Compression bonding

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H01L2224/80201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80201Compression bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,089,409
- Issue date Sep 10, 2024
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Temporary bonding structures for die-to-die and wafer-to-wafer bonding
- Patent number 12,057,429
- Issue date Aug 6, 2024
- HRL Laboratories, LLC
- Aurelio Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 12,015,008
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding tool and bonding method thereof
- Patent number 12,009,337
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 11,973,055
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory
- Patent number 11,729,973
- Issue date Aug 15, 2023
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Small pitch integrated knife edge temporary bonding microstructures
- Patent number 11,555,830
- Issue date Jan 17, 2023
- HRL Laboratories, LLC
- Erik S. Daniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 11,437,344
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,195,849
- Issue date Dec 7, 2021
- TOSHIBA MEMORY CORPORATION
- Yasuhito Yoshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method with electron-stimulated desorption
- Patent number 11,081,463
- Issue date Aug 3, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor memory
- Patent number 10,950,630
- Issue date Mar 16, 2021
- TOSHIBA MEMORY CORPORATION
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device for bonding conductive layers exposed from sur...
- Patent number 10,840,204
- Issue date Nov 17, 2020
- TOSHIBA MEMORY CORPORATION
- Atsuko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire enabled substrate bonding and electrical contact formation
- Patent number 10,833,048
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Li-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit and methods of forming the same
- Patent number 10,790,189
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 10,777,433
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor memory
- Patent number 10,748,928
- Issue date Aug 18, 2020
- TOSHIBA MEMORY CORPORATION
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of liquid assisted micro cold binding
- Patent number 10,672,736
- Issue date Jun 2, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,141,284
- Issue date Nov 27, 2018
- Imec VZW
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit and methods of forming the same
- Patent number 10,090,196
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding with compliant resin and utilizing hydrogen i...
- Patent number 9,991,149
- Issue date Jun 5, 2018
- Skorpios Technologies, Inc.
- Damien Lambert
- G02 - OPTICS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stacked structures and methods for fab...
- Patent number 9,653,430
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment systems and wafer bonding systems and methods
- Patent number 9,646,860
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 9,318,471
- Issue date Apr 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Kabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME
- Publication number 20240404867
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240393653
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20240397722
- Publication date Nov 28, 2024
- KIOXIA Corporation
- Masayoshi TAGAMI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20240371705
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Nan HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332247
- Publication date Oct 3, 2024
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240297143
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YUAN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...
- Publication number 20240274461
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD
- Publication number 20240250061
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures and Processes for Void-Free Hybrid Bonding
- Publication number 20240222313
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240090239
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Kiichi TACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079364
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-D...
- Publication number 20240072004
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20230378012
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...
- Publication number 20230317653
- Publication date Oct 5, 2023
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230197672
- Publication date Jun 22, 2023
- KIOXIA Corporation
- Ai MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
- Publication number 20230075263
- Publication date Mar 9, 2023
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Package and Method of Forming Same
- Publication number 20230040030
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method
- Publication number 20220367407
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220208607
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20210151353
- Publication date May 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL PITCH INTEGRATED KNIFE EDGE TEMPORARY BONDING MICROSTRUCTURES
- Publication number 20210063439
- Publication date Mar 4, 2021
- HRL LABORATORIES, LLC
- Erik S. DANIEL
- G01 - MEASURING TESTING
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20210013098
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200303408
- Publication date Sep 24, 2020
- Toshiba Memory Corporation
- Yasuhito YOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD WITH ELECTRON-STIMULATED DESORPTION
- Publication number 20200152597
- Publication date May 14, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE ENABLED SUBSTRATE BONDING AND ELECTRICAL CONTACT FORMATION
- Publication number 20190319006
- Publication date Oct 17, 2019
- International Business Machines Corporation
- Li-Wen HUNG
- H01 - BASIC ELECTRIC ELEMENTS

Compression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode and display apparatus having the same

Semiconductor memory

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Wafer bonding method

Bonding tool and bonding method thereof

Wafer bonding method

Semiconductor memory

Small pitch integrated knife edge temporary bonding microstructures

Wafer bonding method

Semiconductor device and method of manufacturing the same

Bonding method with electron-stimulated desorption

Bonding apparatus, bonding system, bonding method and storage medium

Semiconductor memory

Bonding system

Semiconductor device for bonding conductive layers exposed from sur...

Nanowire enabled substrate bonding and electrical contact formation

3D integrated circuit and methods of forming the same

Gas-controlled bonding platform for edge defect reduction during wa...

Bonding apparatus, bonding system, bonding method and storage medium

Semiconductor memory

Method of liquid assisted micro cold binding

Bonding apparatus, bonding system, bonding method and storage medium

Method of bonding semiconductor substrates

3D integrated circuit and methods of forming the same

Semiconductor bonding with compliant resin and utilizing hydrogen i...

Method for bonding substrates

Bonding method, storage medium, bonding apparatus and bonding system

Semiconductor devices having stacked structures and methods for fab...

Alignment systems and wafer bonding systems and methods

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

WAFER BONDING APPARATUS AND METHOD

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME

BONDING TOOL AND BONDING METHOD THEREOF

BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...

WAFER BONDING METHOD

Structures and Processes for Void-Free Hybrid Bonding

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Die Structures and Methods of Forming the Same

SEMICONDUCTOR DEVICE WITH CIRCUIT COMPONENTS FORMED THROUGH INTER-D...

Integrated Circuit Packages and Methods of Forming the Same

HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

Semiconductor Package and Method of Forming Same

Wafer Bonding Method

3D Integrated Circuit and Methods of Forming the Same

3D Integrated Circuit and Methods of Forming the Same

3D Integrated Circuit and Methods of Forming the Same

SMALL PITCH INTEGRATED KNIFE EDGE TEMPORARY BONDING MICROSTRUCTURES

3D Integrated Circuit and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING METHOD WITH ELECTRON-STIMULATED DESORPTION

NANOWIRE ENABLED SUBSTRATE BONDING AND ELECTRICAL CONTACT FORMATION