Cavity shape

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H01L2924/1616

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1616Cavity shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded lid for low cost and improved thermal performance
- Patent number 12,021,004
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,002,735
- Issue date Jun 4, 2024
- Tien-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,855,034
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of housing for semiconductor device
- Patent number 11,806,903
- Issue date Nov 7, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package
- Patent number 11,798,862
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity packages
- Patent number 11,600,542
- Issue date Mar 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,488,886
- Issue date Nov 1, 2022
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,222,868
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity packages
- Patent number 10,923,408
- Issue date Feb 16, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,714,378
- Issue date Jul 14, 2020
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 10,510,668
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate and electronic device
- Patent number 9,806,005
- Issue date Oct 31, 2017
- KYOCERA Corporation
- Hiroshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 9,735,043
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded glass lid for wafer level packaging of opto-electronic assem...
- Patent number 9,575,266
- Issue date Feb 21, 2017
- Cisco Technology, Inc.
- Kishor Desai
- G02 - OPTICS
Information Patent Grant
Method and system for a semiconductor for device package with a die...
- Patent number 9,136,159
- Issue date Sep 15, 2015
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded glass lid for wafer level packaging of opto-electronic assem...
- Patent number 9,052,445
- Issue date Jun 9, 2015
- Cisco Technology, Inc.
- Kishor Desai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for integrated waveguide packaging
- Patent number 8,872,333
- Issue date Oct 28, 2014
- Viasat, Inc.
- Noel A Lopez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for temporary wafer molding for chip-on-wafer assembly
- Patent number 8,802,499
- Issue date Aug 12, 2014
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for a semiconductor device package with a die-to-...
- Patent number 8,796,072
- Issue date Aug 5, 2014
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,531,025
- Issue date Sep 10, 2013
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package substrate
- Patent number 8,379,390
- Issue date Feb 19, 2013
- Funai Electric Co., Ltd.
- Yoshihiko Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module, power semiconductor module assembly and...
- Patent number 8,319,335
- Issue date Nov 27, 2012
- Infineon Technologies AG
- Reinhold Bayerer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of semiconductor device protection
- Patent number 8,268,670
- Issue date Sep 18, 2012
- Fujitsu Semiconductor Limited
- Kazuhiro Tashiro
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321672
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...
- Publication number 20240222335
- Publication date Jul 4, 2024
- ROBERT BOSCH GmbH
- Bo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
- Publication number 20240213112
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240186213
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Jin REE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240178206
- Publication date May 30, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240079346
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Package with Double-Side...
- Publication number 20240063196
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Partial EMI Shielding
- Publication number 20240063137
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20240055379
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- HASEOB SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240047301
- Publication date Feb 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyoun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240038607
- Publication date Feb 1, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fanny LAPORTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030089
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHOR-CONTAINING UNDERFILL STRUCTURES FOR A CHIP PACKAGE AND METHO...
- Publication number 20230420314
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...
- Publication number 20230411235
- Publication date Dec 21, 2023
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- MAN BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20230411346
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- JoonYoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402398
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Che-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230395461
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230317539
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Bo In NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED HEAT SLUG IN A SUBSTRATE
- Publication number 20230317554
- Publication date Oct 5, 2023
- Qorvo US, Inc.
- Christine Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20230299028
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282587
- Publication date Sep 7, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGES
- Publication number 20230260858
- Publication date Aug 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230148222
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- BOIN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Compensation for BGA Package
- Publication number 20230147273
- Publication date May 11, 2023
- Apple Inc.
- Brett W. Degner
- H01 - BASIC ELECTRIC ELEMENTS

Cavity shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and manufacturing method thereof

Embedded lid for low cost and improved thermal performance

Bonding structure and method thereof

Semiconductor package

Thermal transfer structures for semiconductor die assemblies

Electronic device package and method of manufacturing the same

Manufacturing method of housing for semiconductor device

Semiconductor package

Direct bonded heterogeneous integration silicon bridge

Cavity packages

Semiconductor device

Semiconductor device package and manufacturing method thereof

Thermal transfer structures for semiconductor die assemblies

Cavity packages

Semiconductor packaging structure and process

Semiconductor device package and manufacturing method thereof

Method of fabricating semiconductor device

Semiconductor packaging structure and process

Electronic element mounting substrate and electronic device

Semiconductor packaging structure and process

Molded glass lid for wafer level packaging of opto-electronic assem...

Method and system for a semiconductor for device package with a die...

Molded glass lid for wafer level packaging of opto-electronic assem...

System and method for integrated waveguide packaging

Methods for temporary wafer molding for chip-on-wafer assembly

Method and system for a semiconductor device package with a die-to-...

Thermal paste containment for semiconductor modules

Package substrate

Power semiconductor module, power semiconductor module assembly and...

Method of semiconductor device protection

Patents Applicationslast 30 patents

EMBEDDED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

BONDING STRUCTURE AND METHOD THEREOF

ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...

SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Integrated Circuit Packages and Methods of Forming the Same

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming Package with Double-Side...

Semiconductor Device and Method for Partial EMI Shielding

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

INTEGRATED CIRCUIT PACKAGE

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

SEMICONDUCTOR PACKAGE

ANCHOR-CONTAINING UNDERFILL STRUCTURES FOR A CHIP PACKAGE AND METHO...

ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method Forming Same

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

SEMICONDUCTOR PACKAGE

EMBEDDED HEAT SLUG IN A SUBSTRATE

BONDING STRUCTURE AND METHOD THEREOF

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

CAVITY PACKAGES

INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Warpage Compensation for BGA Package