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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/404Connecting portions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe package with adjustable clip
- Patent number 12,046,540
- Issue date Jul 23, 2024
- Infineon Technologies AG
- Christian Feuerbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,676,931
- Issue date Jun 13, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,646,250
- Issue date May 9, 2023
- Kabushiki Kaisha Toshiba
- Daisuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,274
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,273
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,270,969
- Issue date Mar 8, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip module
- Patent number 11,264,351
- Issue date Mar 1, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clips for semiconductor packages
- Patent number 11,211,353
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,201,101
- Issue date Dec 14, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Norio Takatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,189,591
- Issue date Nov 30, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor assembly with dual middle mounting clips
- Patent number 11,075,148
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device
- Patent number 10,985,092
- Issue date Apr 20, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with temperature detecting element
- Patent number 10,580,754
- Issue date Mar 3, 2020
- Mitsubishi Electric Corporation
- Shinya Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,559,538
- Issue date Feb 11, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stack die package
- Patent number 10,546,840
- Issue date Jan 28, 2020
- Vishay SIliconix, LLC
- Kyle Terrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,656
- Issue date Jan 7, 2020
- Mitsubishi Electric Corporation
- Yoshihiro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,510,636
- Issue date Dec 17, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240395761
- Publication date Nov 28, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355774
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Nozomi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...
- Publication number 20240312880
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Yusuke KUSAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...
- Publication number 20240243092
- Publication date Jul 18, 2024
- Infineon Technologies Austria AG
- Edward Fürgut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240153904
- Publication date May 9, 2024
- Fuji Electric Co., Ltd.
- Norihiro NASHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
- Publication number 20240145353
- Publication date May 2, 2024
- Fuji Electric Co., Ltd.
- Tsubasa NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240128166
- Publication date Apr 18, 2024
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105666
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Daisuke Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096843
- Publication date Mar 21, 2024
- Kabushiki Kaisha Toshiba
- Kyo TANABIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047315
- Publication date Feb 8, 2024
- ROHM CO., LTD.
- Masaki KANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014193
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411338
- Publication date Dec 21, 2023
- Rohm Co., Ltd.
- Takukazu OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378013
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Kengo OHMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230369279
- Publication date Nov 16, 2023
- STMicroelectronics S.r.l
- Thomas GOTTARDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PCB FOR TOPSIDE POWER DELIVERY
- Publication number 20230317706
- Publication date Oct 5, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230299036
- Publication date Sep 21, 2023
- Rohm Co., Ltd.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230268311
- Publication date Aug 24, 2023
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230245954
- Publication date Aug 3, 2023
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230223441
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STOP FEATURE FOR ELECTRONIC DEVICES
- Publication number 20230170316
- Publication date Jun 1, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

Connecting portions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Leadframe package with adjustable clip

Semiconductor device

Semiconductor device and electronic device

Semiconductor package, method of manufacturing the same and metal b...

Semiconductor package

Semiconductor device

Semiconductor devices and methods of making the same

Electronic module, method of manufacturing connector, and method of...

Electronic module

Electronic module

Method for die and clip attachment

Semiconductor package

Method of manufacturing chip module

Clips for semiconductor packages

Electronic component

Electronic module

Stacked transistor assembly with dual middle mounting clips

Method for electrically contacting a component by galvanic connecti...

Semiconductor device

Solid top terminal for discrete power devices

Semiconductor device and method with clip arrangement in IC package

Curtain airbag device mounting structure and curtain airbag deploym...

Semiconductor devices and methods of making the same

Package with vertical interconnect between carrier and clip

Semiconductor module with temperature detecting element

Power module

Method for fabricating stack die package

Semiconductor device

Electronic module

Semiconductor devices and methods of making the same

Patents Applicationslast 30 patents

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

SEMICONDUCTOR PACKAGE IN A SOURCE-DOWN CONFIGURATION BY USE OF VERT...

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

SEMICONDUCTOR DEVICE

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

SEMICONDUCTOR DEVICE

Two-In-One Lead Frame Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER MODULE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METAL PCB FOR TOPSIDE POWER DELIVERY

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SOLDER STOP FEATURE FOR ELECTRONIC DEVICES