Crossover interconnections

Industry

CPC
H01L23/5381

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5381Crossover interconnections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB patch on glass laminate substrate
- Patent number 12,148,703
- Issue date Nov 19, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless architecture and processing strategy for EMIB-based substr...
- Patent number 12,142,567
- Issue date Nov 12, 2024
- Intel Corporation
- Xiao Di Sun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating pedestal based memory devices using pocket in...
- Patent number 12,142,310
- Issue date Nov 12, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with embedded programmable logic
- Patent number 12,135,660
- Issue date Nov 5, 2024
- Altera Corporation
- Arifur Rahman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,132,003
- Issue date Oct 29, 2024
- Siliconware Precision Industries Co., Ltd.
- You-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,125,793
- Issue date Oct 22, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method forming same
- Patent number 12,125,833
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices
- Patent number 12,127,401
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Christopher J. Larsen
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,119,326
- Issue date Oct 15, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonded interconnect bridging
- Patent number 12,107,075
- Issue date Oct 1, 2024
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,100,672
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-forwarding bridge for inter-chip data signal transfer
- Patent number 12,100,662
- Issue date Sep 24, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 12,094,825
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die microelectronic device with molded component
- Patent number 12,087,700
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fan-out architecture with EMIB and glass core for heterogene...
- Patent number 12,087,695
- Issue date Sep 10, 2024
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 12,080,690
- Issue date Sep 3, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 12,062,616
- Issue date Aug 13, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with thick RDLs and thin RDLs stacked alternatingly
- Patent number 12,057,405
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,051,649
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch translation architecture for semiconductor package including...
- Patent number 12,051,647
- Issue date Jul 30, 2024
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 12,046,568
- Issue date Jul 23, 2024
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of very high density routing used with embedded m...
- Patent number 12,040,276
- Issue date Jul 16, 2024
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,033,946
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,033,978
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387359
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240387385
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240379572
- Publication date Nov 14, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240371791
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...
- Publication number 20240371774
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD FORMING SAME
- Publication number 20240371843
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355802
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
- Publication number 20240355754
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240355744
- Publication date Oct 24, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20240355745
- Publication date Oct 24, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE
- Publication number 20240355746
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20240347457
- Publication date Oct 17, 2024
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240347466
- Publication date Oct 17, 2024
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BRIDGE CIRCUITRY DESIGNS FOR INTEGRATED CIRCUIT PACKAG...
- Publication number 20240332193
- Publication date Oct 3, 2024
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240332192
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-I WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20240332202
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE T...
- Publication number 20240332195
- Publication date Oct 3, 2024
- Intel Corporation
- Naiya SOETAN-DODD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD
- Publication number 20240332236
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shenggao LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240332256
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED...
- Publication number 20240321754
- Publication date Sep 26, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321848
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING GLASS CORE SUBSTRATE AND METHOD OF...
- Publication number 20240321755
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20240321785
- Publication date Sep 26, 2024
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240321753
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE
- Publication number 20240321752
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS
- Publication number 20240312919
- Publication date Sep 19, 2024
- Intel Corporation
- Pezhman MONADGEMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-L...
- Publication number 20240304545
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS

Crossover interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical interconnect bridge

EMIB patch on glass laminate substrate

Coreless architecture and processing strategy for EMIB-based substr...

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Method of fabricating pedestal based memory devices using pocket in...

Integrated circuit device with embedded programmable logic

Bridge interconnection with layered interconnect structures

Electronic package and manufacturing method thereof

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Method for forming semiconductor package and semiconductor package

Integrated circuit package and method forming same

Methods of forming microelectronic devices

Microelectronic structures including bridges

Multi-chip package and method of providing die-to-die interconnects...

Hybrid bonded interconnect bridging

Semiconductor device and method of manufacture

Power-forwarding bridge for inter-chip data signal transfer

Interconnection between chips by bridge chip

High density interconnect device and method

Embedded die microelectronic device with molded component

Hybrid fan-out architecture with EMIB and glass core for heterogene...

Micro assembled LED displays and lighting elements

Power delivery for embedded bridge die utilizing trench structures

Packages with thick RDLs and thin RDLs stacked alternatingly

Architecture for computing system package

Pitch translation architecture for semiconductor package including...

Capacitor die embedded in package substrate for providing capacitan...

Device and method of very high density routing used with embedded m...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR MODULE

Semiconductor Device and Method of Manufacture

PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...

INTEGRATED CIRCUIT PACKAGE AND METHOD FORMING SAME

SEMICONDUCTOR PACKAGE

PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE

PITCH TRANSLATION ARCHITECTURE FOR SEMICONDUCTOR PACKAGE INCLUDING...

SEMICONDUCTOR MODULE

INTERCONNECT BRIDGE CIRCUITRY DESIGNS FOR INTEGRATED CIRCUIT PACKAG...

PACKAGE STRUCTURE

PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME

SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE T...

SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED...

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING GLASS CORE SUBSTRATE AND METHOD OF...

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE

INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS

COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-L...