Conductive via connections through the substrate, container, or encapsulation

Industry

CPC
H01L2225/06548

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06548Conductive via connections through the substrate, container, or encapsulation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 11,967,623
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Sunggil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded board
- Patent number 11,948,849
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked semiconductors die assemblies
- Patent number 11,948,921
- Issue date Apr 2, 2024
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,942,454
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a through-electrode penetrating a m...
- Patent number 11,942,458
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having thermal dissipation structure therein and...
- Patent number 11,935,760
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 11,929,338
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,929,332
- Issue date Mar 12, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging semiconductor, semiconductor package structure...
- Patent number 11,929,350
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic module and electronic apparatus ea...
- Patent number 11,916,021
- Issue date Feb 27, 2024
- Sony Group Corporation
- Hirohisa Yasukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 11,908,838
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,336
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,901,337
- Issue date Feb 13, 2024
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,472
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-mold via
- Patent number 11,869,829
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric stackup structure for SoC package substrates
- Patent number 11,862,597
- Issue date Jan 2, 2024
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with metal line crack prevention design
- Patent number 11,862,606
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,855,042
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging semiconductor, semiconductor package structure...
- Patent number 11,854,941
- Issue date Dec 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,854,877
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive shielding film
- Patent number 11,855,047
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,848,310
- Issue date Dec 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Won Geol Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
- Publication number 20240145346
- Publication date May 2, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Joo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136331
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyun Soo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136329
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128195
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Sangwoong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
- Publication number 20240120317
- Publication date Apr 11, 2024
- Western Digital Technologies, Inc.
- Cheng-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105661
- Publication date Mar 28, 2024
- Unimicron Technology Corp.
- Yu-Shen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096851
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Unbyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240087954
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...
- Publication number 20240071980
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240072021
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063178
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
- Publication number 20240063143
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES
- Publication number 20240055400
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY
- Publication number 20240047328
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Jinduck Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED SUBSTRATE WITH CAVITIES FOR DIRECT DIE-TO-DIE INTERCON...
- Publication number 20240038729
- Publication date Feb 1, 2024
- Intel Corporation
- Pooya TADAYON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR
- Publication number 20240038683
- Publication date Feb 1, 2024
- NXP B.V.
- Tzu Ya Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030077
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- SANGHYEON JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240030192
- Publication date Jan 25, 2024
- SK HYNIX INC.
- Ki Jun SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME
- Publication number 20240021576
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20240021523
- Publication date Jan 18, 2024
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...
- Publication number 20240006381
- Publication date Jan 4, 2024
- Intel Corporation
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
- Publication number 20240006377
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES FOR ALTERNATE STACKED MEMORY AND METHODS OF...
- Publication number 20240006376
- Publication date Jan 4, 2024
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230411268
- Publication date Dec 21, 2023
- LG Innotek Co., Ltd.
- Hodol YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Integrated Voltage Regulator For Integrated Circuits
- Publication number 20230402430
- Publication date Dec 14, 2023
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395571
- Publication date Dec 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System Formed Through Package-In-Package Formation
- Publication number 20230387082
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Conductive via connections through the substrate, container, or encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method of the same

Semiconductor devices and electronic systems including the same

Microelectronic device assemblies and packages including multiple d...

Package stacking using chip to wafer bonding

Advanced info POP and method of forming thereof

Package-embedded board

Methods of forming stacked semiconductors die assemblies

Package and manufacturing method thereof

Semiconductor package including a through-electrode penetrating a m...

Package structure having thermal dissipation structure therein and...

Semiconductor package and method of fabricating the same

Honeycomb pattern for conductive features

Semiconductor device and manufacturing method thereof

Method for packaging semiconductor, semiconductor package structure...

Semiconductor device, electronic module and electronic apparatus ea...

Three-dimensional device structure including embedded integrated pa...

Semiconductor package

Semiconductor device and method of manufacturing the same

Stacked microfeature devices and associated methods

Semiconductor package

Semiconductor device with through-mold via

Semiconductor package using a coreless signal distribution structure

Asymmetric stackup structure for SoC package substrates

Packages with metal line crack prevention design

Semiconductor device with discrete blocks

Method of manufacturing semiconductor structure

Method for packaging semiconductor, semiconductor package structure...

Semiconductor device and manufacturing method of the same

Chip package structure with conductive shielding film

Semiconductor device and method of manufacturing thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...

CIRCUIT BOARD WITH EMBEDDED CHIP AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

QUASI-MONOLITHIC DIE ARCHITECTURES

DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET

SUBSTRATE FOR VERTICALLY ASSEMBLED SEMICONDUCTOR DIES

SEMICONDUCTOR PACKAGE WITH SUBSTRATE CAVITY

DOUBLE-SIDED SUBSTRATE WITH CAVITIES FOR DIRECT DIE-TO-DIE INTERCON...

SEMICONDUCTOR DEVICE WITH STRESS RELIEF FEATURE AND METHOD THEREFOR

PACKAGE AND METHOD OF FABRICATING THE SAME

STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

SEMICONDUCTOR PACKAGES FOR ALTERNATE STACKED MEMORY AND METHODS OF...

SEMICONDUCTOR PACKAGE

Backside Integrated Voltage Regulator For Integrated Circuits

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

System Formed Through Package-In-Package Formation