comprising interlocking features

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H01L2224/02351

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02351comprising interlocking features

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 12,021,066
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect
- Patent number 11,817,404
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,646,280
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlocked redistribution layer interface for flip-chip integrated...
- Patent number 11,545,450
- Issue date Jan 3, 2023
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component with component interconnection element
- Patent number 11,527,497
- Issue date Dec 13, 2022
- Murata Manufacturing Co., Ltd.
- Heikki Kuisma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 11,270,978
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect
- Patent number 11,114,395
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 11,049,829
- Issue date Jun 29, 2021
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-size package with redistribution layer
- Patent number 10,998,267
- Issue date May 4, 2021
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,879,198
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging devices and methods of manufacture thereof
- Patent number 10,629,555
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 10,510,723
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 10,504,862
- Issue date Dec 10, 2019
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect and fabrication method therefor
- Patent number 10,453,811
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 10,420,211
- Issue date Sep 17, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with bump stop structure
- Patent number 10,269,749
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,262,958
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production of adhesion structures in dielectric layers using photop...
- Patent number 10,217,644
- Issue date Feb 26, 2019
- Infineon Technologies AG
- Thomas Grille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure
- Patent number 10,141,275
- Issue date Nov 27, 2018
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 10,037,973
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and method
- Patent number 10,026,707
- Issue date Jul 17, 2018
- Microchip Technology Incorportated
- George Chu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structures having height-adjusted molding members and metho...
- Patent number 9,799,615
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,780,024
- Issue date Oct 3, 2017
- Amkor Technology, Inc.
- In Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device redistribution layer with narrow trace width r...
- Patent number 9,716,071
- Issue date Jul 25, 2017
- Amkor Technology, Inc.
- Ji Yeon Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packages and methods of fabricating the same
- Patent number 9,640,580
- Issue date May 2, 2017
- SK Hynix Inc.
- Seung Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,620,467
- Issue date Apr 11, 2017
- Infineon Technologies Austria AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,613,919
- Issue date Apr 4, 2017
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming openings and trenches i...
- Patent number 9,607,958
- Issue date Mar 28, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect structures and methods for forming th...
- Patent number 9,553,066
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POST PASSIVATION INTERCONNECT
- Publication number 20240079357
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer Layer(s) on a Stacked Structure Having a Via
- Publication number 20220189928
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220059478
- Publication date Feb 24, 2022
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...
- Publication number 20220020709
- Publication date Jan 20, 2022
- NVIDIA Corporation
- Yuanjing Jane Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL COMPONENT WITH COMPONENT INTERCONNECTION ELEMENT
- Publication number 20210375801
- Publication date Dec 2, 2021
- Murata Manufacturing Co., Ltd.
- Heikki KUISMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION INTERCONNECT
- Publication number 20210375802
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210134744
- Publication date May 6, 2021
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer Layer(s) on a Stacked Structure Having a Via
- Publication number 20200118977
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...
- Publication number 20200105698
- Publication date Apr 2, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Solder Regions Aligned to Recesses
- Publication number 20190214356
- Publication date Jul 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190053373
- Publication date Feb 14, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20160379940
- Publication date Dec 29, 2016
- Intel Corporation
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20160086897
- Publication date Mar 24, 2016
- Infineon Technologies Austria AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20140327131
- Publication date Nov 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Chun-Wei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POST-PASSIVATION INTERCONNECT STRUCTURE A...
- Publication number 20140264837
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20140151885
- Publication date Jun 5, 2014
- ROBERT BOSCH GmbH
- Peter SCHMOLLNGRUBER
- G01 - MEASURING TESTING
Information Patent Application
THROUGH-SILICON VIA STRUCTURE WITH PATTERNED SURFACE, PATTERNED SID...
- Publication number 20140131882
- Publication date May 15, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Pui Chung Simon LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF F...
- Publication number 20140084457
- Publication date Mar 27, 2014
- Moon Gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post Passivation Interconnect Structures and Methods for Forming th...
- Publication number 20140077356
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...
- Publication number 20130334683
- Publication date Dec 19, 2013
- SK HYNIX INC.
- Seung Jee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130328192
- Publication date Dec 12, 2013
- Amkor Technology, Inc.
- Jeong Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20130328190
- Publication date Dec 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Openings and Trenches i...
- Publication number 20130249080
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICON...
- Publication number 20120211269
- Publication date Aug 23, 2012
- Sanyo Electric Co., Ltd.
- Kouichi SAITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120129335
- Publication date May 24, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Masamitsu IKUMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110281430
- Publication date Nov 17, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung-Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD FOR PREVENTING PAD PEELING
- Publication number 20110018131
- Publication date Jan 27, 2011
- Hynix Semiconductor Inc.
- Jeong-Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20100221910
- Publication date Sep 2, 2010
- Kiyonori Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100187677
- Publication date Jul 29, 2010
- Samsung Electro-Mechanics CO., LTD.
- Seung-Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100184257
- Publication date Jul 22, 2010
- Shinko Electric Industries Co., Ltd.
- Takuya Kazama
- H01 - BASIC ELECTRIC ELEMENTS

comprising interlocking features

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method to minimize stress on stack via

Buffer layer(s) on a stacked structure having a via

Post passivation interconnect

Method for fabricating semiconductor device

Interlocked redistribution layer interface for flip-chip integrated...

Electrical component with component interconnection element

Buffer layer(s) on a stacked structure having a via

Post passivation interconnect

Redistribution metal and under bump metal interconnect structures a...

Wafer-level chip-size package with redistribution layer

Package with solder regions aligned to recesses

Packaging devices and methods of manufacture thereof

Buffer layer(s) on a stacked structure having a via

Redistribution metal and under bump metal interconnect structures a...

Post passivation interconnect and fabrication method therefor

Semiconductor package device

Method of forming a semiconductor device with bump stop structure

Package with solder regions aligned to recesses

Production of adhesion structures in dielectric layers using photop...

Method for manufacturing a semiconductor structure

Method for manufacturing semiconductor package structure

Wafer level package and method

Package structures having height-adjusted molding members and metho...

Semiconductor package and manufacturing method thereof

Semiconductor device redistribution layer with narrow trace width r...

Image sensor packages and methods of fabricating the same

Electronic component

Chip package and method for forming the same

Semiconductor device and method for forming openings and trenches i...

Post passivation interconnect structures and methods for forming th...

Patents Applicationslast 30 patents

POST PASSIVATION INTERCONNECT

Buffer Layer(s) on a Stacked Structure Having a Via

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

INTERLOCKED REDISTRIBUTION LAYER INTERFACE FOR FLIP-CHIP INTEGRATED...

ELECTRICAL COMPONENT WITH COMPONENT INTERCONNECTION ELEMENT

POST PASSIVATION INTERCONNECT

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Buffer Layer(s) on a Stacked Structure Having a Via

REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...

Package with Solder Regions Aligned to Recesses

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

Electronic Component

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH POST-PASSIVATION INTERCONNECT STRUCTURE A...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

THROUGH-SILICON VIA STRUCTURE WITH PATTERNED SURFACE, PATTERNED SID...

BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF F...

Post Passivation Interconnect Structures and Methods for Forming th...

ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURIN...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Methods and Apparatus of Packaging Semiconductor Devices

Semiconductor Device and Method for Forming Openings and Trenches i...

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

BONDING PAD FOR PREVENTING PAD PEELING

METHOD OF PRODUCING SEMICONDUCTOR DEVICE

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE