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H01L23/49866

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49866characterised by the materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Split substrate interposer with integrated passive device
- Patent number 12,148,687
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Arya Bhattacherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray shielding structure for a chip
- Patent number 12,142,556
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 12,136,608
- Issue date Nov 5, 2024
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure and manufacturing method thereof
- Patent number 12,107,036
- Issue date Oct 1, 2024
- INNOLUX CORPORATION
- Kuo-Jung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive vias and methods for producing same
- Patent number 12,100,647
- Issue date Sep 24, 2024
- Samtec, Inc.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 12,087,679
- Issue date Sep 10, 2024
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and chip package including same
- Patent number 12,080,654
- Issue date Sep 3, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with serpentine conductor and method of...
- Patent number 12,068,232
- Issue date Aug 20, 2024
- Avago Technologies International Sales Pte. Limited
- Michael Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 12,068,236
- Issue date Aug 20, 2024
- Murata Manufacturing Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with increased thickness for metal pads
- Patent number 12,057,418
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Shu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 12,051,653
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,046,544
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having electric power transmitting elements on...
- Patent number 12,027,454
- Issue date Jul 2, 2024
- ABSOLICS INC.
- Youngho Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,027,456
- Issue date Jul 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 12,027,451
- Issue date Jul 2, 2024
- Ibiden Co., Ltd.
- Shuhei Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circular bond finger pad
- Patent number 12,021,063
- Issue date Jun 25, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect loss of high density package with magnetic material
- Patent number 12,009,320
- Issue date Jun 11, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with metal-containing layer
- Patent number 12,002,746
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 11,990,396
- Issue date May 21, 2024
- Resonac Corporation
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,978,695
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,955,416
- Issue date Apr 9, 2024
- Macronix International Co., Ltd.
- Cheng-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
- Patent number 11,942,430
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package module including a bonding system
- Patent number 11,935,824
- Issue date Mar 19, 2024
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20240387192
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379638
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...
- Publication number 20240371799
- Publication date Nov 7, 2024
- Intel Corporation
- Aleksander ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS
- Publication number 20240363563
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Shu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR...
- Publication number 20240355718
- Publication date Oct 24, 2024
- LITTELFUSE, INC.
- THOMAS SPANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...
- Publication number 20240355720
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YING-CHIH HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...
- Publication number 20240339381
- Publication date Oct 10, 2024
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
- Publication number 20240332153
- Publication date Oct 3, 2024
- Intel Corporation
- Tchefor NDUKUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...
- Publication number 20240321657
- Publication date Sep 26, 2024
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD FOR PRODUCING DEVICE USING THE INTE...
- Publication number 20240321705
- Publication date Sep 26, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Koichi SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312974
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- KYOUNGLIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER
- Publication number 20240312900
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER
- Publication number 20240304536
- Publication date Sep 12, 2024
- Intel Corporation
- Sanjay THARMARAJAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CERAMIC MIXED PACKAGE SUBSTRATE PLATED WITH NON-MAGNETIC LAYE...
- Publication number 20240304539
- Publication date Sep 12, 2024
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...
- Publication number 20240297096
- Publication date Sep 5, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240282684
- Publication date Aug 22, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...
- Publication number 20240258243
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BAC...
- Publication number 20240260185
- Publication date Aug 1, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Jiaxiang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240250008
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- JUSUK KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240243053
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240234272
- Publication date Jul 11, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20240234280
- Publication date Jul 11, 2024
- TOPPAN Holdings Inc.
- Ryo WARIGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKA...
- Publication number 20240222282
- Publication date Jul 4, 2024
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240222280
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- MyungDo CHO
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Split substrate interposer with integrated passive device

Power amplifier modules including semiconductor resistor and tantal...

X-ray shielding structure for a chip

Multi-chip package

Hermetic metallized via with improved reliability

Chip package structure with nickel layer

Through-substrate via structure and method of manufacture

Redistribution layer structure and manufacturing method thereof

Electrically conductive vias and methods for producing same

Package core assembly and fabrication methods

Flexible circuit board and chip package including same

Integrated circuit package with serpentine conductor and method of...

Electronic module

Semiconductor device having via sidewall adhesion with encapsulant

Passivation structure with increased thickness for metal pads

Reconstituted substrate for radio frequency applications

Semiconductor package device with integrated inductor and manufactu...

Semiconductor device

Packaging substrate having electric power transmitting elements on...

Semiconductor structure and manufacturing method thereof

Wiring substrate

Circular bond finger pad

Interconnect loss of high density package with magnetic material

High density organic bridge device and method

Chip package structure with metal-containing layer

Substrate and method for manufacturing the same

Semiconductor package and method of fabricating the same

Semiconductor structure and method for manufacturing the same

Stacked die modules for semiconductor device assemblies and methods...

Integrated circuit package module including a bonding system

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME

THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...

PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS

METHOD TO CONNECT POWER TERMINAL TO SUBSTRATE WITHIN SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...

INTERPOSER SUBSTRATE AND METHOD FOR PRODUCING DEVICE USING THE INTE...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER

HIGH DENSITY PACKAGING ELECTROMIGRATION PROTECTION LAYER

METAL-CERAMIC MIXED PACKAGE SUBSTRATE PLATED WITH NON-MAGNETIC LAYE...

SEMICONDUCTOR PACKAGE HAVING HEAT EMITTING POST BONDED THERETO AND...

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BAC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE

SUBSTRATE WITH SUPPORT AND SEMICONDUCTOR DEVICE

ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKA...

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME