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PACKAGE AND SEMICONDUCTOR DEVICE
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Publication number 20250054841
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Publication date Feb 13, 2025
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SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
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Ikuo NAKASHIMA
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H01 - BASIC ELECTRIC ELEMENTS
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EMBEDDED SEMICONDUCTOR DEVICE
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Publication number 20240413066
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Publication date Dec 12, 2024
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Intel Corporation
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Ranjul BALAKRISHNAN
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H01 - BASIC ELECTRIC ELEMENTS
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BONDING STRUCTURE AND METHOD THEREOF
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Publication number 20240304580
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Publication date Sep 12, 2024
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Taiwan Semiconductor Manufacturing company Ltd.
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WEN-CHUAN TAI
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGE
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Publication number 20240038607
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Publication date Feb 1, 2024
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STMicroelectronics (Grenoble 2) SAS
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Fanny LAPORTE
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240030089
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Publication date Jan 25, 2024
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Samsung Electronics Co., Ltd.
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Eunseok CHO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20230317539
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Publication date Oct 5, 2023
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Samsung Electronics Co., Ltd.
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Bo In NOH
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H01 - BASIC ELECTRIC ELEMENTS
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BONDING STRUCTURE AND METHOD THEREOF
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Publication number 20230299028
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Publication date Sep 21, 2023
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Taiwan Semiconductor Manufacturing company Ltd.
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WEN-CHUAN TAI
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H01 - BASIC ELECTRIC ELEMENTS