Combinations of arrays with different layouts

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H01L2224/06177

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/06177Combinations of arrays with different layouts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Techniques for positioning bond pads of microelectronic devices and...
- Patent number 12,087,716
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a molding layer
- Patent number 12,080,676
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device including opposite facing I...
- Patent number 11,990,464
- Issue date May 21, 2024
- SOCIONEXT INC.
- Toru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,728,300
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Woon-Ki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,456,263
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having wafer-to-wafer bonding structure
- Patent number 11,315,895
- Issue date Apr 26, 2022
- SK hynix Inc.
- Sung Lae Oh
- G11 - INFORMATION STORAGE
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power island segmentation for selective bond-out
- Patent number 11,211,329
- Issue date Dec 28, 2021
- Kioxia Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and chip bonding method
- Patent number 11,101,230
- Issue date Aug 24, 2021
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Chunpeng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with hybrid wire bond pads
- Patent number 11,043,435
- Issue date Jun 22, 2021
- INNOGRIT TECHNOLOGIES CO., LTD.
- Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,978,419
- Issue date Apr 13, 2021
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,964,659
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device provided with same
- Patent number 10,825,760
- Issue date Nov 3, 2020
- SOCIONEXT INC.
- Toshihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,818,623
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 10,692,826
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power island segmentation for selective bond-out
- Patent number 10,629,533
- Issue date Apr 21, 2020
- TOSHIBA MEMORY CORPORATION
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 10,615,154
- Issue date Apr 7, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including external terminal groups
- Patent number 10,559,528
- Issue date Feb 11, 2020
- Rohm Co., Ltd.
- Masashi Nagasato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device
- Patent number 10,475,760
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,340,245
- Issue date Jul 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE IN A STACK FORM
- Publication number 20240387420
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Soyeon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND...
- Publication number 20240379599
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240371808
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Won-Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH
- Publication number 20240321793
- Publication date Sep 26, 2024
- Xilinx, Inc.
- Yun WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203844
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Takamichi HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS
- Publication number 20240105650
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Duhyoung AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR PERFORMING TRAINING OPERATION
- Publication number 20240047003
- Publication date Feb 8, 2024
- SK HYNIX INC.
- Seong Ju LEE
- G11 - INFORMATION STORAGE
Information Patent Application
Stacking of integrated circuit dies
- Publication number 20230238358
- Publication date Jul 27, 2023
- MELLANOX TECHNOLOGIES, LTD.
- Ido Bourstein
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND...
- Publication number 20230197651
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20230197652
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaoxuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20230154867
- Publication date May 18, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND CHIP THEREOF
- Publication number 20230139424
- Publication date May 4, 2023
- Realtek Semiconductor Corp.
- CHIA-LIN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230118535
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Side Folded Source Driver Outputs of a Display Panel Having a...
- Publication number 20230045931
- Publication date Feb 16, 2023
- PARADE TECHNOLOGIES, LTD.
- You Ben Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220367391
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESCENDING-TYPE PADS OF SEMICONDUCTOR CHIP
- Publication number 20220344292
- Publication date Oct 27, 2022
- NOVATEK MICROELECTRONICS CORP.
- Huan-Teng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER
- Publication number 20220328445
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- HAE-JUNG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
- Publication number 20220246564
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT DEVICE
- Publication number 20220157778
- Publication date May 19, 2022
- Fuji Electric Co., Ltd.
- Yasuyuki HOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220068853
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- WOON-KI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY
- Publication number 20220037273
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE HAVING WAFER-TO-WAFER BONDING STRUCTURE
- Publication number 20210313288
- Publication date Oct 7, 2021
- SK hynix Inc.
- Sung Lae OH
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210111145
- Publication date Apr 15, 2021
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200321294
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS

Combinations of arrays with different layouts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Techniques for positioning bond pads of microelectronic devices and...

Semiconductor package including a molding layer

Semiconductor structure

Semiconductor integrated circuit device including opposite facing I...

Bond enhancement structure in microelectronics for trapping contami...

Method and system for packing optimization of semiconductor devices

Semiconductor device

Semiconductor package for improving bonding reliability

Semiconductor device assembly with through-package interconnect and...

Semiconductor structure and method for forming the same

Semiconductor memory device having wafer-to-wafer bonding structure

Bond enhancement structure in microelectronics for trapping contami...

Mixed UBM and mixed pitch on a single die

Method and system for packing optimization of semiconductor devices

Power island segmentation for selective bond-out

Array substrate and chip bonding method

Multi-chip modules including stacked semiconductor dice

Semiconductor die with hybrid wire bond pads

Semiconductor package and manufacturing method thereof

Semiconductor device

Semiconductor chip and semiconductor device provided with same

Mixed UBM and mixed pitch on a single die

Method and system for packing optimization of semiconductor devices

Semiconductor structure and method for forming the same

Semiconductor package with heat-dissipating structure and method of...

Power island segmentation for selective bond-out

Semiconductor device assembly with through-package interconnect and...

Semiconductor device including external terminal groups

Semiconductor device

Fan-out semiconductor package module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE IN A STACK FORM

TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND...

SEMICONDUCTOR PACKAGE

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

CHIP PACKAGE ASSEMBLY WITH ENHANCED SOLDER PITCH

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE FOR PERFORMING TRAINING OPERATION

Stacking of integrated circuit dies

TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND...

PACKAGE STRUCTURE AND PACKAGING METHOD

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

CHIP STRUCTURE AND SEMICONDUCTOR STRUCTURE

ELECTRONIC PACKAGE STRUCTURE AND CHIP THEREOF

SEMICONDUCTOR PACKAGES

Dual-Side Folded Source Driver Outputs of a Display Panel Having a...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR STRUCTURE

DESCENDING-TYPE PADS OF SEMICONDUCTOR CHIP

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

SEMICONDUCTOR PACKAGE INCLUDING A MOLDING LAYER

BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY

SEMICONDUCTOR MEMORY DEVICE HAVING WAFER-TO-WAFER BONDING STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME