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H01L2224/4117

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4117Crossed straps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,274
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-clip structure for die bonding
- Patent number 11,189,592
- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,770,400
- Issue date Sep 8, 2020
- Kabushiki Kaisha Toyota Jidoshokki
- Naoki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module including multiple signal wiring patterns disposed on...
- Patent number 10,734,911
- Issue date Aug 4, 2020
- Rohm Co., Ltd.
- Tatsuya Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and conductive member for semiconductor module...
- Patent number 10,475,667
- Issue date Nov 12, 2019
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 9,905,500
- Issue date Feb 27, 2018
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out pop stacking process
- Patent number 9,754,924
- Issue date Sep 5, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 9,443,760
- Issue date Sep 13, 2016
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,397,030
- Issue date Jul 19, 2016
- NSK Ltd.
- Takashi Sunaga
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Fan-out PoP stacking process
- Patent number 9,379,097
- Issue date Jun 28, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 9,362,219
- Issue date Jun 7, 2016
- Mitsubishi Electric Corporation
- Tatsuya Kawase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,117,811
- Issue date Aug 25, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip power semiconductor device
- Patent number 8,916,968
- Issue date Dec 23, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor component and structure th...
- Patent number 8,582,317
- Issue date Nov 12, 2013
- Semiconductor Components Industries, LLC
- Yenting Wen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
- Publication number 20240120308
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME
- Publication number 20240105703
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
- Publication number 20220320032
- Publication date Oct 6, 2022
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220320054
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Hiroyuki SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Clip Bond Having Multipl...
- Publication number 20220208716
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Hyung Mook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
- Publication number 20220208686
- Publication date Jun 30, 2022
- UTAC Headquarters Pte. Ltd.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210202429
- Publication date Jul 1, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Clip Structure for Die Bonding
- Publication number 20200105707
- Publication date Apr 2, 2020
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20200035656
- Publication date Jan 30, 2020
- ROHM CO., LTD.
- Tatsuya MIYAZAKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20170025336
- Publication date Jan 26, 2017
- Semiconductor Components Industries, LLC
- Balaji Padmanabhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip Power Semiconductor Device
- Publication number 20130256856
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR...
- Publication number 20120112308
- Publication date May 10, 2012
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
- Publication number 20110292632
- Publication date Dec 1, 2011
- Yenting Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT
- Publication number 20080088008
- Publication date Apr 17, 2008
- Samsung Electronics Co., Ltd.
- Hyun-A KIM
- H01 - BASIC ELECTRIC ELEMENTS

Crossed straps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Electronic module

Multi-clip structure for die bonding

Semiconductor module

Power module including multiple signal wiring patterns disposed on...

Semiconductor module and conductive member for semiconductor module...

Semiconductor component and method of manufacture

Sintered conductive matrix material on wire bond

Fan-out pop stacking process

Multichip power semiconductor device

Flip chip assembly and process with sintering material on metal bumps

Semiconductor module

Fan-out PoP stacking process

Semiconductor module and semiconductor device

Flip chip assembly and process with sintering material on metal bumps

Multichip power semiconductor device

Method for manufacturing a semiconductor component and structure th...

Patents Applicationslast 30 patents

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Clip Bond Having Multipl...

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

ELECTRONIC MODULE

Multi-Clip Structure for Die Bonding

POWER MODULE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Semiconductor Device and Manufacturing Method Thereof

Multichip Power Semiconductor Device

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR...

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...

SEMICONDUCTOR PACKAGE HAVING PAD ARRANGEMENT