHIP COOLING INFRASTRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

CARRIER SUBSTRATE FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCI...

ELECTRONIC DEVICE COOLING STRUCTURES

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...