by patterning a pre-deposited material

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H01L2224/276

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/276by patterning a pre-deposited material

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Patents Grantslast 30 patents

Information Patent Grant
Substrate treating apparatus with parallel first and second parts o...
- Patent number 12,217,986
- Issue date Feb 4, 2025
- Screen Semiconductor Solutions Co., Ltd.
- Hiroyuki Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,057,439
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chemical mechanical polishing for copper dishing control
- Patent number 12,033,964
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with composite dielectric...
- Patent number 11,664,341
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing the same
- Patent number 11,532,589
- Issue date Dec 20, 2022
- Kioxia Corporation
- Jun Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,062
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,456,270
- Issue date Sep 27, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mingxing Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Creating 3D features through selective laser annealing and/or laser...
- Patent number 11,430,758
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,393,734
- Issue date Jul 19, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite dielectric structure and method...
- Patent number 11,264,350
- Issue date Mar 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure with hybrid bonding structure and method of fab...
- Patent number 11,251,157
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved pillar interconnects
- Patent number 11,239,400
- Issue date Feb 1, 2022
- Facebook Technologies, LLC
- Zheng Sung Chio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for adjusting dimensions of dielectric bond line material...
- Patent number 11,189,590
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Micro-LED chips and methods for manufacturing the same and display...
- Patent number 11,081,632
- Issue date Aug 3, 2021
- CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
- Feng Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,024,605
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device production method
- Patent number 10,998,283
- Issue date May 4, 2021
- TOSHIBA MEMORY CORPORATION
- Takahiko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device including a sensor substrate and a logic...
- Patent number 10,978,505
- Issue date Apr 13, 2021
- Renesas Electronics Corporation
- Hidenori Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...
- Publication number 20250070072
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240321805
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seungho Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20240297133
- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20240136324
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih CHIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING
- Publication number 20230420438
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230253350
- Publication date Aug 10, 2023
- VueReal Inc.
- GHOLAMREZA CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...
- Publication number 20230215832
- Publication date Jul 6, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL
- Publication number 20230066610
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20230009679
- Publication date Jan 12, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271000
- Publication date Aug 25, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Mingxing ZUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE
- Publication number 20220181208
- Publication date Jun 9, 2022
- Western Digital Technologies, Inc.
- Xin Tian
- H01 - BASIC ELECTRIC ELEMENTS

by patterning a pre-deposited material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate treating apparatus with parallel first and second parts o...

Integrated circuit packages

Systems of applying materials to components

Chemical mechanical polishing for copper dishing control

Integration and bonding of micro-devices into system substrate

Fingerprint sensor and manufacturing method thereof

Seal ring structures and methods of forming same

Method for preparing semiconductor device with composite dielectric...

Adhesive bonding composition and method of use

Chemical mechanical polishing for hybrid bonding

Semiconductor wafer and method of manufacturing the same

Integrated circuit package and method

Capacitive coupling in a direct-bonded interface for microelectroni...

Semiconductor structure and manufacturing method thereof

Soldering a conductor to an aluminum metallization

Creating 3D features through selective laser annealing and/or laser...

Fingerprint sensor and manufacturing method thereof

Seal ring structures and methods of forming same

Semiconductor device with composite dielectric structure and method...

Die stack structure with hybrid bonding structure and method of fab...

Curved pillar interconnects

Processes for adjusting dimensions of dielectric bond line material...

Enhanced adhesive materials and processes for 3D applications

Micro-LED chips and methods for manufacturing the same and display...

Integrated circuit package and method

Semiconductor device production method

Solid-state imaging device including a sensor substrate and a logic...

Method and apparatus for creating a bond between objects based on f...

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL L...

SEMICONDUCTOR PACKAGE

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

INTEGRATED CIRCUIT PACKAGES

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

OPTICAL SENSOR PACKAGE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MANUFACTURING METHOD

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR PACKAGING

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH REDUCED STRESS DIE PICK AND PLACE