connecting first outside the semiconductor or solid-state body

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H01L2224/85186

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85186connecting first outside the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact wirebonding in stacked-chip system in package, and methods...
- Patent number 10,847,450
- Issue date Nov 24, 2020
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with supported stacked die
- Patent number 10,796,975
- Issue date Oct 6, 2020
- Intel Corporation
- Guo Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-chip package
- Patent number 10,679,972
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnections for semiconductor devices and methods f...
- Patent number 10,643,966
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Hyosung Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,629,520
- Issue date Apr 21, 2020
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical wire connections for integrated circuit package
- Patent number 10,490,527
- Issue date Nov 26, 2019
- Intel IP Corporation
- Christian Geissler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-volatile memory with stacked semiconductor chips
- Patent number 10,347,618
- Issue date Jul 9, 2019
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 10,312,171
- Issue date Jun 4, 2019
- Rohm Co., Ltd.
- Kensuke Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,402
- Issue date Jan 1, 2019
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,859,182
- Issue date Jan 2, 2018
- Rohm Co., Ltd.
- Kensuke Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipped die stacks with multiple rows of leadframe interconnects
- Patent number 9,859,257
- Issue date Jan 2, 2018
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,837,373
- Issue date Dec 5, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,793,236
- Issue date Oct 17, 2017
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package structure
- Patent number 9,653,669
- Issue date May 16, 2017
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chih-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method for manufacturing the module
- Patent number 9,613,938
- Issue date Apr 4, 2017
- Mitsumi Electric Co., Ltd.
- Soichiro Suzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection pads for a fingerprint sensing device
- Patent number 9,582,704
- Issue date Feb 28, 2017
- FINGERPRINT CARDS AB
- Pontus Jägemalm
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding pad arrangment design for multi-die semiconductor package s...
- Patent number 9,564,395
- Issue date Feb 7, 2017
- Mediatek Inc.
- Hsing-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and production method therefor
- Patent number 9,543,239
- Issue date Jan 10, 2017
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging having plurality of wires bonding to...
- Patent number 9,536,859
- Issue date Jan 3, 2017
- Rohm Co., Ltd.
- Hiroyuki Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 9,508,673
- Issue date Nov 29, 2016
- Nanya Technology Corporation
- Po-Chun Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,490,194
- Issue date Nov 8, 2016
- Rohm Co., Ltd.
- Kensuke Mikado
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
- Publication number 20230275060
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Xiaoling Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...
- Publication number 20220320040
- Publication date Oct 6, 2022
- Yamaha Robotics Holdings Co., Ltd.
- Hiroshi MUNAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
- Publication number 20220199571
- Publication date Jun 23, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTI-CHIP PACKAGE
- Publication number 20190103381
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...
- Publication number 20180331064
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Hyosung KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180096908
- Publication date Apr 5, 2018
- ROHM CO., LTD.
- Kensuke MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20180076188
- Publication date Mar 15, 2018
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED PACKAGE STRUCTURE
- Publication number 20160336498
- Publication date Nov 17, 2016
- LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
- CHIH-YUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20160163673
- Publication date Jun 9, 2016
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140353822
- Publication date Dec 4, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenji OYACHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRE BONDING METHOD AND SEMICONDUCTOR PACKAGE MANUFACTURED USING TH...
- Publication number 20140339290
- Publication date Nov 20, 2014
- Won-Gil HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140306328
- Publication date Oct 16, 2014
- ROHM CO., LTD.
- Kensuke MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ARRAY PACKAGE
- Publication number 20140227833
- Publication date Aug 14, 2014
- Apple Inc.
- Shawn X. Arnold
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WATERFALL WIRE BONDING
- Publication number 20140183727
- Publication date Jul 3, 2014
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE
- Publication number 20140170812
- Publication date Jun 19, 2014
- SK HYNIX INC.
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND BONDING METHOD
- Publication number 20140138426
- Publication date May 22, 2014
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140021608
- Publication date Jan 23, 2014
- Samsunung Electronics., Ltd.
- KEUN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130334687
- Publication date Dec 19, 2013
- Hiroyuki KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...
- Publication number 20130328218
- Publication date Dec 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT AND LOW LOOP WIRE BONDING
- Publication number 20130328194
- Publication date Dec 12, 2013
- Carsem (M) Sdn.Bhd.
- Liew Siew Har
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD
- Publication number 20130285239
- Publication date Oct 31, 2013
- HON HAI Precision Industry CO., LTD.
- KAI-WEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ARRAY PACKAGE
- Publication number 20130285263
- Publication date Oct 31, 2013
- Apple Inc.
- Shawn X. ARNOLD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR ARRAY PACKAGE
- Publication number 20130285240
- Publication date Oct 31, 2013
- Apple Inc.
- Matthew E. LAST
- H01 - BASIC ELECTRIC ELEMENTS

connecting first outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and methods for tool mark free stitch bonding

Packages with electrical fuses

Wire bonding tool including a wedge tool

Compact wirebonding in stacked-chip system in package, and methods...

Semiconductor integrated circuit device

Semiconductor package with supported stacked die

Electronic unit

Semiconductor chip package with resilient conductive paste post and...

Method of manufacturing multi-chip package

Electrical interconnections for semiconductor devices and methods f...

Semiconductor device and method for manufacturing the same

Vertical wire connections for integrated circuit package

Non-volatile memory with stacked semiconductor chips

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Flipped die stacks with multiple rows of leadframe interconnects

Semiconductor device and production method therefor

Wire-bonding apparatus and method of manufacturing semiconductor de...

Waterfall wire bonding

Thin plastic leadless package with exposed metal die paddle

LED package structure

Module and method for manufacturing the module

Connection pads for a fingerprint sensing device

Bonding pad arrangment design for multi-die semiconductor package s...

Semiconductor device and production method therefor

Semiconductor device packaging having plurality of wires bonding to...

Wire bonding method

Semiconductor device

Patents Applicationslast 30 patents

PACKAGES WITH ELECTRICAL FUSES

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION

WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

METHOD OF MANUFACTURING MULTI-CHIP PACKAGE

ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE

LED PACKAGE STRUCTURE

WIRE BONDING APPARATUS AND BONDING METHOD

SEMICONDUCTOR DEVICE

WIRE BONDING METHOD AND SEMICONDUCTOR PACKAGE MANUFACTURED USING TH...

SEMICONDUCTOR DEVICE

SENSOR ARRAY PACKAGE

WATERFALL WIRE BONDING

METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE

WIRE BONDING APPARATUS AND BONDING METHOD

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEALED SEMICONDUCTOR DEVICE HAVING ADHESIVE PATCH WITH INWARDLY SLO...

SHORT AND LOW LOOP WIRE BONDING

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

CHIP ASSEMBLY AND CHIP ASSEMBLING METHOD

SENSOR ARRAY PACKAGE

SENSOR ARRAY PACKAGE