Connecting the strap to a bond pad of the item

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H01L2224/40227

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40227Connecting the strap to a bond pad of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power module
- Patent number 12,068,289
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Kenichi Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 12,027,485
- Issue date Jul 2, 2024
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,948,911
- Issue date Apr 2, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,564
- Issue date Jan 17, 2023
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,502,054
- Issue date Nov 15, 2022
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly and method therefor
- Patent number 11,462,505
- Issue date Oct 4, 2022
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip module
- Patent number 11,264,351
- Issue date Mar 1, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate with integrated inductive component
- Patent number 11,133,375
- Issue date Sep 28, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices
- Patent number 11,031,379
- Issue date Jun 8, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 10,930,524
- Issue date Feb 23, 2021
- Semiconductor Components Industries, LLC
- Chun-Li Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having power device connected between heat sink and dr...
- Patent number 10,763,244
- Issue date Sep 1, 2020
- Siemens Aktiengesellschaft
- Karl Weidner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor system having unidirectional connections to...
- Patent number 10,756,013
- Issue date Aug 25, 2020
- Texas Instruments Incorporated
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package having a power semiconductor chip
- Patent number 10,734,250
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Thomas Basler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with back-side integrated inductive component
- Patent number 10,692,964
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,559,538
- Issue date Feb 11, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 10,510,636
- Issue date Dec 17, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,468,328
- Issue date Nov 5, 2019
- Fuji Electric Co., Ltd.
- Yuki Inaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,373,919
- Issue date Aug 6, 2019
- Fuji Electric Co., Ltd.
- Tatsuhiko Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module assembly with dual substrates and reduced inductance
- Patent number 10,283,475
- Issue date May 7, 2019
- GM Global Technology Operations LLC
- Terence G. Ward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system and method of making the integrated system
- Patent number 10,224,317
- Issue date Mar 5, 2019
- Infineon Technologies AG
- Thomas Kilger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Arrangement of multiple power semiconductor chips and method of man...
- Patent number 10,049,962
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429154
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387455
- Publication date Nov 21, 2024
- NHINC Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240363595
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Kenichi ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D GATE CONTROL CONNECTION OF A POWER MODULE WITH AT LEAST ONE CONT...
- Publication number 20240339434
- Publication date Oct 10, 2024
- II-VI Delaware, Inc.
- Erno TEMESI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Half-Bridge Module, Power Inverter, and Method for Producing...
- Publication number 20240339439
- Publication date Oct 10, 2024
- Vitesco Technologies Germany GMBH
- Markus Hövermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312948
- Publication date Sep 19, 2024
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240234360
- Publication date Jul 11, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240178094
- Publication date May 30, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...
- Publication number 20240145353
- Publication date May 2, 2024
- Fuji Electric Co., Ltd.
- Tsubasa NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240136319
- Publication date Apr 25, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
- Publication number 20240112991
- Publication date Apr 4, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY HAVING DUAL CONDUCTION CHANNELS FOR ELECTRIC...
- Publication number 20240063105
- Publication date Feb 22, 2024
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL
- Publication number 20240030208
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP APPLIED TO POWER MODULE
- Publication number 20230395554
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX BONDED INTEGRATED CIRCUITS
- Publication number 20230299035
- Publication date Sep 21, 2023
- META PLATFORMS, INC.
- Sandeep Rekhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE
- Publication number 20230246002
- Publication date Aug 3, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230146758
- Publication date May 11, 2023
- Rohm Co., Ltd.
- Tatsuya MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CIRCUIT MODULE
- Publication number 20230052830
- Publication date Feb 16, 2023
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
- Publication number 20220415844
- Publication date Dec 29, 2022
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20220320049
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Kenichi ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
- Publication number 20220149000
- Publication date May 12, 2022
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE
- Publication number 20210391229
- Publication date Dec 16, 2021
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- Markus Düsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND SEMICONDUCTOR MODULE
- Publication number 20210288016
- Publication date Sep 16, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210257334
- Publication date Aug 19, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210217721
- Publication date Jul 15, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CHIP MODULE
- Publication number 20210175197
- Publication date Jun 10, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20210066256
- Publication date Mar 4, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS

Connecting the strap to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module

Semiconductor device assembly and method therefor

Semiconductor packaging method and semiconductor package device

Semiconductor devices and methods of making the same

Semiconductor device

Semiconductor device assembly and method therefor

Semiconductor device assembly and method therefor

Electronic module, method of manufacturing connector, and method of...

Method of manufacturing chip module

Semiconductor substrate with integrated inductive component

Method for electrically contacting a component by galvanic connecti...

Stray inductance reduction in packaged semiconductor devices

Semiconductor component and method of manufacture

Die stack assembly using an edge separation structure for connectiv...

Power module having power device connected between heat sink and dr...

Packaged semiconductor system having unidirectional connections to...

Method of manufacturing a package having a power semiconductor chip

Die stack assembly using an edge separation structure for connectiv...

Semiconductor devices and methods of making the same

Semiconductor die with back-side integrated inductive component

Power module

Electronic module

Semiconductor module and conductive member for semiconductor module...

Semiconductor device and method of manufacturing a semiconductor de...

Method of manufacturing a semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Power module assembly with dual substrates and reduced inductance

Integrated system and method of making the integrated system

Arrangement of multiple power semiconductor chips and method of man...

Semiconductor device, method of manufacturing a semiconductor devic...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

POWER MODULE

3D GATE CONTROL CONNECTION OF A POWER MODULE WITH AT LEAST ONE CONT...

Power Half-Bridge Module, Power Inverter, and Method for Producing...

POWER MODULE WITH OVERLAPPING TERMINALS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE...

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE

SEMICONDUCTOR ASSEMBLY HAVING DUAL CONDUCTION CHANNELS FOR ELECTRIC...

HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL

METAL CLIP APPLIED TO POWER MODULE

FLEX BONDED INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

POWER CIRCUIT MODULE

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

POWER MODULE

SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

POWER ELECTRONIC CIRCUIT DEVICE WITH A PRESSURE DEVICE

WIRING STRUCTURE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING CHIP MODULE

STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES