Conductive connections on the side of the device

Industry

CPC
H01L2225/06551

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06551Conductive connections on the side of the device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Four D device process and structure
- Patent number 11,458,717
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,398,455
- Issue date Jul 26, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing and filling containers
- Patent number 11,345,073
- Issue date May 31, 2022
- KHS GmbH
- Ludwig Clüsserath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including vertically stacked semiconductor dies
- Patent number 11,302,673
- Issue date Apr 12, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming modular 3D semiconductor...
- Patent number 11,211,359
- Issue date Dec 28, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, DIMM module, manufacturing method of semicond...
- Patent number 11,183,484
- Issue date Nov 23, 2021
- ULTRAMEMORY INC.
- Fumitake Okutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including control switches to reduce pin capac...
- Patent number 11,177,239
- Issue date Nov 16, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density, low power die interconnect system
- Patent number 11,069,571
- Issue date Jul 20, 2021
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,031,371
- Issue date Jun 8, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,991,676
- Issue date Apr 27, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stacked die package with flexible interconnect
- Patent number 10,892,248
- Issue date Jan 12, 2021
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density, low power die interconnect system
- Patent number 10,872,816
- Issue date Dec 22, 2020
- Gula Consulting Limited Liabiity Company
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Grant
Method for packaging circuits
- Patent number 10,811,278
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,811,386
- Issue date Oct 20, 2020
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASICS face to face self assembly
- Patent number 10,770,432
- Issue date Sep 8, 2020
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, high density, low power die interconnect system
- Patent number 10,707,124
- Issue date Jul 7, 2020
- Gula Consulting Limited Liabiity Company
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Grant
Microelectronic package including microelectronic elements having s...
- Patent number 10,692,842
- Issue date Jun 23, 2020
- Invensas Corporation
- Richard Dewitt Crisp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 10,643,952
- Issue date May 5, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous fan-out structures for memory devices
- Patent number 10,607,955
- Issue date Mar 31, 2020
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,593,651
- Issue date Mar 17, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked dies with disparate interconnect footprints
- Patent number 10,529,693
- Issue date Jan 7, 2020
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 10,453,704
- Issue date Oct 22, 2019
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-chip alignment
- Patent number 10,410,989
- Issue date Sep 10, 2019
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with multi-layer package surface conductors...
- Patent number 10,388,607
- Issue date Aug 20, 2019
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure
- Patent number 10,373,932
- Issue date Aug 6, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 10,366,969
- Issue date Jul 30, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,290,612
- Issue date May 14, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 10,256,210
- Issue date Apr 9, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including stacked chips and memory modu...
- Patent number 10,229,900
- Issue date Mar 12, 2019
- Samsung Electronics Co., Ltd.
- Jong-Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME
- Publication number 20240147722
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Byongju Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
- Publication number 20240128208
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
- Publication number 20240120317
- Publication date Apr 11, 2024
- Western Digital Technologies, Inc.
- Cheng-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
- Publication number 20240063184
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20220115268
- Publication date Apr 14, 2022
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
- Publication number 20220084979
- Publication date Mar 17, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20210143060
- Publication date May 13, 2021
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, DIMM MODULE, MANUFACTURING METHOD OF SEMICOND...
- Publication number 20210143129
- Publication date May 13, 2021
- UltraMemory Inc.
- Fumitake OKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY STACKED SEMICONDUCTOR DIES
- Publication number 20200411481
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20200381395
- Publication date Dec 3, 2020
- Amkor Technology Singapore Holding Pte. Ltd
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20200212013
- Publication date Jul 2, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EDGE MOUNTED FRAME STRUCTURES
- Publication number 20200098674
- Publication date Mar 26, 2020
- Intel Corporation
- Chin Lee KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR STACKED INTEGRATED CIRCUIT DEVICES...
- Publication number 20190393131
- Publication date Dec 26, 2019
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20190371765
- Publication date Dec 5, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20190362988
- Publication date Nov 28, 2019
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STACKED DIE PACKAGE WITH FLEXIBLE INTERCONNECT
- Publication number 20190333895
- Publication date Oct 31, 2019
- Intel Corporation
- Hyoung IL Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASICS FACE TO FACE SELF ASSEMBLY
- Publication number 20190287944
- Publication date Sep 19, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED DIES WITH DISPARATE INTERCONNECT FOOTPRINTS
- Publication number 20190164936
- Publication date May 30, 2019
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Package Including Microelectronic Elements Having S...
- Publication number 20190035769
- Publication date Jan 31, 2019
- Invensas Corporation
- Richard Dewitt Crisp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20180308823
- Publication date Oct 25, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20180197772
- Publication date Jul 12, 2018
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- G02 - OPTICS
Information Patent Application
DIE SIDEWALL INTERCONNECTS FOR 3D CHIP ASSEMBLIES
- Publication number 20180174999
- Publication date Jun 21, 2018
- Intel Corporation
- Mitul MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180114777
- Publication date Apr 26, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20180114773
- Publication date Apr 26, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND ASSEMBLIES WITH REPEATERS
- Publication number 20180040589
- Publication date Feb 8, 2018
- Invensas Corporation
- Shaowu Huang
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...
- Publication number 20180040591
- Publication date Feb 8, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE AND PACKAGING PROCESS OF A SEMICONDUCTOR DEVICE
- Publication number 20180005993
- Publication date Jan 4, 2018
- WINBOND ELECTRONICS CORP.
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170373038
- Publication date Dec 28, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS

Conductive connections on the side of the device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Four D device process and structure

Straight wirebonding of silicon dies

Semiconductor devices and related methods

Method and device for producing and filling containers

Semiconductor device including vertically stacked semiconductor dies

Semiconductor device and method of forming modular 3D semiconductor...

Semiconductor module, DIMM module, manufacturing method of semicond...

Semiconductor device including control switches to reduce pin capac...

High speed, high density, low power die interconnect system

Semiconductor package and method of fabricating semiconductor package

Systems and methods for flash stacking

Multi-stacked die package with flexible interconnect

High speed, high density, low power die interconnect system

Method for packaging circuits

Semiconductor device

ASICS face to face self assembly

High speed, high density, low power die interconnect system

Microelectronic package including microelectronic elements having s...

Semiconductor device and method of forming EMI shielding layer with...

Heterogeneous fan-out structures for memory devices

Systems and methods for flash stacking

3D stacked dies with disparate interconnect footprints

Method for packaging circuits

Inter-chip alignment

Microelectronic devices with multi-layer package surface conductors...

Stacked semiconductor structure

Integrated electronic device with transceiving antenna and magnetic...

Systems and methods for flash stacking

Semiconductor package structure and method for forming the same

Semiconductor memory device including stacked chips and memory modu...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...

PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

STRAIGHT WIREBONDING OF SILICON DIES

SYSTEMS AND METHODS FOR FLASH STACKING

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

SEMICONDUCTOR MODULE, DIMM MODULE, MANUFACTURING METHOD OF SEMICOND...

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY STACKED SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICES AND RELATED METHODS

SYSTEMS AND METHODS FOR FLASH STACKING

PACKAGE EDGE MOUNTED FRAME STRUCTURES

THERMAL MANAGEMENT SOLUTIONS FOR STACKED INTEGRATED CIRCUIT DEVICES...

SYSTEMS AND METHODS FOR FLASH STACKING

METHOD FOR PACKAGING CIRCUITS

MULTI-STACKED DIE PACKAGE WITH FLEXIBLE INTERCONNECT

ASICS FACE TO FACE SELF ASSEMBLY

3D STACKED DIES WITH DISPARATE INTERCONNECT FOOTPRINTS

Microelectronic Package Including Microelectronic Elements Having S...

STACKED SEMICONDUCTOR STRUCTURE

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

DIE SIDEWALL INTERCONNECTS FOR 3D CHIP ASSEMBLIES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

MICROELECTRONIC PACKAGES AND ASSEMBLIES WITH REPEATERS

INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...

PACKAGE AND PACKAGING PROCESS OF A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME