by printed thermal vias

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CPC
H05K1/0206

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0206by printed thermal vias

Industries

Patents Grantslast 30 patents

Information Patent Grant
Embeddable electrically insulating thermal connector and circuit bo...
- Patent number 12,200,853
- Issue date Jan 14, 2025
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 12,165,950
- Issue date Dec 10, 2024
- Vitesco Technologies GmbH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat removal architecture for stack-type component carrier with emb...
- Patent number 12,167,529
- Issue date Dec 10, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image sensor package and camera device including same
- Patent number 12,160,946
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Seong Su Eom
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and camera device comprising same
- Patent number 12,144,103
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Do Hyuk Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board comprising via
- Patent number 12,108,531
- Issue date Oct 1, 2024
- LG Innotek Co., Ltd
- Kyo Hun Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact memory device having a backup power source
- Patent number 12,062,409
- Issue date Aug 13, 2024
- Pliops Ltd
- Naseem Jamal
- G11 - INFORMATION STORAGE
Information Patent Grant
Formed waveguide antennas of a radar assembly
- Patent number 12,058,804
- Issue date Aug 6, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with heat dissipation function
- Patent number 12,052,827
- Issue date Jul 30, 2024
- Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked image sensor
- Patent number 12,035,060
- Issue date Jul 9, 2024
- OmniVision Technologies, Inc.
- Zhiyong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic switch module with oppositely-arranged power switches an...
- Patent number 12,010,799
- Issue date Jun 11, 2024
- BLACK & DECKER INC.
- Joshua M. Lewis
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Printed circuit board
- Patent number 12,004,287
- Issue date Jun 4, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Pinghua Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High intensity narrow spectrum and far UVC protection device
- Patent number 11,991,817
- Issue date May 21, 2024
- LUX LIGHTING SYSTEMS LLC
- Jonathan Eric Fay
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Data processing systems including optical communication modules
- Patent number 11,988,874
- Issue date May 21, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Grant
Circuit board with heat dissipation structure and method for manufa...
- Patent number 11,979,977
- Issue date May 7, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-power die heat sink
- Patent number 11,948,853
- Issue date Apr 2, 2024
- QUALCOMM Technologies Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power die heat sink with vertical heat path
- Patent number 11,929,299
- Issue date Mar 12, 2024
- QUALCOMM Incorporated
- Jose Moreira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board (PCB) including heatsinks
- Patent number 11,924,962
- Issue date Mar 5, 2024
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-circuit isolation barrier for co-site interference mitigation
- Patent number 11,924,963
- Issue date Mar 5, 2024
- Raytheon Company
- David D. Crouch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,910,520
- Issue date Feb 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and chip package having a chip mounting region
- Patent number 11,903,119
- Issue date Feb 13, 2024
- LG Innotek Co., Ltd
- Chae Won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric machine
- Patent number 11,894,732
- Issue date Feb 6, 2024
- SPAL Automotive S.R.L.
- Pietro De Filippis
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wiring module and imaging apparatus
- Patent number 11,882,646
- Issue date Jan 23, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yutaro Yamashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronic device assemblies having an electrically insulatin...
- Patent number 11,869,760
- Issue date Jan 9, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY
- Publication number 20250016908
- Publication date Jan 9, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling Methodology for Package-on-Package Structures
- Publication number 20250006673
- Publication date Jan 2, 2025
- Intel Corporation
- Siva Prasad JANGILI GANGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
- Publication number 20240422894
- Publication date Dec 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20240418943
- Publication date Dec 19, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET PRINTING DEDICATED TEST PINS
- Publication number 20240421105
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
- Publication number 20240363479
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- KAI-MOU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIGARETTE
- Publication number 20240324689
- Publication date Oct 3, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC SYSTEM
- Publication number 20240314920
- Publication date Sep 19, 2024
- MEDIATEK INC.
- Tso-Ju YI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT
- Publication number 20240314919
- Publication date Sep 19, 2024
- ADVANCED MICRO DEVICES, INC.
- Paul Theodore ARTMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EFFICIENT THERMAL MANAGEMENT FOR VERTICAL POWER DELIVERY
- Publication number 20240306287
- Publication date Sep 12, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Tahir Cader
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
- Publication number 20240292541
- Publication date Aug 29, 2024
- Black & Decker Inc.
- Joshua M. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...
- Publication number 20240292576
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL INTERPOSERS WITH MOLD FLOW CHANNELS, CIRCUIT MODULES INCLU...
- Publication number 20240290685
- Publication date Aug 29, 2024
- NXP USA, Inc.
- Eduard Jan Pabst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING MODULE WITH COMPACT CONVERTER CIRCUIT
- Publication number 20240255132
- Publication date Aug 1, 2024
- Valeo Vision
- Alexandre VAL
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...
- Publication number 20240260168
- Publication date Aug 1, 2024
- VITESCO TECHNOLOGIES GMBH
- Detlev Bagung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20240206048
- Publication date Jun 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION CHIP PACKAGE WITH ANTENNA AND HEAT DISSIPATION GROUND
- Publication number 20240178123
- Publication date May 30, 2024
- Korea Electronics Technology Institute
- Soo Chang CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED DATA THROUGHPUT USING A FIN STACK
- Publication number 20240172355
- Publication date May 23, 2024
- Micron Technology, Inc.
- Suresh Reddy Yarragunta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING MODULE AND IMAGING APPARATUS
- Publication number 20240130034
- Publication date Apr 18, 2024
- Sony Semiconductor Solutions Corporation
- YUTARO YAMASHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Conduction - Electrical Conduction Isolated Circuit Board w...
- Publication number 20240114614
- Publication date Apr 4, 2024
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHING POWER CONVERTER MODULE WITH A HEAT DISSIPATION STRUCTURE
- Publication number 20240098876
- Publication date Mar 21, 2024
- Navitas Semiconductor Limited
- Xiucheng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURGE SUPPRESSION DEVICE
- Publication number 20240072535
- Publication date Feb 29, 2024
- Proterial, Ltd.
- Tsukasa KONDO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240064901
- Publication date Feb 22, 2024
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH BOARD VIA HEAT SINK
- Publication number 20240057246
- Publication date Feb 15, 2024
- Aptiv Technologies Limited
- Navneet GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240057247
- Publication date Feb 15, 2024
- MURATA MANUFACTURING CO., LTD.
- Takanori UEJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONIC DEVICE ASSEMBLIES HAVING AN ELECTRICALLY INSULATIN...
- Publication number 20240038625
- Publication date Feb 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240008167
- Publication date Jan 4, 2024
- HUAWEI TECHNOLOGIES CO., LTD.
- Lan LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by printed thermal vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embeddable electrically insulating thermal connector and circuit bo...

Substrate for mounting electronic element, electronic device, and e...

Power semiconductor component and method for producing a power semi...

Heat removal architecture for stack-type component carrier with emb...

Image sensor package and camera device including same

Package carrier with improved heat dissipation efficiency and manuf...

Method and procedure for miniaturing a multi-layer PCB

Printed circuit board and camera device comprising same

Circuit board and method for producing circuit board

Heat removal from silicon photonics chip using a recessed side-by-s...

Circuit board comprising via

System and method for creating orthogonal solder interconnects

Compact memory device having a backup power source

Formed waveguide antennas of a radar assembly

Circuit board with heat dissipation function

Stacked image sensor

Electronic switch module with oppositely-arranged power switches an...

Printed circuit board

High intensity narrow spectrum and far UVC protection device

Data processing systems including optical communication modules

Circuit board with heat dissipation structure and method for manufa...

High-power die heat sink

High-power die heat sink with vertical heat path

Printed circuit board (PCB) including heatsinks

Printed-circuit isolation barrier for co-site interference mitigation

Thermal management in circuit board assemblies

Flexible circuit board and chip package having a chip mounting region

Electric machine

Wiring module and imaging apparatus

Power electronic device assemblies having an electrically insulatin...

Patents Applicationslast 30 patents

CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY

Cooling Methodology for Package-on-Package Structures

Method of Producing a PCB, as well as a PCB, and a Circuit Board

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

INKJET PRINTING DEDICATED TEST PINS

PRINTED CIRCUIT BOARD

CERAMIC METAL COMPOSITE SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

ELECTRONIC CIGARETTE

ELECTRONIC SYSTEM

ELECTRONIC DEVICE WITH BELOW PCB THERMAL MANAGEMENT

EFFICIENT THERMAL MANAGEMENT FOR VERTICAL POWER DELIVERY

ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...

POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...

TERMINAL INTERPOSERS WITH MOLD FLOW CHANNELS, CIRCUIT MODULES INCLU...

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

LIGHT-EMITTING MODULE WITH COMPACT CONVERTER CIRCUIT

CIRCUIT BOARD FOR A POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR...

Thermal Management in Circuit Board Assemblies

COMMUNICATION CHIP PACKAGE WITH ANTENNA AND HEAT DISSIPATION GROUND

IMPROVED DATA THROUGHPUT USING A FIN STACK

WIRING MODULE AND IMAGING APPARATUS

Thermal Conduction - Electrical Conduction Isolated Circuit Board w...

SWITCHING POWER CONVERTER MODULE WITH A HEAT DISSIPATION STRUCTURE

SURGE SUPPRESSION DEVICE

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

THROUGH BOARD VIA HEAT SINK

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

POWER ELECTRONIC DEVICE ASSEMBLIES HAVING AN ELECTRICALLY INSULATIN...

HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE