comprising apertures or cavities

Industry

CPC
H01L2224/05551

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05551comprising apertures or cavities

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 12,113,003
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,080,662
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,009,328
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 11,881,446
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection between component parts
- Patent number 11,694,977
- Issue date Jul 4, 2023
- Osram Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,688,707
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with through semiconductor via and method for...
- Patent number 11,664,364
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,545,451
- Issue date Jan 3, 2023
- Nepes Co., Ltd.
- Hyun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and manufacturing method thereof
- Patent number 11,424,204
- Issue date Aug 23, 2022
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated stretchable electronics
- Patent number 11,375,895
- Issue date Jul 5, 2022
- The Regents of the University of California
- Sheng Xu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,362,054
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the electrical bonding of semiconductor components
- Patent number 11,362,061
- Issue date Jun 14, 2022
- Imec VZW
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal contact structure in microelectronic component
- Patent number 11,088,099
- Issue date Aug 10, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, and solid-state imaging...
- Patent number 11,018,110
- Issue date May 25, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Akiko Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,978,655
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Spoked solder pad to improve solderability and self-alignment of in...
- Patent number 10,957,663
- Issue date Mar 23, 2021
- Myron Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure and integrated circuit die using the same
- Patent number 10,910,330
- Issue date Feb 2, 2021
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...
- Publication number 20240355858
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321789
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuyuki HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
- Publication number 20240266267
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- PEI CHENG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL I/O DIE
- Publication number 20240243074
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Conductive IC Spacer with Integrated Electrical Isolation
- Publication number 20240128210
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Amit Ashara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...
- Publication number 20240120298
- Publication date Apr 11, 2024
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240113016
- Publication date Apr 4, 2024
- LAPIS SEMICONDUCTOR CO., LTD.
- MANAMI KINASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...
- Publication number 20240071963
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yun Ting Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE
- Publication number 20240047510
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
- Publication number 20230361013
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- PEI CHENG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352371
- Publication date Nov 2, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
- Publication number 20230352428
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED BOND PAD IN STACKED WAFER STRUCTURE
- Publication number 20230245987
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230163087
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCT...
- Publication number 20230145031
- Publication date May 11, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIERS AND METHOD OF FORMING SAME
- Publication number 20230132632
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
- Publication number 20230114550
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Yongbum KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230099844
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20230056623
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230016437
- Publication date Jan 19, 2023
- DENSO CORPORATION
- Yasushi FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING
- Publication number 20220399302
- Publication date Dec 15, 2022
- PLESSEY SEMICONDUCTORS LIMITED
- Kevin STRIBLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS

comprising apertures or cavities

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with interconnectors of different density

Patterned and planarized under-bump metallization

Semiconductor device with composite middle interconnectors

Bonded structures

Semiconductor structure and method for forming semiconductor struct...

Display device and method of manufacturing the same

Semiconductor device and method to minimize stress on stack via

Semiconductor package and method of manufacturing the same

Method of manufacturing substrate structure with filling material f...

Multi-metal contact structure

Semiconductor device with composite middle interconnectors

Semiconductor device including bond pad with fixing parts fixed ont...

Method for producing a connection between component parts

Semiconductor package

Bonded structures

Semiconductor device with through semiconductor via and method for...

Microelectronic devices and apparatuses having a patterned surface...

Semiconductor package

Semiconductor component and manufacturing method thereof

Three-dimensional integrated stretchable electronics

Semiconductor package and method of manufacturing the same

Method for the electrical bonding of semiconductor components

Surface mounting semiconductor components

Multi-metal contact structure in microelectronic component

Semiconductor device, manufacturing method, and solid-state imaging...

Semiconductor devices

Spoked solder pad to improve solderability and self-alignment of in...

Methods of forming microelectronic devices having a patterned surfa...

Pad structure and integrated circuit die using the same

Bonded structures

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...

BONDING-TYPE INTERCONNECTION MEMBER

BONDING-TYPE INTERCONNECTION MEMBER

SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS

COAXIAL I/O DIE

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR PACKAGES

Thermally Conductive IC Spacer with Integrated Electrical Isolation

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

INTEGRATED CIRCUIT WITH THIN FILM RESISTER STRUCTURE

PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION

SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS

BONDED STRUCTURES

SEMICONDUCTOR DEVICE

BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME

SLOTTED BOND PAD IN STACKED WAFER STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCT...

DIFFUSION BARRIERS AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME

SEMICONDUCTOR DEVICE

SUBSTRATE BONDING

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...