containing a filler

Industry

CPC
H01L23/295

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/295containing a filler

Industries

Patents Grantslast 30 patents

Information Patent Grant
Compartmentalized shielding of a module utilizing self-shielded sub...
- Patent number 12,342,518
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an encapsulant
- Patent number 12,341,118
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Seungwan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,315,771
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method for manufacturing same
- Patent number 12,300,628
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having heterogeneous dielectric layers
- Patent number 12,266,581
- Issue date Apr 1, 2025
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for curable resins, cured product of said composition,...
- Patent number 12,258,472
- Issue date Mar 25, 2025
- ENEOS Corporation
- Yoshinori Nishitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,249,588
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sheet
- Patent number 12,247,124
- Issue date Mar 11, 2025
- Lintec Corporation
- Yasutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,243,792
- Issue date Mar 4, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package (CSP) semiconductor device having thin substrate
- Patent number 12,243,808
- Issue date Mar 4, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid compression molding or encapsulant compositions
- Patent number 12,187,843
- Issue date Jan 7, 2025
- Henkel AG & Co. KGaA
- Jay Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compounds and packages for encapsulating electronic components
- Patent number 12,152,133
- Issue date Nov 26, 2024
- Infineon Technologies AG
- Andreas Waterloo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid resin composition for sealing and electronic component appar...
- Patent number 12,131,970
- Issue date Oct 29, 2024
- Resonac Corporation
- Hidetoshi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package
- Patent number 12,132,009
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Su Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing resin composition
- Patent number 12,116,479
- Issue date Oct 15, 2024
- Sumitomo Bakelite Co., Ltd.
- Jun Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,113,029
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Tatsuto Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated fan-out package having fan-ou...
- Patent number 12,080,615
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor device packaging and associated systems an...
- Patent number 12,080,616
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Suresh K. Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,057,359
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Assembly of stacked elements and method of producing the same
- Patent number 12,046,524
- Issue date Jul 23, 2024
- TDK Corporation
- Yongfu Cai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250210433
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND APPLICATION THEREOF
- Publication number 20250206916
- Publication date Jun 26, 2025
- Huawei Technologies Co., Ltd
- Weina XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND PREPARATION METHOD AND DISCLOSURE THEREOF
- Publication number 20250206941
- Publication date Jun 26, 2025
- Huawei Technologies Co., Ltd
- Weina XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...
- Publication number 20250210451
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210430
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- DAE HYUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20250210452
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED BODY, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFAC...
- Publication number 20250197577
- Publication date Jun 19, 2025
- AGC Inc.
- Seigo KOTERA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE...
- Publication number 20250197628
- Publication date Jun 19, 2025
- SUMITOMO BAKELITE CO., LTD.
- Makoto MATSUO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICOND...
- Publication number 20250178245
- Publication date Jun 5, 2025
- Namics Corporation
- Yu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250183104
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183103
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunjung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE
- Publication number 20250174524
- Publication date May 29, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN FILM, PRINTED CIRCUIT BOARD, AND SEMICONDU...
- Publication number 20250174506
- Publication date May 29, 2025
- Resonac Corporation
- Hiroki KUZUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250174583
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Kazuya OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20250167062
- Publication date May 22, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT WITH ORGANIC CONSTITUENT AND INORGANIC CONSTITUENT HAVI...
- Publication number 20250157869
- Publication date May 15, 2025
- INFINEON TECHNOLOGIES AG
- Patrick SCHRÖDL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250149399
- Publication date May 8, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Junji FUJINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...
- Publication number 20250149527
- Publication date May 8, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149494
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CONFIGURATION FOR HIGH VOLTAGE GATE DRIVERS WITH A TRANSFORMER
- Publication number 20250140673
- Publication date May 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME
- Publication number 20250125281
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeongHwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250125207
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125205
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105209
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT WITH POROUS COLORANT FOR ELECTRONIC PACKAGE
- Publication number 20250096056
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Yosephine ANDRIANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096070
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive Heatable Particles in Semiconductor Module
- Publication number 20250096219
- Publication date Mar 20, 2025
- Fabian Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096063
- Publication date Mar 20, 2025
- MITSUBISHI ELECTRIC CORPORATION
- Seiu HIGASHIDE
- H01 - BASIC ELECTRIC ELEMENTS

containing a filler

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Compartmentalized shielding of a module utilizing self-shielded sub...

Semiconductor package including an encapsulant

Semiconductor module

Module and method for manufacturing same

Electronic substrates having heterogeneous dielectric layers

Semiconductor package having an encapulant comprising conductive fi...

Composition for curable resins, cured product of said composition,...

Semiconductor device and methods of manufacture

Resin sheet

Microelectronic structures including bridges

Chip scale package (CSP) semiconductor device having thin substrate

Cured product and production method of same, and resin sheet and re...

Electronic device

Semiconductor device and method of manufacturing the same

Liquid compression molding or encapsulant compositions

Thermal conductive film

Package structure and method of manufacturing the same

Mold compounds and packages for encapsulating electronic components

Semiconductor device and method of forming ultra high density embed...

Liquid resin composition for sealing and electronic component appar...

Semiconductor package

Sealing resin composition

Package having an electronic component and an encapsulant encapsula...

Semiconductor device and manufacturing method thereof

Method of manufacturing an integrated fan-out package having fan-ou...

Chip packaging method and package structure

Reinforced semiconductor device packaging and associated systems an...

Semiconductor device and corresponding method of manufacture

Semiconductor package and method of fabricating the same

Assembly of stacked elements and method of producing the same

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

RESIN COMPOSITION AND APPLICATION THEREOF

RESIN COMPOSITION AND PREPARATION METHOD AND DISCLOSURE THEREOF

PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

LAYERED BODY, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFAC...

RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE...

LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICOND...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE

RESIN COMPOSITION, RESIN FILM, PRINTED CIRCUIT BOARD, AND SEMICONDU...

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

ENCAPSULANT WITH ORGANIC CONSTITUENT AND INORGANIC CONSTITUENT HAVI...

POWER MODULE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INTERMEDIATE, REDISTRI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE CONFIGURATION FOR HIGH VOLTAGE GATE DRIVERS WITH A TRANSFORMER

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

ENCAPSULANT WITH POROUS COLORANT FOR ELECTRONIC PACKAGE

SEMICONDUCTOR MODULE

Inductive Heatable Particles in Semiconductor Module

SEMICONDUCTOR DEVICE