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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L23/5381
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic package
Patent number
12,368,104
Issue date
Jul 22, 2025
Advanced Semiconductor Engineering, Inc.
Hung-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Supporting InFO packages to reduce warpage
Patent number
12,368,115
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Parameter exchange for a die-to-die interconnect
Patent number
12,360,934
Issue date
Jul 15, 2025
Intel Corporation
Debendra Das Sharma
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of making a fan-out semiconductor assembly with an intermedi...
Patent number
12,362,322
Issue date
Jul 15, 2025
Deca Technologies USA, Inc.
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with redistribution structure and method for f...
Patent number
12,354,965
Issue date
Jul 8, 2025
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package comprising a substrate and a high-density interconnect inte...
Patent number
12,355,000
Issue date
Jul 8, 2025
QUALCOMM Incorporated
Yangyang Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
Patent number
12,354,883
Issue date
Jul 8, 2025
Intel Corporation
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
Patent number
12,354,963
Issue date
Jul 8, 2025
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under chip bridge
Patent number
12,354,964
Issue date
Jul 8, 2025
FRONTGRADE TECHNOLOGIES INC.
Sean Thorne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with flipped high bandwidth memory device
Patent number
12,347,780
Issue date
Jul 1, 2025
Intel Corporation
Krishna Vasanth Valavala
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Logic die in a multi-chip package having a configurable physical in...
Patent number
12,347,818
Issue date
Jul 1, 2025
Intel Corporation
Narasimha Lanka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing semiconductor devices
Patent number
12,341,104
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus to reduce defects in interconnects between se...
Patent number
12,341,117
Issue date
Jun 24, 2025
Intel Corporation
Kyle McElhinny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board
Patent number
12,336,098
Issue date
Jun 17, 2025
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Jae Woong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and manufacturing method thereof
Patent number
12,334,452
Issue date
Jun 17, 2025
Siliconware Precision Industries Co., Ltd.
Chao-Chiang Pu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for forming the same
Patent number
12,334,444
Issue date
Jun 17, 2025
Mediatek Inc.
Po-Hao Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Soldered metallic reservoirs for enhanced transient and steady-stat...
Patent number
12,334,453
Issue date
Jun 17, 2025
Intel Corporation
Nicholas Neal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
Patent number
12,334,443
Issue date
Jun 17, 2025
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lithographically defined vertical interconnect access (VIA) for a b...
Patent number
12,334,447
Issue date
Jun 17, 2025
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture for computing system package
Patent number
12,327,796
Issue date
Jun 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with underfill containment barrier
Patent number
12,327,773
Issue date
Jun 10, 2025
Intel Corporation
Rahul Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die coupling using a substrate with a glass core
Patent number
12,327,794
Issue date
Jun 10, 2025
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waveguide interconnect bridges
Patent number
12,327,795
Issue date
Jun 10, 2025
Intel Corporation
Georgios Dogiamis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures to increase substrate routing density and methods of for...
Patent number
12,308,321
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company Limited
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,308,336
Issue date
May 20, 2025
Samsung Electronics Co., Ltd.
Jungho Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package
Patent number
12,308,308
Issue date
May 20, 2025
Siliconware Precision Industries Co., Ltd.
Sung-Hua Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die interconnect substrate, an electrical device and a method for f...
Patent number
12,300,613
Issue date
May 13, 2025
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conformal power delivery structure for direct chip attach architect...
Patent number
12,288,750
Issue date
Apr 29, 2025
Intel Corporation
William J. Lambert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and manufacturing method thereof
Patent number
12,278,189
Issue date
Apr 15, 2025
Siliconware Precision Industries Co., Ltd.
Yu-Lung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous nested interposer package for IC chips
Patent number
12,272,656
Issue date
Apr 8, 2025
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20250226323
Publication date
Jul 10, 2025
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
Publication number
20250218953
Publication date
Jul 3, 2025
Intel Corporation
Zhixin Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPACER FOR EMBEDDED COMPONENT IN CORE
Publication number
20250218952
Publication date
Jul 3, 2025
Intel Corporation
Benjamin DUONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Package and Manufacturing Method Thereof
Publication number
20250210527
Publication date
Jun 26, 2025
Siliconware Precision Industries Co., Ltd.
Yu-Lung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
Publication number
20250201734
Publication date
Jun 19, 2025
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH CRACK-HEALING MATERIALS FOR GLASS C...
Publication number
20250201732
Publication date
Jun 19, 2025
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...
Publication number
20250201720
Publication date
Jun 19, 2025
Intel Corporation
Minglu Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES F...
Publication number
20250192017
Publication date
Jun 12, 2025
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250192131
Publication date
Jun 12, 2025
Samsung Electronics Co., Ltd.
DOOHWAN LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...
Publication number
20250192070
Publication date
Jun 12, 2025
Intel Corporation
Jesse C. Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
Publication number
20250192019
Publication date
Jun 12, 2025
Samsung Electronics Co., Ltd.
Byung Ho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
Publication number
20250192059
Publication date
Jun 12, 2025
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BRIDGE DIE IN SUBSTRATE CORE LAYER
Publication number
20250183178
Publication date
Jun 5, 2025
QUALCOMM Incorporated
Joan Rey Villarba BUOT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
Publication number
20250183180
Publication date
Jun 5, 2025
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
Publication number
20250183179
Publication date
Jun 5, 2025
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250183239
Publication date
Jun 5, 2025
Siliconware Precision Industries Co., Ltd.
Yi-Min Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Molded Silicon on Passive Package
Publication number
20250183127
Publication date
Jun 5, 2025
Apple Inc.
Kumar Nagarajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250174564
Publication date
May 29, 2025
Fuji Electric Co., Ltd.
Kazuya OKADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
Publication number
20250174539
Publication date
May 29, 2025
nD-HI Technologies Lab, Inc.
HO-MING TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Scalable Large System Based on Organic Interconnect
Publication number
20250157936
Publication date
May 15, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250149508
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
Jeonil Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250149401
Publication date
May 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Methods of Making and Using Pre-Molded Bri...
Publication number
20250149454
Publication date
May 8, 2025
STATS ChipPAC Pte Ltd.
Linda Pei Ee Chua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250149460
Publication date
May 8, 2025
Samsung Electronics Co., Ltd.
CHOONGBIN YIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...
Publication number
20250149455
Publication date
May 8, 2025
Intel Corporation
Nicholas Haehn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE WITH A CIRCUIT CARRIER
Publication number
20250140663
Publication date
May 1, 2025
ROBERT BOSCH GmbH
Irfan AYDOGMUS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP STACKING STRUCTURE
Publication number
20250140743
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED ELECTRONIC MODULE WITH LAMINATED BRIDGE ASSEMBLY
Publication number
20250140699
Publication date
May 1, 2025
Analog Devices, Inc.
Hien Minh Pham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250132296
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...
Publication number
20250125268
Publication date
Apr 17, 2025
Intel Corporation
Jianyong XIE
H01 - BASIC ELECTRIC ELEMENTS