connecting the wire to a bond pad of the item

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48157connecting the wire to a bond pad of the item

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,347,814
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device for improving internal quantum efficiency
- Patent number 12,334,485
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Jin Woo Choi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Intra-cardiac echocardiography interposer
- Patent number 12,324,701
- Issue date Jun 10, 2025
- PHILIPS IMAGE GUIDED THERAPY CORPORATION
- Wojtek Sudol
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siliconized heterogeneous optical engine
- Patent number 12,292,605
- Issue date May 6, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passives to facilitate mold compound flow
- Patent number 12,243,849
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Chittranjan Mohan Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, tiled display panel and display device
- Patent number 12,237,316
- Issue date Feb 25, 2025
- BOE Technology Group Co., Ltd.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile sensor packages
- Patent number 12,230,619
- Issue date Feb 18, 2025
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi level radio frequency (RF) integrated circuit components incl...
- Patent number 12,074,123
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,978,683
- Issue date May 7, 2024
- Sumitomo Electric Industries, Ltd.
- Toru Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,961,775
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having pixels with the same active layer and method...
- Patent number 11,942,025
- Issue date Mar 26, 2024
- Samsung Display Co., Ltd.
- Jin Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including sheilding cover that covers molded...
- Patent number 11,923,319
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and production method thereof, and semiconduc...
- Patent number 11,901,341
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,472
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 11,784,177
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Seung Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an electronic fuse control circuit
- Patent number 11,769,562
- Issue date Sep 26, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,694,938
- Issue date Jul 4, 2023
- Mitsubishi Electric Corporation
- Mariko Ohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,676,871
- Issue date Jun 13, 2023
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 11,670,627
- Issue date Jun 6, 2023
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- G02 - OPTICS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,658,149
- Issue date May 23, 2023
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer design in package structures for wire bonding applications
- Patent number 11,652,087
- Issue date May 16, 2023
- Tahoe Research, LTD.
- Aiping Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit architecture
- Patent number 11,527,482
- Issue date Dec 13, 2022
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of assembling a system
- Patent number 11,502,030
- Issue date Nov 15, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,495,505
- Issue date Nov 8, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,462,516
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,430,707
- Issue date Aug 30, 2022
- Fuji Electric Co., Ltd.
- Yuji Ichimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250239512
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Che-Neng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVES TO FACILITATE MOLD COMPOUND FLOW
- Publication number 20250201774
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chittranjan Mohan GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A SUBSTRATE WITH CONNECTING PORTIONS
- Publication number 20250201641
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Gyuhyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...
- Publication number 20250192077
- Publication date Jun 12, 2025
- CIENA CORPORATION
- Joël Boyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE SENSOR PACKAGES
- Publication number 20250174616
- Publication date May 29, 2025
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...
- Publication number 20250149506
- Publication date May 8, 2025
- Kirill Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250149522
- Publication date May 8, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...
- Publication number 20250149395
- Publication date May 8, 2025
- Utkarsh Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20250149412
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-SIDED DIRECT COOLED POWER MODULE
- Publication number 20250149417
- Publication date May 8, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125693
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Shigemi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
- Publication number 20250105157
- Publication date Mar 27, 2025
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...
- Publication number 20250062202
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yi Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...
- Publication number 20250014987
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUIT...
- Publication number 20240421092
- Publication date Dec 19, 2024
- Qorvo US, Inc.
- Tobias Mangold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES
- Publication number 20240396198
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387389
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Harutoshi TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Half-Bridge Module, Power Inverter, and Method for Producing...
- Publication number 20240339439
- Publication date Oct 10, 2024
- Vitesco Technologies Germany GMBH
- Markus Hövermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING
- Publication number 20240332252
- Publication date Oct 3, 2024
- Meta Platforms Technologies, LLC
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...
- Publication number 20240297105
- Publication date Sep 5, 2024
- CIENA CORPORATION
- Michael Vitic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20240297152
- Publication date Sep 5, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND POWER CONVERTER
- Publication number 20240274498
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Shotaro YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240265854
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Wan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20240258182
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
- Publication number 20240234338
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Tetsunari SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240213177
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- YOUNG-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...
- Publication number 20240213430
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR
- Publication number 20240203801
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and semiconductor device

Display device for improving internal quantum efficiency

Intra-cardiac echocardiography interposer

Semiconductor package including shielding cover that covers molded...

Siliconized heterogeneous optical engine

Passives to facilitate mold compound flow

Display substrate, tiled display panel and display device

Low profile sensor packages

Display device and method for fabricating the same

Hybrid system including photonic and electronic integrated circuits...

Multi level radio frequency (RF) integrated circuit components incl...

Semiconductor apparatus

Semiconductor devices and related methods

Display device having pixels with the same active layer and method...

Semiconductor package including sheilding cover that covers molded...

Semiconductor package and production method thereof, and semiconduc...

Semiconductor package

Display device and method for fabricating the same

Semiconductor device including an electronic fuse control circuit

Semiconductor device

Semiconductor device and method of forming interposer with opening...

Semiconductor device and manufacturing method for semiconductor device

Hybrid system including photonic and electronic integrated circuits...

Semiconductor package including stacked semiconductor chips

Interposer design in package structures for wire bonding applications

Hybrid integrated circuit architecture

System and method of assembling a system

Semiconductor devices and related methods

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

PASSIVES TO FACILITATE MOLD COMPOUND FLOW

SEMICONDUCTOR PACKAGES HAVING A SUBSTRATE WITH CONNECTING PORTIONS

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...

LOW PROFILE SENSOR PACKAGES

POWER ELECTRONICS PACKAGE HAVING SIGNAL CONNECTIONS FOR MULTIPLE PO...

DISPLAY SUBSTRATE, TILED DISPLAY PANEL AND DISPLAY DEVICE

POWER MODULES HAVING ENCAPSULATION STRESS AND STRAIN MITIGATING CON...

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

SINGLE-SIDED DIRECT COOLED POWER MODULE

SEMICONDUCTOR DEVICE

BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE

POWER MODULE AND POWER CONVERSION APPARATUS

PACKAGE STRUCTURE, SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING TH...

INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING S...

INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUIT...

CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES

SEMICONDUCTOR DEVICE

Power Half-Bridge Module, Power Inverter, and Method for Producing...

HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING

Semiconductor Device Package with Die Stackup and Interposer

RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...

MODULE

SEMICONDUCTOR MODULE AND POWER CONVERTER

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND RELATED METHODS

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...

TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR