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H01L2224/82105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82105by using a preform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with plated lead frame
- Patent number 10,748,787
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic sub-assembly and method for the production of an electro...
- Patent number 10,229,895
- Issue date Mar 12, 2019
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 10,157,869
- Issue date Dec 18, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid interconnect for chip stacking
- Patent number 9,935,081
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plated lead frame, and method for manufac...
- Patent number 9,847,235
- Issue date Dec 19, 2017
- Infineon Technologies AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-die package with bridge layer and method for making the same
- Patent number 9,640,521
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,640,414
- Issue date May 2, 2017
- Renesas Electronics Corporation
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 9,472,515
- Issue date Oct 18, 2016
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,355,869
- Issue date May 31, 2016
- Renesas Electronics Corporation
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a polymer disposed on a carrier
- Patent number 9,318,473
- Issue date Apr 19, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including embedded controller die and method o...
- Patent number 9,236,368
- Issue date Jan 12, 2016
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shiv Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional structure for wiring formation
- Patent number 9,082,438
- Issue date Jul 14, 2015
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Stack type semiconductor package and method of fabricating the same
- Patent number 8,952,513
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Choong-bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package and method of manufacturing same
- Patent number 8,896,116
- Issue date Nov 25, 2014
- Intel Corporation
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with stacked microelectronic elements and m...
- Patent number 8,786,070
- Issue date Jul 22, 2014
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,736,073
- Issue date May 27, 2014
- Shinko Electric Industries Co., Ltd.
- Yuji Kunimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for embedding semiconductors in printed circuit...
- Patent number 8,664,656
- Issue date Mar 4, 2014
- Apple Inc.
- Shawn X. Arnold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming semiconductor device package having high breakdow...
- Patent number 8,586,421
- Issue date Nov 19, 2013
- General Electric Company
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and method for manufacturing the same
- Patent number 8,558,380
- Issue date Oct 15, 2013
- SK Hynix Inc.
- Si Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies and methods of forming electronic assemblies
- Patent number 8,523,071
- Issue date Sep 3, 2013
- intelliPaper, LLC
- Andrew DePaula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package with stacked microelectronic elements and m...
- Patent number 8,487,421
- Issue date Jul 16, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having high breakdown voltage and low...
- Patent number 8,310,040
- Issue date Nov 13, 2012
- General Electric Company
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module arrangement
- Patent number 8,164,176
- Issue date Apr 24, 2012
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...
- Publication number 20230411263
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- SooHan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Plated Lead Frame
- Publication number 20180061671
- Publication date Mar 1, 2018
- INFINEON TECHNOLOGIES AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20160307870
- Publication date Oct 20, 2016
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION
- Publication number 20140182887
- Publication date Jul 3, 2014
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- G11 - INFORMATION STORAGE
Information Patent Application
DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...
- Publication number 20140134760
- Publication date May 15, 2014
- Apple Inc.
- Shawn X. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20140117524
- Publication date May 1, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140065767
- Publication date Mar 6, 2014
- RENESAS ELECTRONICS CORPORATION
- Michiaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307113
- Publication date Nov 21, 2013
- Shinko Electric Industries Co., Ltd.
- Yuji KUNIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...
- Publication number 20130300000
- Publication date Nov 14, 2013
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method for Semiconductor Device and Semiconductor Device
- Publication number 20130277824
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20130119544
- Publication date May 16, 2013
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130111744
- Publication date May 9, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130112989
- Publication date May 9, 2013
- COOLEDGE LIGHTING, INC.
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROAD-AREA LIGHTING SYSTEMS
- Publication number 20130056749
- Publication date Mar 7, 2013
- Michael Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...
- Publication number 20130032944
- Publication date Feb 7, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20120329207
- Publication date Dec 27, 2012
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120205798
- Publication date Aug 16, 2012
- Hynix Semiconductor Inc.
- Si Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20120168917
- Publication date Jul 5, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Choong-bin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20120146234
- Publication date Jun 14, 2012
- Richard Alfred Beaupre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assemblies and Methods of Forming Electronic Assemblies
- Publication number 20120081868
- Publication date Apr 5, 2012
- Andrew DePaula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Arrangement, Semiconductor Module, and Method for Con...
- Publication number 20110316160
- Publication date Dec 29, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20110316140
- Publication date Dec 29, 2011
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor arrangement, semiconductor module, and method for con...
- Publication number 20080093729
- Publication date Apr 24, 2008
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS

by using a preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-die package with bridge layer

Method for producing an electric circuit comprising a circuit carri...

Semiconductor device with plated lead frame

Methods for making multi-die package with bridge layer

Electronic sub-assembly and method for the production of an electro...

Integrated circuit package

Conductive connections, structures with such connections, and metho...

Hybrid interconnect for chip stacking

Semiconductor device with plated lead frame, and method for manufac...

Conductive connections, structures with such connections, and metho...

Multi-die package with bridge layer and method for making the same

Method of manufacturing semiconductor device

Integrated circuit package

Multichip power semiconductor device

Method of manufacturing semiconductor device

Semiconductor device including a polymer disposed on a carrier

Semiconductor device including embedded controller die and method o...

Three-dimensional structure for wiring formation

Stack type semiconductor package and method of fabricating the same

Multichip power semiconductor device

Microelectronic package and method of manufacturing same

Microelectronic package with stacked microelectronic elements and m...

Semiconductor device

Devices and methods for embedding semiconductors in printed circuit...

Method of forming semiconductor device package having high breakdow...

Stack package and method for manufacturing the same

Electronic assemblies and methods of forming electronic assemblies

Microelectronic package with stacked microelectronic elements and m...

Semiconductor device package having high breakdown voltage and low...

Semiconductor module arrangement

Patents Applicationslast 30 patents

MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...

Methods for Making Multi-Die Package With Bridge Layer

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

Semiconductor Device with Plated Lead Frame

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

THREE-DIMENSIONAL STRUCTURE FOR WIRING FORMATION

DEVICES AND METHODS FOR EMBEDDING SEMICONDUCTORS IN PRINTED CIRCUIT...

POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...

Manufacturing Method for Semiconductor Device and Semiconductor Device

Multichip Power Semiconductor Device

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

BROAD-AREA LIGHTING SYSTEMS

MICROELECTRONIC PACKAGE WITH STACKED MICROELECTRONIC ELEMENTS AND M...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACK TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF

Electronic Assemblies and Methods of Forming Electronic Assemblies

Semiconductor Arrangement, Semiconductor Module, and Method for Con...

MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING SAME

Semiconductor arrangement, semiconductor module, and method for con...