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connecting the wire to a bond pad of the item

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  • H01L2224/48247
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48247connecting the wire to a bond pad of the item
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
    • Publication number 20240120322
    • Publication date Apr 11, 2024
    • Rohm Co., Ltd.
    • Keiji Okumura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package Assembly
    • Publication number 20240120260
    • Publication date Apr 11, 2024
    • NEXPERIA B.V.
    • Tim Böttcher
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240112988
    • Publication date Apr 4, 2024
    • ROHM CO., LTD.
    • Kaori UEBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240087991
    • Publication date Mar 14, 2024
    • Samsung Electronics Co., Ltd.
    • Jae Hyun LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METAL COMPONENT
    • Publication number 20240079298
    • Publication date Mar 7, 2024
    • MITSUI HIGH-TEC, INC.
    • Kento KOGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240079372
    • Publication date Mar 7, 2024
    • DENSO CORPORATION
    • SHOICHIRO OMAE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240063097
    • Publication date Feb 22, 2024
    • Rohm Co., Ltd.
    • Katsutoki SHIRAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240047300
    • Publication date Feb 8, 2024
    • ROHM CO., LTD.
    • Xiaopeng WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
    • Publication number 20240038635
    • Publication date Feb 1, 2024
    • Rohm Co., Ltd.
    • Mamoru YAMAGAMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240030109
    • Publication date Jan 25, 2024
    • ROHM CO., LTD.
    • Yoshizo OSUMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240030338
    • Publication date Jan 25, 2024
    • Ancora Semiconductors Inc.
    • Li-Fan LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240021541
    • Publication date Jan 18, 2024
    • RENESAS ELECTRONICS CORPORATION
    • Kazuo Tomita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240021496
    • Publication date Jan 18, 2024
    • Fuji Electric Co., Ltd.
    • Sota YAMAGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240014107
    • Publication date Jan 11, 2024
    • ROHM CO., LTD.
    • Yoshizo OSUMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGING EMI SHIELDING STRUCTURE AND MANUFACTURING M...
    • Publication number 20230420386
    • Publication date Dec 28, 2023
    • REALTEK SEMICONDUCTOR CORPORATION
    • CHIA JEN CHOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230420428
    • Publication date Dec 28, 2023
    • ROHM CO., LTD.
    • Yuji ISHIMATSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGING MEMBER, SEMICONDUCT...
    • Publication number 20230411252
    • Publication date Dec 21, 2023
    • JCET SEMICONDUCTOR (SUQIAN) CO., LTD.
    • KAI LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE FOR POWER CONVERTOR AND MANUFACTURING METHOD THEREOF
    • Publication number 20230411236
    • Publication date Dec 21, 2023
    • Joulwatt Technology Co., Ltd.
    • Anda ZHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN SUBSTRATE PACKAGE AND LEAD FRAME
    • Publication number 20230411251
    • Publication date Dec 21, 2023
    • STMICROELECTRONICS, INC.
    • Jefferson Sismundo TALLEDO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230411255
    • Publication date Dec 21, 2023
    • Rohm Co., Ltd.
    • Hiroaki MATSUBARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230411273
    • Publication date Dec 21, 2023
    • Rohm Co., Ltd.
    • Eiji KUWAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230411232
    • Publication date Dec 21, 2023
    • Rohm Co., Ltd.
    • Yosui FUTAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230402354
    • Publication date Dec 14, 2023
    • Rohm Co., Ltd.
    • Hiroaki MATSUBARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230395475
    • Publication date Dec 7, 2023
    • ROHM CO., LTD.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED-DIE MEMS RESONATOR
    • Publication number 20230391611
    • Publication date Dec 7, 2023
    • SiTime Corporation
    • Pavan Gupta
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230395476
    • Publication date Dec 7, 2023
    • ROHM CO., LTD.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD...
    • Publication number 20230387808
    • Publication date Nov 30, 2023
    • Power Integrations, Inc.
    • Balu Balakrishnan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230387185
    • Publication date Nov 30, 2023
    • ROHM CO., LTD.
    • Masahiko ARIMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20230378032
    • Publication date Nov 23, 2023
    • RENESAS ELECTRONICS CORPORATION
    • Kosuke KITAICHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
    • Publication number 20230378031
    • Publication date Nov 23, 2023
    • DENSO CORPORATION
    • Hiroshi ISHINO
    • H01 - BASIC ELECTRIC ELEMENTS