covering only the central area of the surface to be connected

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H01L2224/29036

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29036covering only the central area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,784,224
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,692,792
- Issue date Jun 23, 2020
- Denso Corporation
- Hirohito Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method
- Patent number 10,522,504
- Issue date Dec 31, 2019
- STMicroelectronics S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with underfill control features, and associat...
- Patent number 10,424,553
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant micro device transfer head
- Patent number 9,895,902
- Issue date Feb 20, 2018
- Apple Inc.
- Andreas Bibl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,698,072
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,589,880
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in electronic devices with yielding substrates
- Patent number 9,583,691
- Issue date Feb 28, 2017
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,502,370
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor element and a fixed...
- Patent number 9,437,520
- Issue date Sep 6, 2016
- Toyota Jidosha Kabushiki Kaisha
- Norimune Orimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant micro device transfer head
- Patent number 9,370,864
- Issue date Jun 21, 2016
- Apple Inc.
- Andreas Bibl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,373,559
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 9,324,676
- Issue date Apr 26, 2016
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for height registration during chip bonding
- Patent number 9,324,682
- Issue date Apr 26, 2016
- Skorpios Technologies, Inc.
- Elton Marchena
- G02 - OPTICS
Information Patent Grant
Thermal management in electronic devices with yielding substrates
- Patent number 9,324,930
- Issue date Apr 26, 2016
- Cooledge Lighting, Inc.
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips having improved solidity, semiconductor package...
- Patent number 9,324,686
- Issue date Apr 26, 2016
- SK hynix Inc.
- Jong Hyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 9,281,287
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, method of mounting semiconductor chip, and sol...
- Patent number 9,245,829
- Issue date Jan 26, 2016
- Omron Corporation
- Shintaro Hara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and power source device
- Patent number 9,082,756
- Issue date Jul 14, 2015
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,059,143
- Issue date Jun 16, 2015
- J-DEVICES CORPORATION
- Yukari Imaizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 9,006,029
- Issue date Apr 14, 2015
- Kabushiki Kaisha Toshiba
- Yukio Katamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a graphene sheet to metal contact bumps of...
- Patent number 8,974,617
- Issue date Mar 10, 2015
- IMEC
- Yu-Hsiang Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, photosensitive resin composition...
- Patent number 8,946,852
- Issue date Feb 3, 2015
- Toray Industries, Inc.
- Hiroyuki Niwa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor bonding structure and process
- Patent number 8,878,355
- Issue date Nov 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20190371755
- Publication date Dec 5, 2019
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...
- Publication number 20180122762
- Publication date May 3, 2018
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD
- Publication number 20170125371
- Publication date May 4, 2017
- STMicroelectronics S.r.l.
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160027714
- Publication date Jan 28, 2016
- Toyota Jidosha Kabushiki Kaisha
- Norimune ORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR HEIGHT REGISTRATION DURING CHIP BONDING
- Publication number 20140319656
- Publication date Oct 30, 2014
- Skorpios Technologies, Inc.
- Elton Marchena
- G02 - OPTICS
Information Patent Application
POWER ELECTRONICS MODULES WITH SOLDER LAYERS HAVING REDUCED THERMAL...
- Publication number 20140291696
- Publication date Oct 2, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shuhei Horimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
- Publication number 20140264427
- Publication date Sep 18, 2014
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE
- Publication number 20140203444
- Publication date Jul 24, 2014
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...
- Publication number 20140166194
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structure and Process
- Publication number 20140117510
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, METHOD OF MOUNTING SEMICONDUCTOR CHIP, AND SOL...
- Publication number 20140077375
- Publication date Mar 20, 2014
- Omron Corporation
- Shintaro Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...
- Publication number 20140015115
- Publication date Jan 16, 2014
- SK HYNIX INC.
- Jong Hyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT MICRO DEVICE TRANSFER HEAD
- Publication number 20130300812
- Publication date Nov 14, 2013
- Andreas Bibl
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20130217182
- Publication date Aug 22, 2013
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...
- Publication number 20130214379
- Publication date Aug 22, 2013
- TORAY INDUSTRIES, INC.
- Hiroyuki Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130193588
- Publication date Aug 1, 2013
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP...
- Publication number 20130181339
- Publication date Jul 18, 2013
- Mars Technology
- Wenjun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA
- Publication number 20130037948
- Publication date Feb 14, 2013
- MAXIM INTEGRATED PRODUCTS, INC.
- Arkadii V. Samoilov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
- Publication number 20130010436
- Publication date Jan 10, 2013
- Hidenobu Nishikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20120211901
- Publication date Aug 23, 2012
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS AND METHOD FOR MAKI...
- Publication number 20120175767
- Publication date Jul 12, 2012
- Advanced Semiconductor Engineering, Inc.
- Chia-Lin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE DOWN DEVICE WITH THERMAL CONNECTOR
- Publication number 20120126396
- Publication date May 24, 2012
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package device with a heat dissipation structure and...
- Publication number 20120104581
- Publication date May 3, 2012
- Global Unichip Corporation
- Chia-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20120052627
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Yukio KATAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120025367
- Publication date Feb 2, 2012
- TOSHIBA CORPORATION
- Yukari IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGE WITH CENTER CONDUCTIVE MASS
- Publication number 20100289145
- Publication date Nov 18, 2010
- Jayprakash Vijay Chipalkatti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20100237510
- Publication date Sep 23, 2010
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS

covering only the central area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method

Method for transferring and placing a semiconductor device on a sub...

Semiconductor device and method

Semiconductor devices with underfill control features, and associat...

Electronic device

Semiconductor device and corresponding method

Semiconductor devices with underfill control features, and associat...

Method for coating conductive substrate with adhesive

Compliant micro device transfer head

Method for producing structured sintered connection layers, and sem...

Low-stress dual underfill packaging

Method for processing a wafer and wafer structure

Thermal management in electronic devices with yielding substrates

Semiconductor bonding structure and process

Semiconductor device including a semiconductor element and a fixed...

Interposer package-on-package structure

Compliant micro device transfer head

Low-stress dual underfill packaging

Packaged microelectronic devices and methods for manufacturing pack...

Method and system for height registration during chip bonding

Thermal management in electronic devices with yielding substrates

Semiconductor chips having improved solidity, semiconductor package...

Semiconductor bonding structure and process

Substrate structure, method of mounting semiconductor chip, and sol...

Semiconductor device and power source device

Semiconductor device

Method for manufacturing semiconductor devices

Method for transferring a graphene sheet to metal contact bumps of...

Photosensitive resin composition, photosensitive resin composition...

Semiconductor bonding structure and process

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIAT...

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

SEMICONDUCTOR DEVICE

METHOD AND SYSTEM FOR HEIGHT REGISTRATION DURING CHIP BONDING

POWER ELECTRONICS MODULES WITH SOLDER LAYERS HAVING REDUCED THERMAL...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES

Method for Producing Structured Sintered Connection Layers, and Sem...

SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE

METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...

Semiconductor Bonding Structure and Process

SUBSTRATE STRUCTURE, METHOD OF MOUNTING SEMICONDUCTOR CHIP, AND SOL...

SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGE...

COMPLIANT MICRO DEVICE TRANSFER HEAD

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...

SEMICONDUCTOR PACKAGE

MULTI-CHIP SELF-ALIGNMENT ASSEMBLY WHICH CAN BE USED WITH FLIP-CHIP...

SEMICONDUCTOR DEVICE HAVING A THROUGH-SUBSTRATE VIA

CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS AND METHOD FOR MAKI...

DIE DOWN DEVICE WITH THERMAL CONNECTOR

Semiconductor package device with a heat dissipation structure and...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

WAFER CHIP SCALE PACKAGE WITH CENTER CONDUCTIVE MASS

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...