consisting of lead-in layers inseparably applied to the semiconductor body

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CPC
H01L23/482

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/482consisting of lead-in layers inseparably applied to the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,948,864
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Akira Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package for notched semiconductor die
- Patent number 11,942,369
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,942,431
- Issue date Mar 26, 2024
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,942,531
- Issue date Mar 26, 2024
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,942,389
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical unclonable functions with silicon-rich dielectric devices
- Patent number 11,935,843
- Issue date Mar 19, 2024
- Arizona Board of Regents on behalf of Arizona State University
- Michael Kozicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection circuit having a metal connectio...
- Patent number 11,929,305
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus for discharging heat
- Patent number 11,923,264
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Yongha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,887,935
- Issue date Jan 30, 2024
- Renesas Electronics Corporation
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode
- Patent number 11,887,980
- Issue date Jan 30, 2024
- Japan Display Inc.
- Toshinari Sasaki
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated circuit having contact jumper
- Patent number 11,887,914
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jung-Ho Do
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with through-mold via
- Patent number 11,869,829
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor device
- Patent number 11,869,957
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power transistors
- Patent number 11,862,536
- Issue date Jan 2, 2024
- MACOM Technology Solutions Holdings, Inc.
- Aram Mkhitarian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,855,039
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 11,854,788
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 11,854,944
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an air gap
- Patent number 11,848,253
- Issue date Dec 19, 2023
- United Microelectronics Corp.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having an electro-static discharge protection...
- Patent number 11,848,286
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Feng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,842,939
- Issue date Dec 12, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating field-effect transistors with interleaved source and dr...
- Patent number 11,842,947
- Issue date Dec 12, 2023
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,830,790
- Issue date Nov 28, 2023
- Kabushiki Kaisha Toshiba
- Hiroko Itokazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising pad-on-pad interconnects
- Patent number 11,823,983
- Issue date Nov 21, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistor, method of manufacturing the same, and radi...
- Patent number 11,810,861
- Issue date Nov 7, 2023
- Sony Group Corporation
- Naoki Saka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 11,804,439
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator transistor layout for radio frequency po...
- Patent number 11,804,435
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetrical plug technique for GaN devices
- Patent number 11,776,815
- Issue date Oct 3, 2023
- Power Integrations, Inc.
- Alexey Kudymov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR
- Publication number 20240128259
- Publication date Apr 18, 2024
- Japan Display Inc.
- Toshinari SASAKI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Semiconductor Devices Having an Electro-static Discharge Protection...
- Publication number 20240113044
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- YI-FENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING
- Publication number 20240105640
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Aya MURAYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV AS PAD
- Publication number 20240088101
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20240087990
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240088090
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE LAYOUT STRUCTURE, METHOD FOR FORMING SAME, AND...
- Publication number 20240071844
- Publication date Feb 29, 2024
- Changxin Memory Technologies, Inc.
- Yizhi ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240063095
- Publication date Feb 22, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Xiaoyan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240055420
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240047311
- Publication date Feb 8, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240047323
- Publication date Feb 8, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLD SUBSTRATE AND METHOD OF MANUFACTURING PRE-MOLD SUBSTRATE
- Publication number 20240038652
- Publication date Feb 1, 2024
- HAESUNG DS CO., LTD
- Kwang Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET PADS OVER TSV
- Publication number 20240006383
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING ON-CHIP GATE RESISTORS
- Publication number 20230420451
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Rahul R. Potera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE, DISPLAY PANEL, AND DISPLAY DEVICE
- Publication number 20230410703
- Publication date Dec 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hee-Kwon Lee
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME
- Publication number 20230386978
- Publication date Nov 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Masayuki KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20230378071
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20230378030
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230369174
- Publication date Nov 16, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Miaomiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP HAVING A BURIED POWER RAIL
- Publication number 20230361041
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Marcus Johannes Henricus VAN DAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND MEMORY DEVICE DEVICES AND RELATED ELECTRONIC SYSTEMS
- Publication number 20230361083
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230335470
- Publication date Oct 19, 2023
- Kabushiki Kaisha Toshiba
- Hiroshi KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE AND METHOD FOR MA...
- Publication number 20230335469
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Heng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20230326832
- Publication date Oct 12, 2023
- Fujitsu Limited
- Tsuyoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DETECTION MODULE AND BEAT SPECTROMETER
- Publication number 20230317867
- Publication date Oct 5, 2023
- Hamamatsu Photonics K.K.
- Tatsuo DOUGAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR AND BEATING SPECTROSCOPY DEVICE
- Publication number 20230307562
- Publication date Sep 28, 2023
- Hamamatsu Photonics K.K.
- Tatsuo DOUGAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE
- Publication number 20230307325
- Publication date Sep 28, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT WITH HIGH ELECTRON MOBILITY
- Publication number 20230307360
- Publication date Sep 28, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Dominique BERGOGNE
- H01 - BASIC ELECTRIC ELEMENTS

consisting of lead-in layers inseparably applied to the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device

Thin semiconductor package for notched semiconductor die

Semiconductor device and manufacturing method thereof

Semiconductor device including sense insulated-gate bipolar transistor

Thermally enhanced semiconductor package with at least one heat ext...

Physical unclonable functions with silicon-rich dielectric devices

Electrostatic discharge protection circuit having a metal connectio...

Semiconductor apparatus for discharging heat

Semiconductor device

Semiconductor device and manufacturing method thereof

Diode

Integrated circuit having contact jumper

Semiconductor device with through-mold via

Compound semiconductor device

High power transistors

Chip package structure

Micro assembled LED displays and lighting elements

Semiconductor packages and methods for forming the same

Semiconductor structure with an air gap

Semiconductor devices having an electro-static discharge protection...

Thermally enhanced semiconductor package with at least one heat ext...

Electronic device with multi-layer contact and system

Fabricating field-effect transistors with interleaved source and dr...

Semiconductor device

Package with a substrate comprising pad-on-pad interconnects

Field-effect transistor, method of manufacturing the same, and radi...

Reducing RC delay in semiconductor devices

Semiconductor-on-insulator transistor layout for radio frequency po...

Asymmetrical plug technique for GaN devices

Patents Applicationslast 30 patents

TRANSISTOR

Semiconductor Devices Having an Electro-static Discharge Protection...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

TSV AS PAD

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE LAYOUT STRUCTURE, METHOD FOR FORMING SAME, AND...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

PRE-MOLD SUBSTRATE AND METHOD OF MANUFACTURING PRE-MOLD SUBSTRATE

OFFSET PADS OVER TSV

SEMICONDUCTOR DEVICES HAVING ON-CHIP GATE RESISTORS

CHIP-ON-FILM PACKAGE, DISPLAY PANEL, AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

SEMICONDUCTOR STRUCTURE

INTEGRATED CHIP HAVING A BURIED POWER RAIL

3D NAND MEMORY DEVICE DEVICES AND RELATED ELECTRONIC SYSTEMS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE AND METHOD FOR MA...

SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...

LIGHT DETECTION MODULE AND BEAT SPECTROMETER

PHOTODETECTOR AND BEATING SPECTROSCOPY DEVICE

CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE

COMPONENT WITH HIGH ELECTRON MOBILITY