by forming build-up interconnects at chip-level

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H01L2224/82

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82by forming build-up interconnects at chip-level

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,155,022
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having air cavity in R...
- Patent number 12,148,731
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 12,131,917
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out LED packaging structure and method
- Patent number 12,132,036
- Issue date Oct 29, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Hanlung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink leveling device and method of manufacturing display device usin...
- Patent number 12,113,047
- Issue date Oct 8, 2024
- Samsung Display Co., Ltd.
- Jung Hyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,100,665
- Issue date Sep 24, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensing die encapsulated by an encapsulant with a roughness surface...
- Patent number 12,087,654
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 12,074,130
- Issue date Aug 27, 2024
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal conductive pattern
- Patent number 12,068,224
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through via extending through redistribution...
- Patent number 12,068,212
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to electrically connect chip with top connectors using 3D pr...
- Patent number 12,046,575
- Issue date Jul 23, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier comprising at least two components
- Patent number 12,041,721
- Issue date Jul 16, 2024
- AT&S(Chongqing) Company Limited
- Dominik Wilding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method therefor
- Patent number 12,040,318
- Issue date Jul 16, 2024
- Samsung Display Co., Ltd.
- Jong Hyuk Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising rigid-flexible substrate...
- Patent number 12,040,281
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
- Patent number 12,033,975
- Issue date Jul 9, 2024
- Olympus Corporation
- Keiichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having plurality of light emitting elements between...
- Patent number 12,033,993
- Issue date Jul 9, 2024
- Samsung Display Co., Ltd.
- Yong Hoon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked integrated circuits using selective ther...
- Patent number 12,027,488
- Issue date Jul 2, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 12,021,054
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240413136
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Tsung-Kai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404904
- Publication date Dec 5, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...
- Publication number 20240395568
- Publication date Nov 28, 2024
- Resonac Corporation
- Keisuke NISHIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240393685
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
- Publication number 20240363575
- Publication date Oct 31, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jihwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20240363550
- Publication date Oct 31, 2024
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN
- Publication number 20240363488
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363464
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...
- Publication number 20240355698
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20240347502
- Publication date Oct 17, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS
- Publication number 20240332155
- Publication date Oct 3, 2024
- Intel Corporation
- Jianyong Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20240321822
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240321594
- Publication date Sep 26, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...
- Publication number 20240321757
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
- Publication number 20240282740
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20240283132
- Publication date Aug 22, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240250062
- Publication date Jul 25, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240234328
- Publication date Jul 11, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
- Publication number 20240234385
- Publication date Jul 11, 2024
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
- Publication number 20240222317
- Publication date Jul 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20240213135
- Publication date Jun 27, 2024
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240203936
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS

by forming build-up interconnects at chip-level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with lead between a plurality of encapsulated...

Seamless interconnect thresholds using dielectric fluid channels

Display device and method for manufacturing display device

Package structure and method of fabrcating the same

Multi-chip integrated fan-out package

Semiconductor package and antenna module comprising the same

Method of manufacturing semiconductor device having air cavity in R...

Manufacturing method of package structure

Fan-out LED packaging structure and method

Ink leveling device and method of manufacturing display device usin...

Semiconductor package structure and manufacturing method thereof

Sensing die encapsulated by an encapsulant with a roughness surface...

Method for forming chip packages and a chip package having a chipse...

Electronic circuit device

Die stack with cascade and vertical connections

Semiconductor packages having thermal conductive pattern

Package structure with through via extending through redistribution...

Semiconductor device and corresponding method of manufacture

Method to electrically connect chip with top connectors using 3D pr...

Component carrier comprising at least two components

Display device and manufacturing method therefor

Semiconductor package structure comprising rigid-flexible substrate...

Semiconductor package having a through intervia through the molding...

Method for interconnecting stacked semiconductor devices

Package structure with bridge die laterally wrapped by insulating e...

Semiconductor device, endoscope, and method for manufacturing semic...

Display device having plurality of light emitting elements between...

Methods of forming stacked integrated circuits using selective ther...

Redistribution layer (RDL) layouts for integrated circuits

Substrate bonding apparatus and method of manufacturing a semicondu...

Patents Applicationslast 30 patents

OPTOELECTRONIC SYSTEM

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MAT...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

SEMICONDUCTOR PACKAGES HAVING THERMAL CONDUCTIVE PATTERN

PACKAGE STRUCTURE

MANUFACTURING METHOD OF SENSING DIE ENCAPSULATED BY ENCAPSULANT WIT...

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

SUBSTRATES WITH A GLASS CORE AND GLASS BUILDUP LAYERS

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

EMBEDDED MAGNET FRAME, INTEGRATED STRUCTURE AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...

FAN-OUT PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

SEMICONDUCTOR STRUCTURE