TREA

Capillary welding

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Industry

  • CPC
  • B23K20/005
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat

Current Industry

B23K20/005Capillary welding
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    APPARATUS FOR BONDING WIRE
    • Publication number 20240038717
    • Publication date Feb 1, 2024
    • Samsung Electronics Co., Ltd.
    • Daewoong Heo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FORCE SENSOR IN AN ULTRASONIC WIRE BONDING DEVICE
    • Publication number 20230343741
    • Publication date Oct 26, 2023
    • ASMPT SINGAPORE PTE. LTD
    • Hing Leung LI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
    • Publication number 20230282613
    • Publication date Sep 7, 2023
    • SHINKAWA LTD.
    • Toshihiko Toyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS
    • Publication number 20230086643
    • Publication date Mar 23, 2023
    • Samsung Electronics Co., Ltd.
    • JONGEUN LEE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING APPARATUS
    • Publication number 20220149001
    • Publication date May 12, 2022
    • SHINKAWA LTD.
    • Naoki SEKINE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAPILLARY GUIDE DEVICE AND WIRE BONDING APPARATUS
    • Publication number 20220134468
    • Publication date May 5, 2022
    • SHINKAWA LTD.
    • Yohei UCHIDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING METHOD FOR SEMICONDUCTOR PACKAGE
    • Publication number 20210358873
    • Publication date Nov 18, 2021
    • Samsung Electronics Co., Ltd.
    • Hosoo HAN
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE CLAMPING SYSTEM FOR FULLY AUTOMATIC WIRE BONDING MACHINE
    • Publication number 20210094118
    • Publication date Apr 1, 2021
    • NINGBO SHANGJIN AUTOMATION TECHNOLOGY CO., LTD.
    • Wen Chen
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...
    • Publication number 20200091107
    • Publication date Mar 19, 2020
    • KAIJO CORPORATION
    • Go TAKEMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING APPARATUS WITH REPLACEABLE BONDING TOOL
    • Publication number 20200020661
    • Publication date Jan 16, 2020
    • ASM Technology Singapore Pte Ltd
    • Keng Yew SONG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
    • Publication number 20190375043
    • Publication date Dec 12, 2019
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Dominick A. DeAngelis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY RE...
    • Publication number 20180315732
    • Publication date Nov 1, 2018
    • KAIJO CORPORATION
    • Go TAKEMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
    • Publication number 20180308821
    • Publication date Oct 25, 2018
    • International Test Solutions, Inc.
    • Alan E. Humphrey
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
    • Publication number 20180200828
    • Publication date Jul 19, 2018
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Dominick A. DeAngelis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING DEVICE
    • Publication number 20180061803
    • Publication date Mar 1, 2018
    • KAIJO CORPORATION
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180005981
    • Publication date Jan 4, 2018
    • Rohm Co., Ltd.
    • Motoharu HAGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAPILLARY ALIGNMENT JIG FOR WIRE BONDER
    • Publication number 20170209955
    • Publication date Jul 27, 2017
    • TEXAS INSTRUMENTS INCORPORATED
    • Elmer Rad Bais Tabio
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING DEVICE
    • Publication number 20170005065
    • Publication date Jan 5, 2017
    • KAIJO CORPORATION
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING DEVICE
    • Publication number 20170005064
    • Publication date Jan 5, 2017
    • KAIJO CORPORATION
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BOND STRENGTHENING
    • Publication number 20160322329
    • Publication date Nov 3, 2016
    • SKYWORKS SOLUTIONS, INC.
    • Aldrin Quinones GARING
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
    • Publication number 20150249063
    • Publication date Sep 3, 2015
    • SHINKAWA LTD.
    • NAOKI SEKINE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20150200181
    • Publication date Jul 16, 2015
    • Rohm Co., Ltd.
    • Motoharu HAGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ANTIOXIDANT GAS SUPPLY UNIT
    • Publication number 20140311590
    • Publication date Oct 23, 2014
    • SHINKAWA LTD.
    • Toru MAEDA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN SEALING TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
    • Publication number 20140179063
    • Publication date Jun 26, 2014
    • Semiconductor Components Industries, LLC
    • Takeshi Sasaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDER INCLUDING A TRANSDUCER, A BOND HEAD, AND A MOUNTING APP...
    • Publication number 20130240605
    • Publication date Sep 19, 2013
    • Yam Mo WONG
    • B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • Information Patent Application

    CAPILLARY EXCHANGE SYSTEM OF SEMICONDUCTOR WIRE BONDING
    • Publication number 20130221071
    • Publication date Aug 29, 2013
    • Samsung Electronics Co., Ltd.
    • Young Sik KIM
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE LOOPS, METHODS OF FORMING WIRE LOOPS, AND RELATED PROCESSES
    • Publication number 20130125390
    • Publication date May 23, 2013
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Gary S. Gillotti
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEATER BLOCK FOR WIRE BONDING SYSTEM
    • Publication number 20120318853
    • Publication date Dec 20, 2012
    • FREESCALE SEMICONDUCTOR, INC.
    • Wai Keong Wong
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING METHOD
    • Publication number 20120138662
    • Publication date Jun 7, 2012
    • Fujitsu Limited
    • Takayoshi Matsumura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE FEEDING APPARATUS FOR WIRE BONDERS
    • Publication number 20120132695
    • Publication date May 31, 2012
    • Yue ZHANG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR