Crossover interconnections

Industry

CPC
H01L23/5381

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5381Crossover interconnections

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Conformal power delivery structure for direct chip attach architect...
- Patent number 12,288,750
- Issue date Apr 29, 2025
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,278,189
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with substrate cavity for bridge-attach
- Patent number 12,272,650
- Issue date Apr 8, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated photonics and processor package with redistribution laye...
- Patent number 12,266,608
- Issue date Apr 1, 2025
- Intel Corporation
- Susheel Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,261,124
- Issue date Mar 25, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and display unit
- Patent number 12,249,597
- Issue date Mar 11, 2025
- Osram Opto Semiconductors GmbH
- Sebastian Wittmann
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,243,824
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate structure and manufacturing method thereof
- Patent number 12,243,838
- Issue date Mar 4, 2025
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 12,243,812
- Issue date Mar 4, 2025
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive vias for electronic substrates
- Patent number 12,243,825
- Issue date Mar 4, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable large system based on organic interconnect
- Patent number 12,237,269
- Issue date Feb 25, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,230,605
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor structure with same
- Patent number 12,224,244
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hailin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,224,245
- Issue date Feb 11, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with metallic layer over the surfaces of a plural...
- Patent number 12,224,224
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB architecture with dedicated metal layers for improving power d...
- Patent number 12,218,063
- Issue date Feb 4, 2025
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded silicon interconnects in bridges for integrated-circuit pack...
- Patent number 12,218,064
- Issue date Feb 4, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and power supply module
- Patent number 12,211,827
- Issue date Jan 28, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,939
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,199,048
- Issue date Jan 14, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interconnects in bridges for integrated-circuit packages
- Patent number 12,183,722
- Issue date Dec 31, 2024
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having bridge structure for connection between se...
- Patent number 12,183,681
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,176,291
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE WITH A CIRCUIT CARRIER
- Publication number 20250140663
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE
- Publication number 20250140743
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC MODULE WITH LAMINATED BRIDGE ASSEMBLY
- Publication number 20250140699
- Publication date May 1, 2025
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132296
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...
- Publication number 20250125268
- Publication date Apr 17, 2025
- Intel Corporation
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20250118649
- Publication date Apr 10, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...
- Publication number 20250112161
- Publication date Apr 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TEC...
- Publication number 20250112204
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEAVED POWER DELIVERY TO 3D DIE COMPLEXES ABOVE BRIDGE CHIPLET...
- Publication number 20250112160
- Publication date Apr 3, 2025
- Intel Corporation
- Andrew P. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE BRIDGE CHIPS CONNECTING TWO SEMICONDUCTOR CHIPS WITH STAC...
- Publication number 20250112203
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20250105136
- Publication date Mar 27, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...
- Publication number 20250105156
- Publication date Mar 27, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS
- Publication number 20250096207
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTIC BRIDGE CHIPS FOR CHIP-TO-CHIP COMMUNICATION
- Publication number 20250096142
- Publication date Mar 20, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jae Kyu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH SAME
- Publication number 20250096144
- Publication date Mar 20, 2025
- Changxin Memory Technologies, Inc.
- Hailin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATIO...
- Publication number 20250096143
- Publication date Mar 20, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...
- Publication number 20250087564
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087603
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES
- Publication number 20250087587
- Publication date Mar 13, 2025
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250070075
- Publication date Feb 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Yang CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20250070030
- Publication date Feb 27, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE
- Publication number 20250062296
- Publication date Feb 20, 2025
- DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...
- Publication number 20250062306
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS
- Publication number 20250062206
- Publication date Feb 20, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES
- Publication number 20250054823
- Publication date Feb 13, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING A LEAD FRAME THAT PROVIDES SUBSTRATE SUPPORT AN...
- Publication number 20250054840
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE
- Publication number 20250046720
- Publication date Feb 6, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Crossover interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conformal power delivery structure for direct chip attach architect...

Electronic package and manufacturing method thereof

Heterogeneous nested interposer package for IC chips

Microelectronic package with substrate cavity for bridge-attach

Integrated photonics and processor package with redistribution laye...

Embedded die architecture and method of making

Display device and display unit

Semiconductor devices and methods of manufacture

Circuit substrate structure and manufacturing method thereof

Alternative surfaces for conductive pad layers of silicon bridges f...

Hybrid conductive vias for electronic substrates

Scalable large system based on organic interconnect

Package substrate z-disaggregation with liquid metal interconnects

Semiconductor package and manufacturing method thereof

Package substrate and semiconductor structure with same

Embedded die architecture and method of making

Package structure with metallic layer over the surfaces of a plural...

EMIB architecture with dedicated metal layers for improving power d...

Molded silicon interconnects in bridges for integrated-circuit pack...

Power supply system and power supply module

Semiconductor packages and methods of forming the same

Semiconductor package

Die to die high-speed communication without discrete amplifiers bet...

Heterogeneous nested interposer package for IC chips

Interposer structure containing embedded silicon-less link chiplet

Multi-chip packaging

Electrical bridge package with integrated off-bridge photonic chann...

Molded interconnects in bridges for integrated-circuit packages

Package structure having bridge structure for connection between se...

Electronic package and manufacturing method thereof

Patents Applicationslast 30 patents

POWER MODULE WITH A CIRCUIT CARRIER

CHIP STACKING STRUCTURE

INTEGRATED ELECTRONIC MODULE WITH LAMINATED BRIDGE ASSEMBLY

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...

Method for Forming Semiconductor Package and Semiconductor Package

METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...

DISAGGREGATED PROCESSOR ARCHITECTURES USING SELECTIVE TRANSFER TEC...

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

INTERLEAVED POWER DELIVERY TO 3D DIE COMPLEXES ABOVE BRIDGE CHIPLET...

DUAL-SIDE BRIDGE CHIPS CONNECTING TWO SEMICONDUCTOR CHIPS WITH STAC...

CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE COUPLED TO A GLAS...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

PACKAGE COMPRISING A BRIDGE LOCATED BETWEEN METALLIZATION PORTIONS

ELECTRO-OPTIC BRIDGE CHIPS FOR CHIP-TO-CHIP COMMUNICATION

PACKAGE SUBSTRATE AND SEMICONDUCTOR STRUCTURE WITH SAME

MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATIO...

SEMICONDUCTOR PACKAGE WITH LATERALLY CONFINED SUBSTRATE AND METHODS...

SEMICONDUCTOR PACKAGE

EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE

COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...

PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS

METHODS AND APPARATUS TO MITIGATE CRACKING IN GLASS CORES

POWER MODULE HAVING A LEAD FRAME THAT PROVIDES SUBSTRATE SUPPORT AN...

High Density 3D Interconnect Configuration

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE