connecting the wire to a bond pad of the item

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H01L2224/48157

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48157connecting the wire to a bond pad of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi level radio frequency (RF) integrated circuit components incl...
- Patent number 12,074,123
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,978,683
- Issue date May 7, 2024
- Sumitomo Electric Industries, Ltd.
- Toru Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,961,775
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having pixels with the same active layer and method...
- Patent number 11,942,025
- Issue date Mar 26, 2024
- Samsung Display Co., Ltd.
- Jin Wan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including sheilding cover that covers molded...
- Patent number 11,923,319
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and production method thereof, and semiconduc...
- Patent number 11,901,341
- Issue date Feb 13, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,472
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 11,784,177
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Seung Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an electronic fuse control circuit
- Patent number 11,769,562
- Issue date Sep 26, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,694,938
- Issue date Jul 4, 2023
- Mitsubishi Electric Corporation
- Mariko Ohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,676,871
- Issue date Jun 13, 2023
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 11,670,627
- Issue date Jun 6, 2023
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- G02 - OPTICS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,658,149
- Issue date May 23, 2023
- SK hynix Inc.
- Jin Kyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer design in package structures for wire bonding applications
- Patent number 11,652,087
- Issue date May 16, 2023
- Tahoe Research, LTD.
- Aiping Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit architecture
- Patent number 11,527,482
- Issue date Dec 13, 2022
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of assembling a system
- Patent number 11,502,030
- Issue date Nov 15, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,495,505
- Issue date Nov 8, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,462,516
- Issue date Oct 4, 2022
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,430,707
- Issue date Aug 30, 2022
- Fuji Electric Co., Ltd.
- Yuji Ichimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intra-cardiac echocardiography interposer
- Patent number 11,426,140
- Issue date Aug 30, 2022
- PHILIPS IMAGE GUIDED THERAPY CORPORATION
- Wojtek Sudol
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Semiconductor module
- Patent number 11,430,726
- Issue date Aug 30, 2022
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting device with high flexibility in connecting electrical comp...
- Patent number 11,430,933
- Issue date Aug 30, 2022
- Lumileds LLC
- Harry Gijsbers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure including an encapsulant having a c...
- Patent number 11,410,915
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,393,795
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including processor chip and memory chip
- Patent number 11,309,300
- Issue date Apr 19, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,244,875
- Issue date Feb 8, 2022
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having case to which circuit board is bonded b...
- Patent number 11,177,236
- Issue date Nov 16, 2021
- Fuji Electric Co., Ltd.
- Tatsuya Karasawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUIT...
- Publication number 20240421092
- Publication date Dec 19, 2024
- Qorvo US, Inc.
- Tobias Mangold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES
- Publication number 20240396198
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Ernst SELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387389
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Harutoshi TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Half-Bridge Module, Power Inverter, and Method for Producing...
- Publication number 20240339439
- Publication date Oct 10, 2024
- Vitesco Technologies Germany GMBH
- Markus Hövermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING
- Publication number 20240332252
- Publication date Oct 3, 2024
- Meta Platforms Technologies, LLC
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...
- Publication number 20240297105
- Publication date Sep 5, 2024
- CIENA CORPORATION
- Michael Vitic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20240297152
- Publication date Sep 5, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND POWER CONVERTER
- Publication number 20240274498
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Shotaro YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240265854
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Wan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20240258182
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
- Publication number 20240234338
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Tetsunari SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240213177
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- YOUNG-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...
- Publication number 20240213430
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR
- Publication number 20240203801
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE COMPRISING TWO ELECTRONIC CHIPS WITH DIFFERENT SUBSTRATES
- Publication number 20240153880
- Publication date May 9, 2024
- STMicroelectroncis (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...
- Publication number 20240145424
- Publication date May 2, 2024
- Western Digital Technologies, Inc.
- John Contreras
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096723
- Publication date Mar 21, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Akira SAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20240079384
- Publication date Mar 7, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240057353
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055405
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Joo-Young OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME, AND MEMORY
- Publication number 20240055404
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20230369180
- Publication date Nov 16, 2023
- KYOCERA CORPORATION
- Akihiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR AN ELECTRONIC CHIP
- Publication number 20230371167
- Publication date Nov 16, 2023
- CENTRE NATIONAL D'ETUDES SPATIALES
- Pascal FEBVRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230335448
- Publication date Oct 19, 2023
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECORDING ELEMENT UNIT AND METHOD FOR MANUFACTURING RECORDING ELEME...
- Publication number 20230311498
- Publication date Oct 5, 2023
- Canon Kabushiki Kaisha
- NAOYA TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD OF HIGH-POWER RADIO FREQUE...
- Publication number 20230282609
- Publication date Sep 7, 2023
- INNOGRATION (SUZHOU) CO., LTD.
- Yinghao ZHUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, PACKAGED STRUCTURE, AND ELECTRONIC DEVICE
- Publication number 20230230928
- Publication date Jul 20, 2023
- Huawei Technologies Co., Ltd.
- Huibin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY CIRCUIT DEVICE AND DETECTION SYSTEM
- Publication number 20230207500
- Publication date Jun 29, 2023
- Canon Kabushiki Kaisha
- Yasushi Koyama
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a bond pad of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method for fabricating the same

Hybrid system including photonic and electronic integrated circuits...

Multi level radio frequency (RF) integrated circuit components incl...

Semiconductor apparatus

Semiconductor devices and related methods

Display device having pixels with the same active layer and method...

Semiconductor package including sheilding cover that covers molded...

Semiconductor package and production method thereof, and semiconduc...

Semiconductor package

Display device and method for fabricating the same

Semiconductor device including an electronic fuse control circuit

Semiconductor device

Semiconductor device and method of forming interposer with opening...

Semiconductor device and manufacturing method for semiconductor device

Hybrid system including photonic and electronic integrated circuits...

Semiconductor package including stacked semiconductor chips

Interposer design in package structures for wire bonding applications

Hybrid integrated circuit architecture

System and method of assembling a system

Semiconductor devices and related methods

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Intra-cardiac echocardiography interposer

Semiconductor module

Lighting device with high flexibility in connecting electrical comp...

Semiconductor package structure including an encapsulant having a c...

Semiconductor package

Semiconductor package including processor chip and memory chip

Semiconductor device and manufacturing method for semiconductor device

Semiconductor device having case to which circuit board is bonded b...

Patents Applicationslast 30 patents

INTEGRATED THERMAL BRIDGES ON WIREBOND ASSEMBLED INTEGRATED CIRCUIT...

CHIP PACKAGES INCLUDING SUBSTRATE INTEGRATED WAVEGUIDES

SEMICONDUCTOR DEVICE

Power Half-Bridge Module, Power Inverter, and Method for Producing...

HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING

Semiconductor Device Package with Die Stackup and Interposer

RADIO FREQUENCY (RF) INTERCONNECT CONFIGURATION FOR SUBSTRATE AND S...

MODULE

SEMICONDUCTOR MODULE AND POWER CONVERTER

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND RELATED METHODS

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...

TEST PAD ON DEVICE LEAD FOR TEST CONTACTOR

QFN PACKAGE COMPRISING TWO ELECTRONIC CHIPS WITH DIFFERENT SUBSTRATES

NAND DIE WITH WIRE-BOND INDUCTIVE COMPENSATION FOR ALTERED BOND WIR...

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME, AND MEMORY

WIRING SUBSTRATE AND ELECTRONIC DEVICE

SUBSTRATE FOR AN ELECTRONIC CHIP

SEMICONDUCTOR APPARATUS

RECORDING ELEMENT UNIT AND METHOD FOR MANUFACTURING RECORDING ELEME...

PACKAGING STRUCTURE AND PACKAGING METHOD OF HIGH-POWER RADIO FREQUE...

SUBSTRATE, PACKAGED STRUCTURE, AND ELECTRONIC DEVICE

HIGH-FREQUENCY CIRCUIT DEVICE AND DETECTION SYSTEM