comprising protrusions or indentations

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CPC
H01L2224/29015

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29015comprising protrusions or indentations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 11,296,015
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies having a mesh bond material and methods of fo...
- Patent number 10,861,816
- Issue date Dec 8, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,832,992
- Issue date Nov 10, 2020
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package, backlight unit, illumination apparat...
- Patent number 10,074,788
- Issue date Sep 11, 2018
- LUMENS CO., LTD.
- Seung-Hyun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,972,555
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,929,124
- Issue date Mar 27, 2018
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package, backlight unit, illumination apparat...
- Patent number 9,831,407
- Issue date Nov 28, 2017
- LUMENS CO., LTD.
- Seung-Hyun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 9,653,424
- Issue date May 16, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,595,488
- Issue date Mar 14, 2017
- J-DEVICES CORPORATION
- Yoshihiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,468,136
- Issue date Oct 11, 2016
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded electrical component surface interconnect
- Patent number 9,245,819
- Issue date Jan 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,010,616
- Issue date Apr 21, 2015
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a solder joint
- Patent number 8,925,793
- Issue date Jan 6, 2015
- DunAn Microstaq, Inc.
- Parthiban Arunasalam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and pattern of dispensing thermal interface materials
- Patent number 8,851,159
- Issue date Oct 7, 2014
- The Research Foundation for the State University of New York
- Drew A. Davidson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat dissipation
- Patent number 8,581,390
- Issue date Nov 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arrangement and method for production thereof
- Patent number 8,564,969
- Issue date Oct 22, 2013
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor chip, and semiconductor package and system each inclu...
- Patent number 8,519,470
- Issue date Aug 27, 2013
- Samsung Electronics Co., Ltd.
- Sun-won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and pattern of dispensing thermal interface materials
- Patent number 8,481,103
- Issue date Jul 9, 2013
- The Research Foundation of State University of New York
- Drew A. Davidson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking method and stacking carrier
- Patent number 8,324,105
- Issue date Dec 4, 2012
- Victory Gain Group Corporation
- Jui-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying solder to semiconductor chips using decals w...
- Patent number 8,272,120
- Issue date Sep 25, 2012
- International Business Machines Corporation
- Peter A. Gruber
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230378117
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Hiromasa KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...
- Publication number 20210280436
- Publication date Sep 9, 2021
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20210013132
- Publication date Jan 14, 2021
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING A MESH BOND MATERIAL AND METHODS OF FO...
- Publication number 20200126943
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20180233440
- Publication date Aug 16, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARAT...
- Publication number 20180047884
- Publication date Feb 15, 2018
- LUMENS CO., LTD
- Seung-Hyun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20180033709
- Publication date Feb 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140224862
- Publication date Aug 14, 2014
- Fuji Electric Co., Ltd.
- Takeshi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20140193658
- Publication date Jul 10, 2014
- Indium Corporation
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION
- Publication number 20130264698
- Publication date Oct 10, 2013
- Edward O. Travis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Electrical Component Surface Interconnect
- Publication number 20130215583
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Making A Solder Joint
- Publication number 20130175330
- Publication date Jul 11, 2013
- DunAn Microstaq, Inc.
- Parthiban Arunasalam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKING METHOD AND STACKING CARRIER
- Publication number 20130049230
- Publication date Feb 28, 2013
- VICTORY GAIN GROUP CORPORATION
- Jui-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20120305632
- Publication date Dec 6, 2012
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Apparatus Manufacturing Method, Electronic Component, an...
- Publication number 20120085575
- Publication date Apr 12, 2012
- Nobuhiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKING METHOD AND STACKING CARRIER
- Publication number 20120038060
- Publication date Feb 16, 2012
- MOS Art Pack Corporation
- Jui-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component arrangement and method for production thereof
- Publication number 20120039056
- Publication date Feb 16, 2012
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...
- Publication number 20110283034
- Publication date Nov 17, 2011
- Samsung Electronics Co., Ltd.
- Sun-won KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...
- Publication number 20110272450
- Publication date Nov 10, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...
- Publication number 20110237030
- Publication date Sep 29, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATED INTERCONNECT DECAL AND MANUFACTURING METHOD...
- Publication number 20110233762
- Publication date Sep 29, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT STRUCTURE AND MANUFACTURING METHOD FOR SEMICONDUCTOR...
- Publication number 20110127657
- Publication date Jun 2, 2011
- Nitto Denko Corporation
- Takashi ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Chip Via Interconnects for Stacked Integrated Circuit Struc...
- Publication number 20090057872
- Publication date Mar 5, 2009
- Eric R. Ehlers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

comprising protrusions or indentations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Seal ring structures and methods of forming same

Semiconductor device and method for manufacturing the same

Method of applying conductive adhesive and manufacturing device usi...

Seal ring structures and methods of forming same

Die attach methods and semiconductor devices manufactured based on...

Method of applying conductive adhesive and manufacturing device usi...

Electronic assemblies having a mesh bond material and methods of fo...

Die attach methods and semiconductor devices manufactured based on...

Seal ring structures and methods of forming same

Seal ring structures and methods of forming same

Die attach methods and semiconductor devices manufactured based on...

Light emitting device package, backlight unit, illumination apparat...

Semiconductor device and method of manufacturing same

Method for bonding substrates

Method for producing structured sintered connection layers, and sem...

Light emitting device package, backlight unit, illumination apparat...

Semiconductor package with adhesive material pre-printed on the lea...

Semiconductor device

Low void solder joint for multiple reflow applications

Interposer package-on-package structure

Embedded electrical component surface interconnect

Low void solder joint for multiple reflow applications

Method for making a solder joint

Method and pattern of dispensing thermal interface materials

Semiconductor device with heat dissipation

Component arrangement and method for production thereof

Semiconductor chip, and semiconductor package and system each inclu...

Method and pattern of dispensing thermal interface materials

Stacking method and stacking carrier

Apparatus for applying solder to semiconductor chips using decals w...

Patents Applicationslast 30 patents

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...

Die Attach Methods and Semiconductor Devices Manufactured based on...

ELECTRONIC ASSEMBLIES HAVING A MESH BOND MATERIAL AND METHODS OF FO...

Die Attach Methods and Semiconductor Devices Manufactured based on...

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, ILLUMINATION APPARAT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method for Producing Structured Sintered Connection Layers, and Sem...

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION

Embedded Electrical Component Surface Interconnect

Method For Making A Solder Joint

STACKING METHOD AND STACKING CARRIER

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

Electronic Apparatus Manufacturing Method, Electronic Component, an...

STACKING METHOD AND STACKING CARRIER

Component arrangement and method for production thereof

SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...

DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...

DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...

WAFER LEVEL INTEGRATED INTERCONNECT DECAL AND MANUFACTURING METHOD...

WIRING CIRCUIT STRUCTURE AND MANUFACTURING METHOD FOR SEMICONDUCTOR...

Through-Chip Via Interconnects for Stacked Integrated Circuit Struc...

METHOD FOR MOUNTING ELECTRONIC COMPONENTS