comprising protrusions or indentations

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CPC
H01L2224/13015

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13015comprising protrusions or indentations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,688,708
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip structure
- Patent number 11,502,052
- Issue date Nov 15, 2022
- Novatek Microelectronics Corp.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 11,329,022
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,833,033
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonded semiconductor package and related methods
- Patent number 10,748,864
- Issue date Aug 18, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 10,734,343
- Issue date Aug 4, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure
- Patent number 10,734,344
- Issue date Aug 4, 2020
- Novatek Microelectronics Corp.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages
- Patent number 10,658,319
- Issue date May 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, flexible display panel and display device
- Patent number 10,651,141
- Issue date May 12, 2020
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bump, method for forming composite bump, and substrate
- Patent number 10,629,556
- Issue date Apr 21, 2020
- Fujitsu Limited
- Takashi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,553,526
- Issue date Feb 4, 2020
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,388,622
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless package with non-collapsible bump
- Patent number 10,269,751
- Issue date Apr 23, 2019
- Nexperia B.V.
- Wai Wong Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages
- Patent number 10,181,448
- Issue date Jan 15, 2019
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 10,170,444
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,153,243
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-on-trace structures with high assembly yield
- Patent number 10,050,000
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240096833
- Publication date Mar 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yuan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME
- Publication number 20230253356
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230068503
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR BUMP AND MANUFACTURING METHOD THEREFORE
- Publication number 20220059483
- Publication date Feb 24, 2022
- WINBOND ELECTRONICS CORP.
- Jin-Neng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...
- Publication number 20210280436
- Publication date Sep 9, 2021
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20210035938
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200350271
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20200321300
- Publication date Oct 8, 2020
- NOVATEK MICROELECTRONICS CORP.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20190326240
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE
- Publication number 20190198473
- Publication date Jun 27, 2019
- NOVATEK MICROELECTRONICS CORP.
- Ling-Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20190157238
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES
- Publication number 20190148326
- Publication date May 16, 2019
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20180053741
- Publication date Feb 22, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGES WITH IMPROVED TOPOLOGY
- Publication number 20170243845
- Publication date Aug 24, 2017
- QUALCOMM Incorporated
- Jae Sik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure and Method of Forming Same
- Publication number 20170117245
- Publication date Apr 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20170062371
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20170005067
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BUMPS IN ELECTRONIC COMPONENTS, CORRESPONDING C...
- Publication number 20160315059
- Publication date Oct 27, 2016
- STMicroelectronics S.r.l.
- Paolo CREMA
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20150318253
- Publication date Nov 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DEVICE AND METHOD WITH CANTILEVER PILLAR STRUCTURE
- Publication number 20150279799
- Publication date Oct 1, 2015
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150179596
- Publication date Jun 25, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Won CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150145127
- Publication date May 28, 2015
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS

comprising protrusions or indentations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump structure having a side recess and semiconductor structure inc...

Solderless interconnection structure and method of forming same

Method and system for packing optimization of semiconductor devices

Chip structure and method for forming the same

Bump structure having a side recess and semiconductor structure inc...

Method of applying conductive adhesive and manufacturing device usi...

Chip structure

Packages for semiconductor devices, packaged semiconductor devices,...

Method and system for packing optimization of semiconductor devices

Solderless interconnection structure and method of forming same

Device-bonded body, image pickup module, endoscope and method for m...

Method of applying conductive adhesive and manufacturing device usi...

Bump-forming film, semiconductor device and manufacturing method th...

Bump structure having a side recess and semiconductor structure inc...

Bonded semiconductor package and related methods

Method and system for packing optimization of semiconductor devices

Chip structure

Semiconductor devices and semiconductor packages

Chip, flexible display panel and display device

Composite bump, method for forming composite bump, and substrate

Semiconductor package

Bump structure having a side recess and semiconductor structure inc...

Solderless interconnection structure and method of forming same

Leadless package with non-collapsible bump

Semiconductor devices and semiconductor packages

Packages for semiconductor devices, packaged semiconductor devices,...

Semiconductor devices, methods of manufacture thereof, and packaged...

Chip mounting structure

Bump-on-trace structures with high assembly yield

Structures having a tapering curved profile and methods of making same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

BUMP STRUCTURE OF CHIP

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

Method and System for Packing Optimization of Semiconductor Devices

CONDUCTIVE PILLAR BUMP AND MANUFACTURING METHOD THEREFORE

Solderless Interconnection Structure and Method of Forming Same

METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Method and System for Packing Optimization of Semiconductor Devices

BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

CHIP STRUCTURE

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Solderless Interconnection Structure and Method of Forming Same

CHIP STRUCTURE

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES

CHIP MOUNTING STRUCTURE

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

FAN-OUT WAFER-LEVEL PACKAGES WITH IMPROVED TOPOLOGY

Interconnection Structure and Method of Forming Same

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

METHOD OF PRODUCING BUMPS IN ELECTRONIC COMPONENTS, CORRESPONDING C...

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

WAFER LEVEL DEVICE AND METHOD WITH CANTILEVER PILLAR STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE