connected to auxiliary connecting means on the bonding areas

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H01L2224/40475

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40475connected to auxiliary connecting means on the bonding areas

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,646,250
- Issue date May 9, 2023
- Kabushiki Kaisha Toshiba
- Daisuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,274
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,201,101
- Issue date Dec 14, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Norio Takatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,985,092
- Issue date Apr 20, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,656
- Issue date Jan 7, 2020
- Mitsubishi Electric Corporation
- Yoshihiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging solutions for devices and systems comprising lateral GaN...
- Patent number 9,824,949
- Issue date Nov 21, 2017
- GaN Systems Inc.
- Cameron McKnight-MacNeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,633,967
- Issue date Apr 25, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,609,775
- Issue date Mar 28, 2017
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,601,453
- Issue date Mar 21, 2017
- MagnaChip Semiconductor, Ltd.
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,402,311
- Issue date Jul 26, 2016
- NSK Ltd.
- Takashi Sunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,312,234
- Issue date Apr 12, 2016
- NSK Ltd.
- Takashi Sunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,117,811
- Issue date Aug 25, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,823,151
- Issue date Sep 2, 2014
- Mitsubishi Electric Corporation
- Yoshihiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,653,667
- Issue date Feb 18, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET having selectively silvered pads for clip and bond wir...
- Patent number 8,586,480
- Issue date Nov 19, 2013
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355774
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Nozomi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...
- Publication number 20240243092
- Publication date Jul 18, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
- Publication number 20240145353
- Publication date May 2, 2024
- Fuji Electric Co., Ltd.
- Tsubasa NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105666
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- Kabushiki Kaisha Toshiba
- Daisuke Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378013
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Kengo OHMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STOP FEATURE FOR ELECTRONIC DEVICES
- Publication number 20230170316
- Publication date Jun 1, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Clip Bond Having Multipl...
- Publication number 20220208716
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Hyung Mook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
- Publication number 20220208686
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP INTERCONNECT WITH MICRO CONTACT HEADS
- Publication number 20220181290
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Emmanuel Silvestre RAMOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210313294
- Publication date Oct 7, 2021
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210280500
- Publication date Sep 9, 2021
- Kabushiki Kaisha Toshiba
- Daisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210202429
- Publication date Jul 1, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210020548
- Publication date Jan 21, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20200381335
- Publication date Dec 3, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Norio TAKATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140239468
- Publication date Aug 28, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Yoshihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140054757
- Publication date Feb 27, 2014
- PANASONIC CORPORATION
- Keiko Ikuta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...
- Publication number 20140042624
- Publication date Feb 13, 2014
- IXYS Corporation
- Nathan Zommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120074516
- Publication date Mar 29, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Yoshihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS

connected to auxiliary connecting means on the bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Electronic module

Electronic component

Semiconductor device

Semiconductor device

Sintered conductive matrix material on wire bond

Packaging solutions for devices and systems comprising lateral GaN...

Semiconductor module

Semiconductor module

Semiconductor package

Flip chip assembly and process with sintering material on metal bumps

Semiconductor module

Semiconductor module and method for manufacturing the same

Flip chip assembly and process with sintering material on metal bumps

Semiconductor device

Power MOSFET having selectively silvered pads for clip and bond wir...

Power MOSFET having selectively silvered pads for clip and bond wir...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...

SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR DEVICE

SOLDER STOP FEATURE FOR ELECTRONIC DEVICES

Semiconductor Device and Method of Forming Clip Bond Having Multipl...

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

CLIP INTERCONNECT WITH MICRO CONTACT HEADS

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Power MOSFET Having Selectively Silvered Pads for Clip and Bond Wir...

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

SEMICONDUCTOR DEVICE