Conductive via connections through the substrate, container, or encapsulation

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H01L2225/06548

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06548Conductive via connections through the substrate, container, or encapsulation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-height interconnect structures and associated systems and met...
- Patent number 12,308,348
- Issue date May 20, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including differential height PCB
- Patent number 12,300,557
- Issue date May 13, 2025
- SanDisk Technologies, Inc.
- Nandha Kumar Mohanraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooled interposer for integrated circuit stack
- Patent number 12,300,579
- Issue date May 13, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside integrated voltage regulator for integrated circuits
- Patent number 12,278,217
- Issue date Apr 15, 2025
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,255,182
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,249,593
- Issue date Mar 11, 2025
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,308
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having supportive plating structures
- Patent number 12,237,275
- Issue date Feb 25, 2025
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising stacked integrated devices with overhang
- Patent number 12,230,604
- Issue date Feb 18, 2025
- QUALCOMM Incorporated
- Krishna Vemuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with system and methods for conveying sign...
- Patent number 12,230,608
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Travis M. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,230,623
- Issue date Feb 18, 2025
- Kioxia Corporation
- Masaki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,218,102
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Youngkun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,218,108
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167137
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167178
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20250167176
- Publication date May 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250160092
- Publication date May 15, 2025
- Innolux Corporation
- Jui-Jen Yueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...
- Publication number 20250149345
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140749
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140747
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
- Publication number 20250140627
- Publication date May 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132294
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method Of Fabricating The Same
- Publication number 20250132263
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
- Publication number 20250118694
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105210
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105116
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105214
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20250105237
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Chung-Min Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING...
- Publication number 20250087632
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250081473
- Publication date Mar 6, 2025
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20250070085
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsang-Jiuh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20250070006
- Publication date Feb 27, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062289
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062286
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062248
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACKED DIE STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20250022852
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Chih Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Conductive via connections through the substrate, container, or encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-height interconnect structures and associated systems and met...

Semiconductor device including differential height PCB

Liquid cooled interposer for integrated circuit stack

Integrated circuit packages and methods of forming the same

Semiconductor packages

Backside integrated voltage regulator for integrated circuits

Method of fabricating semiconductor package

Bond pads for semiconductor die assemblies and associated methods a...

Secure semiconductor integration and method for making thereof

Electronic package and manufacturing method thereof

Electronic device

Semiconductor package and method manufacturing the same

Semiconductor device including penetration via structure

Semiconductor device with electromagnetic interference film and met...

Semiconductor package

Semiconductor package and method for fabricating the same

Semiconductor devices having supportive plating structures

Integrated circuit package having wirebonded multi-die stack

Package comprising stacked integrated devices with overhang

Double-sided substrate with cavities for direct die-to-die intercon...

Semiconductor assemblies with system and methods for conveying sign...

Method for manufacturing semiconductor device and semiconductor device

Semiconductor package and method of fabricating the same

Passivation structure with planar top surfaces

Semiconductor package

Method for forming chip package structure with molding layer

Package and manufacturing method thereof

Method of preparing semiconductor structure having low dielectric c...

Honeycomb pattern for conductive features

Die to die high-speed communication without discrete amplifiers bet...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

Wafer Level Integration of Passive Devices

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES

PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Package And Method Of Fabricating The Same

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...

SEMICONDUCTOR PACKAGE ASSEMBLY

VOLTAGE REGULATOR IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING...

METHOD FOR FORMING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

PACKAGE SUBSTRATE AND PACKAGE STRUCTURE

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

WAFER-LEVEL STACKED DIE STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS