containing a filler

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CPC
H01L23/295

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/295containing a filler

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid resin composition for sealing and electronic component appar...
- Patent number 12,131,970
- Issue date Oct 29, 2024
- Resonac Corporation
- Hidetoshi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package
- Patent number 12,132,009
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Su Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing resin composition
- Patent number 12,116,479
- Issue date Oct 15, 2024
- Sumitomo Bakelite Co., Ltd.
- Jun Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,113,029
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Tatsuto Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor device packaging and associated systems an...
- Patent number 12,080,616
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Suresh K. Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,057,359
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Assembly of stacked elements and method of producing the same
- Patent number 12,046,524
- Issue date Jul 23, 2024
- TDK Corporation
- Yongfu Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with bridge die laterally wrapped by insulating e...
- Patent number 12,033,949
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package structure
- Patent number 12,021,037
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite component and method for manufacturing the same
- Patent number 12,002,760
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,002,686
- Issue date Jun 4, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,996,345
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip protective film and method for manufacturing same, and chip
- Patent number 11,978,686
- Issue date May 7, 2024
- Wuhan Choice Technology Co, Ltd
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 11,961,795
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die and package structure
- Patent number 11,948,904
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,385
- Issue date Mar 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,433
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,935,803
- Issue date Mar 19, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with leads having step surfaces
- Patent number 11,929,342
- Issue date Mar 12, 2024
- Shinko Electric Industries Co., Ltd.
- Futoshi Tsukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,923,259
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including mold layer and manufacturing method...
- Patent number 11,923,340
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,924,979
- Issue date Mar 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES
- Publication number 20240379602
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL METAL CARBIDE, NITRIDE, AND CARBONITRIDE FILMS AND...
- Publication number 20240365522
- Publication date Oct 31, 2024
- Drexel University
- Yury GOGOTSI
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...
- Publication number 20240363463
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355691
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE STRUCTURE AND MEMORY SYSTEM
- Publication number 20240347406
- Publication date Oct 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shanshan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240347496
- Publication date Oct 17, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...
- Publication number 20240339368
- Publication date Oct 10, 2024
- FUJIFILM CORPORATION
- Atsushi NAKAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON
- Publication number 20240332102
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF STACKED ELEMENTS AND METHOD OF PRODUCING THE SAME
- Publication number 20240332103
- Publication date Oct 3, 2024
- TDK Corporation
- Yongfu CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
- Publication number 20240332035
- Publication date Oct 3, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE U...
- Publication number 20240301129
- Publication date Sep 12, 2024
- Henkel AG & Co. KGaA
- Chunlin He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240297088
- Publication date Sep 5, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290673
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240282731
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282657
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE U...
- Publication number 20240279517
- Publication date Aug 22, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Kenji TOKUHISA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240274442
- Publication date Aug 15, 2024
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266246
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICA POWDER IN WHICH AGGREGATION IS REDUCED, RESIN COMPOSITION, A...
- Publication number 20240254313
- Publication date Aug 1, 2024
- Denka Company Limited
- Teruhiro AIKYO
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240250062
- Publication date Jul 25, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RESIN COMPOSITION
- Publication number 20240240011
- Publication date Jul 18, 2024
- SUMITOMO BAKELITE CO., LTD.
- Jun YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT ENCAPSULATION RESIN COMPOSITION AND SEMICONDU...
- Publication number 20240239988
- Publication date Jul 18, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...
- Publication number 20240234227
- Publication date Jul 11, 2024
- INFINEON TECHNOLOGIES AG
- Martin MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20240222217
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPE...
- Publication number 20240209166
- Publication date Jun 27, 2024
- Henkel AG & Co. KGaA
- Jie Bai
- H01 - BASIC ELECTRIC ELEMENTS

containing a filler

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming ultra high density embed...

Liquid resin composition for sealing and electronic component appar...

Semiconductor package

Sealing resin composition

Package having an electronic component and an encapsulant encapsula...

Semiconductor device and manufacturing method thereof

Method of manufacturing an integrated fan-out package having fan-ou...

Chip packaging method and package structure

Reinforced semiconductor device packaging and associated systems an...

Semiconductor device and corresponding method of manufacture

Semiconductor package and method of fabricating the same

Assembly of stacked elements and method of producing the same

Package structure with bridge die laterally wrapped by insulating e...

Method for manufacturing package structure

Composite component and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Package structure and manufacturing method thereof

Chip protective film and method for manufacturing same, and chip

Semiconductor package and package-on-package including the same

Semiconductor device package having multi-layer molding compound an...

Hollow package and method for manufacturing same

Semiconductor package including high thermal conductivity layer

Die and package structure

Semiconductor package structure

Integrated circuit package and method

Resin composition, laminate, semiconductor wafer with resin composi...

Semiconductor device with leads having step surfaces

Package structure and method of manufacturing the same

Semiconductor package including mold layer and manufacturing method...

Resin composition, laminate, semiconductor wafer with resin composi...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...

METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES

TWO-DIMENSIONAL METAL CARBIDE, NITRIDE, AND CARBONITRIDE FILMS AND...

METHOD OF MANUFACTURING AN INTEGRATED FAN-OUT PACKAGE HAVING FAN-OU...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MEMORY SYSTEM

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...

PACKAGE WITH ENCAPSULANT AND FURTHER ENCAPSULANT THEREON

ASSEMBLY OF STACKED ELEMENTS AND METHOD OF PRODUCING THE SAME

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

Semiconductor Device and Method of Forming Interconnect Structure w...

LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE U...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE

ADHESIVE COMPOSITION AND FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE U...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SILICA POWDER IN WHICH AGGREGATION IS REDUCED, RESIN COMPOSITION, A...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

SEALING RESIN COMPOSITION

SEMICONDUCTOR ELEMENT ENCAPSULATION RESIN COMPOSITION AND SEMICONDU...

SEMICONDUCTOR DEVICES WITH EMBEDDED FILLER PARTICLES AND ASSOCIATED...

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER

RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPE...