connecting the wire to a via metallisation of the item

Industry

CPC
H01L2224/48235

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48235connecting the wire to a via metallisation of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,854,925
- Issue date Dec 26, 2023
- Kioxia Corporation
- Satoshi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,749,612
- Issue date Sep 5, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chun-Hsien Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with reduced calibration time and ZQ calibration...
- Patent number 11,475,955
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Junha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit board and packaged chip
- Patent number 11,296,006
- Issue date Apr 5, 2022
- Mediatek Inc.
- You-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rod-based substrate with ringed interconnect layers
- Patent number 11,239,126
- Issue date Feb 1, 2022
- Intel Corporation
- Florence Su Sin Phun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,174,157
- Issue date Nov 16, 2021
- Advanced Semiconductor Engineering Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-chip package with reduced calibration time and ZQ calibration...
- Patent number 11,127,462
- Issue date Sep 21, 2021
- Samsung Electronics Co., Ltd.
- Junha Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 11,094,670
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip package having optical interface
- Patent number 11,061,193
- Issue date Jul 13, 2021
- Lipac Co., Ltd.
- Sang Don Lee
- G02 - OPTICS
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,950,563
- Issue date Mar 16, 2021
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure including at least one connecting module and manu...
- Patent number 10,950,593
- Issue date Mar 16, 2021
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,867,942
- Issue date Dec 15, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,818,619
- Issue date Oct 27, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,770,417
- Issue date Sep 8, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive trace design for smart card
- Patent number 10,763,203
- Issue date Sep 1, 2020
- NXP B.V.
- Amornthep Saiyajitara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple molding routing layers and a me...
- Patent number 10,734,247
- Issue date Aug 4, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 10,692,827
- Issue date Jun 23, 2020
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 10,662,056
- Issue date May 26, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip package having optical interface
- Patent number 10,649,159
- Issue date May 12, 2020
- Lipac Co., Ltd.
- Sang Don Lee
- G02 - OPTICS
Information Patent Grant
Multilayer frame packages for integrated circuits having a magnetic...
- Patent number 10,643,954
- Issue date May 5, 2020
- EVERSPIN TECHNOLOGIES, INC.
- Angelo V. Ugge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive shield for semiconductor package
- Patent number 10,586,771
- Issue date Mar 10, 2020
- UTAC HEADQUARTERS PTE, LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,586,748
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 10,522,507
- Issue date Dec 31, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for producing an electronic component
- Patent number 10,468,317
- Issue date Nov 5, 2019
- Osram Opto Semiconductors GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having a shielding against electromag...
- Patent number 10,455,692
- Issue date Oct 22, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier with RF structure
- Patent number 10,431,511
- Issue date Oct 1, 2019
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...
- Publication number 20240260281
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Wen Wei LUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC PACKAGE
- Publication number 20240105538
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SangHo SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...
- Publication number 20240071980
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...
- Publication number 20240057350
- Publication date Feb 15, 2024
- Changxin Memory Technologies, Inc.
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...
- Publication number 20240055399
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED HEAT SLUG IN A SUBSTRATE
- Publication number 20230317554
- Publication date Oct 5, 2023
- Qorvo US, Inc.
- Christine Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20230268278
- Publication date Aug 24, 2023
- ROBERT BOSCH GmbH
- Jan Homoth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20230023328
- Publication date Jan 26, 2023
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20220289560
- Publication date Sep 15, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220270945
- Publication date Aug 25, 2022
- KIOXIA Corporation
- SATOSHI KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS
- Publication number 20210074598
- Publication date Mar 11, 2021
- Intel Corporation
- Florence Su Sin Phun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20200399117
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200388585
- Publication date Dec 10, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200335462
- Publication date Oct 22, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE TRACE DESIGN FOR SMART CARD
- Publication number 20200258831
- Publication date Aug 13, 2020
- NXP B.V.
- Amornthep Saiyajitara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE HAVING OPTICAL INTERFACE
- Publication number 20200233157
- Publication date Jul 23, 2020
- Lipac Co., Ltd.
- Sang Don LEE
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200176344
- Publication date Jun 4, 2020
- Samsung Electronics Co. Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...
- Publication number 20200020667
- Publication date Jan 16, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200002162
- Publication date Jan 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...
- Publication number 20190244930
- Publication date Aug 8, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...
- Publication number 20190139934
- Publication date May 9, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20190081015
- Publication date Mar 14, 2019
- Micron Technology, Inc.
- Matt E. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20180315737
- Publication date Nov 1, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20180197840
- Publication date Jul 12, 2018
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20180114779
- Publication date Apr 26, 2018
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE HAVING OPTICAL INTERFACE
- Publication number 20180100977
- Publication date Apr 12, 2018
- GIPARANG CO., LTD.
- Sang Don LEE
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047695
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu SHIMOTE
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a via metallisation of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked microfeature devices and associated methods

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package device

Multi-chip package with reduced calibration time and ZQ calibration...

Stacked microfeature devices and associated methods

Semiconductor device and method of forming microelectromechanical s...

Circuit board and packaged chip

Rod-based substrate with ringed interconnect layers

Semiconductor device packages and methods of manufacturing the same

Multi-chip package with reduced calibration time and ZQ calibration...

Semiconductor device assemblies including multiple shingled stacks...

Semiconductor chip package having optical interface

Chip packages and methods for forming the same

Package structure including at least one connecting module and manu...

Printed circuit board and semiconductor package

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Chip packages and methods for forming the same

Conductive trace design for smart card

Semiconductor package with multiple molding routing layers and a me...

Packaged microelectronic devices and methods for manufacturing pack...

Semiconductor device and method of forming microelectromechanical s...

Semiconductor chip package having optical interface

Multilayer frame packages for integrated circuits having a magnetic...

Conductive shield for semiconductor package

Printed circuit board and semiconductor package

Semiconductor device assemblies including multiple shingled stacks...

Electronic component and method for producing an electronic component

Packaged semiconductor device having a shielding against electromag...

Power amplifier with RF structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...

METHOD FOR MAKING AN ELECTRONIC PACKAGE

WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...

SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...

EMBEDDED HEAT SLUG IN A SUBSTRATE

ELECTRONIC CIRCUIT MODULE

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

Semiconductor Device and Method of Forming Microelectromechanical S...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS

Semiconductor Device and Method of Forming Microelectromechanical S...

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

CONDUCTIVE TRACE DESIGN FOR SMART CARD

SEMICONDUCTOR CHIP PACKAGE HAVING OPTICAL INTERFACE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME

SEMICONDUCTOR CHIP PACKAGE HAVING OPTICAL INTERFACE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF