-
WIRING MODULE AND IMAGING APPARATUS
-
Publication number 20240130034
-
Publication date Apr 18, 2024
-
Sony Semiconductor Solutions Corporation
-
YUTARO YAMASHITA
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
-
SURGE SUPPRESSION DEVICE
-
Publication number 20240072535
-
Publication date Feb 29, 2024
-
Proterial, Ltd.
-
Tsukasa KONDO
-
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
-
-
THROUGH BOARD VIA HEAT SINK
-
Publication number 20240057246
-
Publication date Feb 15, 2024
-
Aptiv Technologies Limited
-
Navneet GUPTA
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
SUBSTRATE FOR AN ELECTRONIC CHIP
-
Publication number 20230371167
-
Publication date Nov 16, 2023
-
CENTRE NATIONAL D'ETUDES SPATIALES
-
Pascal FEBVRE
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
POWER CONTROLLER
-
Publication number 20230300971
-
Publication date Sep 21, 2023
-
MGM COMPRO S.R.O
-
Grigorij DVORSKÝ
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
-
-
HEAT DISSIPATING STRUCTURES
-
Publication number 20230197320
-
Publication date Jun 22, 2023
-
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
-
Yudi SETIAWAN
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION
-
Publication number 20230139231
-
Publication date May 4, 2023
-
Hong Heng Sheng Electronical Technology (HuaiAn)Co.,Ltd.
-
PAN TANG
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
-
-
-
-
-
ELECTRONIC CONTROL DEVICE
-
Publication number 20230054252
-
Publication date Feb 23, 2023
-
Hitachi Astemo, Ltd.
-
Miki HIRAOKA
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-
PRINTED CIRCUIT BOARD
-
Publication number 20230051976
-
Publication date Feb 16, 2023
-
Telefonaktiebolaget LM Ericsson (publ)
-
Pinghua DUAN
-
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
-