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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/82
by forming build-up interconnects at chip-level
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last 30 patents
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Patent Grant
LED with internally confined current injection area
Patent number
11,978,825
Issue date
May 7, 2024
Apple Inc.
Kelly McGroddy
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect layout for semiconductor device
Patent number
11,961,878
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Hsiung Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,942,451
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuits with redistribution lines
Patent number
11,923,338
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device reflective bank structure
Patent number
11,916,048
Issue date
Feb 27, 2024
Apple Inc.
Kapil V. Sakariya
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnect structure for stacked device
Patent number
11,915,977
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
Patent number
11,908,783
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Naoki Hayashi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated fan-out package and manufacturing method thereof
Patent number
11,894,336
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for producing optoelectronic semiconductor devices and optoe...
Patent number
11,881,544
Issue date
Jan 23, 2024
OSRAM OLED GmbH
Markus Pindl
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electrical interconnection of circuit elements on a substrate witho...
Patent number
11,881,466
Issue date
Jan 23, 2024
Orbotech Ltd.
Michael Zenou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure
Patent number
11,874,513
Issue date
Jan 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Lun Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Polymer layer in semiconductor device and method of manufacture
Patent number
11,868,047
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Sih-Hao Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Asymmetric stackup structure for SoC package substrates
Patent number
11,862,597
Issue date
Jan 2, 2024
Apple Inc.
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure and method of manufacturing the same
Patent number
11,855,030
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure and method of forming the same
Patent number
11,855,057
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for producing an electrically conductive connection on a sub...
Patent number
11,855,037
Issue date
Dec 26, 2023
Karlsruher Institut für Technologie
Uwe Bog
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of forming the same
Patent number
11,848,304
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wafer scale bonded active photonics interposer
Patent number
11,841,531
Issue date
Dec 12, 2023
The Research Foundation for the State University of New York
Douglas Coolbaugh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,842,970
Issue date
Dec 12, 2023
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of forming thereof
Patent number
11,837,567
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device structure and method for manufacturing the same
Patent number
11,837,595
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead between a plurality of encapsulated MOSFETs
Patent number
11,830,792
Issue date
Nov 28, 2023
Rohm Co., Ltd.
Kentaro Nasu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display device
Patent number
11,830,885
Issue date
Nov 28, 2023
Samsung Display Co., Ltd.
Do Yeong Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package structure comprising via structure and redist...
Patent number
11,817,413
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Neng-Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electrical interconnect structure using metal bridges to interconne...
Patent number
11,810,895
Issue date
Nov 7, 2023
Honeywell Federal Manufacturing & Technologies, LLC
Barbara Diane Young
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3DIC formation with dies bonded to formed RDLs
Patent number
11,810,899
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package device
Patent number
11,798,853
Issue date
Oct 24, 2023
Innolux Corporation
Yeong-E Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3DIC interconnect apparatus and method
Patent number
11,798,916
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
Publication number
20240145429
Publication date
May 2, 2024
STMicroelectronics S.r.l.
Riccardo VILLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
Publication number
20240136297
Publication date
Apr 25, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yingqiang YAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
Publication number
20240105661
Publication date
Mar 28, 2024
Unimicron Technology Corp.
Yu-Shen CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240096760
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096837
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240088085
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
Publication number
20240072032
Publication date
Feb 29, 2024
QUALCOMM Incorporated
Yanmei SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming the Same
Publication number
20240063177
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...
Publication number
20240063048
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Ching Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240055329
Publication date
Feb 15, 2024
ROHM CO., LTD.
Kentaro NASU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240047403
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Neng-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
Publication number
20240030265
Publication date
Jan 25, 2024
Semiconductor Components Industries, LLC
Weng-Jin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE
Publication number
20240021559
Publication date
Jan 18, 2024
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Di ZHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Forming Thereof
Publication number
20240021564
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
Publication number
20240014142
Publication date
Jan 11, 2024
Mike Morianz
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE
Publication number
20240006249
Publication date
Jan 4, 2024
InnoLux Corporation
Yeong-E CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
Publication number
20240008298
Publication date
Jan 4, 2024
Apple Inc.
Andreas Bibl
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
Publication number
20240006377
Publication date
Jan 4, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230411230
Publication date
Dec 21, 2023
InnoLux Corporation
Cheng-Chi WANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...
Publication number
20230411263
Publication date
Dec 21, 2023
STATS ChipPAC Pte Ltd.
SooHan PARK
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS
Publication number
20230387097
Publication date
Nov 30, 2023
Apple Inc.
Hsin-Hua Hu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
3DIC Interconnect Apparatus and Method
Publication number
20230378139
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer (RDL) Layouts for Integrated Circuits
Publication number
20230378116
Publication date
Nov 23, 2023
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
Cheng-Yuan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
Publication number
20230369292
Publication date
Nov 16, 2023
Huawei Technologies Co., Ltd
Shan GAO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
Publication number
20230369158
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
Publication number
20230352442
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Co., Ltd.
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING AIR CAVITY
Publication number
20230326904
Publication date
Oct 12, 2023
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
Publication number
20230290750
Publication date
Sep 14, 2023
Sumitomo Electric Industries, Ltd.
Tatsuya HASHINAGA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
Publication number
20230268328
Publication date
Aug 24, 2023
Siliconware Precision Industries Co., Ltd.
Kong-Toon Ng
H01 - BASIC ELECTRIC ELEMENTS