Chemical cleaning

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CPC
H01L2224/81911

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81911Chemical cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with metal-containing layer
- Patent number 12,002,746
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for cleaning flip chip assemblies
- Patent number 11,876,005
- Issue date Jan 16, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor with ultra-fine pitch and...
- Patent number 11,742,316
- Issue date Aug 29, 2023
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor device and method
- Patent number 11,727,714
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Soldering device and a method for producing a solder connection of...
- Patent number 11,491,567
- Issue date Nov 8, 2022
- Pink GmbH Thermosysteme
- Aaron Hutzler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,335,634
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor device and method
- Patent number 11,194,990
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,790,268
- Issue date Sep 29, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,636,774
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cleaning for water-soluble flux soldering
- Patent number 10,636,763
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Charles C. Bureau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,607,960
- Issue date Mar 31, 2020
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,553,451
- Issue date Feb 4, 2020
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,283,480
- Issue date May 7, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux residue cleaning system and method
- Patent number 10,170,295
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing-tape integrated film for backside of semiconductor and metho...
- Patent number 10,141,217
- Issue date Nov 27, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,076,801
- Issue date Sep 18, 2018
- Samsung Electronics Co., Ltd.
- Min-woo Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,008,393
- Issue date Jun 26, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cleaning for water-soluble flux soldering
- Patent number 9,818,717
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structural designs to minimize package defects
- Patent number 9,711,475
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming Cu pillar bump with non-metal sidewall spacer and...
- Patent number 9,685,372
- Issue date Jun 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flux residue cleaning system and method
- Patent number 9,406,500
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV substrate structure and the stacked assembly thereof
- Patent number 9,257,338
- Issue date Feb 9, 2016
- Industrial Technology Research Institute
- Chung-Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor die assemblies
- Patent number 9,224,715
- Issue date Dec 29, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structural designs to minimize package defects
- Patent number 9,159,589
- Issue date Oct 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump interconnection techniques
- Patent number 9,053,990
- Issue date Jun 9, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
- Publication number 20250006691
- Publication date Jan 2, 2025
- Intel Corporation
- George Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER
- Publication number 20240312900
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20240021557
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20230343133
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING LIGHT-EMITTING UNIT AND LIGHT-EMITTING UNIT
- Publication number 20230207756
- Publication date Jun 29, 2023
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...
- Publication number 20220415846
- Publication date Dec 29, 2022
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER
- Publication number 20220270963
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR DEVICE AND METHOD
- Publication number 20220067334
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210066181
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING APPARATUS AND METHOD FOR CHIP-STACKED STRUCTURE
- Publication number 20200161125
- Publication date May 21, 2020
- GRAND PROCESS TECHNOLOGY CORPORATION
- Fu-Yuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES
- Publication number 20190244837
- Publication date Aug 8, 2019
- ACM Research (Shanghai) Inc.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20190244004
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20190229087
- Publication date Jul 25, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180308712
- Publication date Oct 25, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20180005975
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170246699
- Publication date Aug 31, 2017
- Samsung Electronics Co., Ltd.
- Min-woo SONG
- B82 - NANO-TECHNOLOGY
Information Patent Application
ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING
- Publication number 20170243852
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Charles C. Bureau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD
- Publication number 20150179595
- Publication date Jun 25, 2015
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DIE ASSEMBLIES
- Publication number 20150162302
- Publication date Jun 11, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE...
- Publication number 20150123287
- Publication date May 7, 2015
- Siliconware Precision Industries Co., Ltd.
- Chu-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flux Residue Cleaning System and Method
- Publication number 20140332033
- Publication date Nov 13, 2014
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Bonding Semiconductor Devices
- Publication number 20140242777
- Publication date Aug 28, 2014
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES
- Publication number 20140224281
- Publication date Aug 14, 2014
- ACM Research (Shanghai) Inc.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURAL DESIGNS TO MINIMIZE PACKAGE DEFECTS
- Publication number 20140199812
- Publication date Jul 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Interconnection Ratio for Robust CPI Window
- Publication number 20140117532
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Chemical cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure with metal-containing layer

Semiconductor device and manufacturing method thereof

Methods and apparatus for cleaning flip chip assemblies

Interconnect structure for semiconductor with ultra-fine pitch and...

Fingerprint sensor device and method

Soldering device and a method for producing a solder connection of...

Chip package structure and method for forming the same

Semiconductor device and manufacturing method thereof

Fingerprint sensor device and method

Semiconductor device and method of forming a 3D integrated system-i...

Metallic interconnect, a method of manufacturing a metallic interco...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming a 3D integrated system-i...

Enhanced cleaning for water-soluble flux soldering

Substrate structure with selective surface finishes for flip chip a...

Semiconductor device and manufacturing method thereof

Substrate structure with selective surface finishes for flip chip a...

Flux residue cleaning system and method

Structures and methods to enable a full intermetallic interconnect

Dicing-tape integrated film for backside of semiconductor and metho...

Semiconductor package and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Enhanced cleaning for water-soluble flux soldering

Bump structural designs to minimize package defects

Method of forming Cu pillar bump with non-metal sidewall spacer and...

Flux residue cleaning system and method

TSV substrate structure and the stacked assembly thereof

Methods of forming semiconductor die assemblies

Bump structural designs to minimize package defects

Bump interconnection techniques

Patents Applicationslast 30 patents

COMPLIANT INSERTS FOR PIN DIPPING PROCESSES

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

Fingerprint Sensor Device and Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER

SEMICONDUCTOR DEVICE AND BUMP ARRANGEMENT METHOD

Fingerprint Sensor Device and Method

METHOD FOR PRODUCING LIGHT-EMITTING UNIT AND LIGHT-EMITTING UNIT

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...

CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER

FINGERPRINT SENSOR DEVICE AND METHOD

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CLEANING APPARATUS AND METHOD FOR CHIP-STACKED STRUCTURE

METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES

Fingerprint Sensor Device and Method

SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ENHANCED CLEANING FOR WATER-SOLUBLE FLUX SOLDERING

SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD

METHODS OF FORMING SEMICONDUCTOR DIE ASSEMBLIES

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE...

Flux Residue Cleaning System and Method

Method for Bonding Semiconductor Devices

METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES

BUMP STRUCTURAL DESIGNS TO MINIMIZE PACKAGE DEFECTS

Bump Interconnection Ratio for Robust CPI Window