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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L23/5381
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Patents Grants
last 30 patents
Information
Patent Grant
Interposer structures and methods for 2.5D and 3D packaging
Patent number
11,955,431
Issue date
Apr 9, 2024
Intel Corporation
Jenny Shio Yin Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture to manage FLI bump height delta and reliability needs...
Patent number
11,955,448
Issue date
Apr 9, 2024
Intel Corporation
Jung Kyu Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,955,442
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pedestal-based pocket integration process for embedded memory
Patent number
11,942,133
Issue date
Mar 26, 2024
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices
Patent number
11,935,836
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with underfill containment barrier
Patent number
11,935,805
Issue date
Mar 19, 2024
Intel Corporation
Rahul Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out packages and methods of forming the same
Patent number
11,929,319
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
Patent number
11,929,330
Issue date
Mar 12, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,923,307
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Patternable die attach materials and processes for patterning
Patent number
11,923,312
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,923,315
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sacrificial dielectric for lithographic via formation to enable via...
Patent number
11,908,821
Issue date
Feb 20, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die interconnect substrate, an electrical device and a method for f...
Patent number
11,901,296
Issue date
Feb 13, 2024
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices including embedded bridge interconnect stru...
Patent number
11,901,334
Issue date
Feb 13, 2024
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded die architecture and method of making
Patent number
11,901,248
Issue date
Feb 13, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,881,467
Issue date
Jan 23, 2024
Samsung Electronics Co., Ltd.
Jungho Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-on-wafer structure and fabrication method
Patent number
11,876,071
Issue date
Jan 16, 2024
ZHEJIANG LAB
Weihao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power supply system
Patent number
11,876,084
Issue date
Jan 16, 2024
Delta Electronics (Shanghai) Co., Ltd.
Pengkai Ji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scalable high speed high bandwidth IO signaling package architectur...
Patent number
11,869,842
Issue date
Jan 9, 2024
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacture
Patent number
11,854,983
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro assembled LED displays and lighting elements
Patent number
11,854,788
Issue date
Dec 26, 2023
X Display Company Technology Limited
Christopher Bower
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Ferroelectric memory device integrated with a transition electrode
Patent number
11,854,593
Issue date
Dec 26, 2023
Kepler Computing Inc.
Noriyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bridge chip with through via
Patent number
11,848,273
Issue date
Dec 19, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,848,294
Issue date
Dec 19, 2023
Intel Corporation
Christoph Kutter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection between chips by bridge chip
Patent number
11,848,272
Issue date
Dec 19, 2023
International Business Machines Corporation
Akihiro Horibe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
Patent number
11,848,259
Issue date
Dec 19, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power delivery for embedded bridge die utilizing trench structures
Patent number
11,837,549
Issue date
Dec 5, 2023
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Creating interconnects between dies using a cross-over die and thro...
Patent number
11,830,817
Issue date
Nov 28, 2023
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous nested interposer package for IC chips
Patent number
11,824,018
Issue date
Nov 21, 2023
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
Publication number
20240145393
Publication date
May 2, 2024
Ankur AGGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Publication number
20240136292
Publication date
Apr 25, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
Publication number
20240128138
Publication date
Apr 18, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS NESTED INTERPOSER PACKAGE FOR IC CHIPS
Publication number
20240128205
Publication date
Apr 18, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGING
Publication number
20240128256
Publication date
Apr 18, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS
Publication number
20240128181
Publication date
Apr 18, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240128194
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
Publication number
20240120305
Publication date
Apr 11, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE INCLUDING MEMORY BRIDGE DIE AND METHODS FOR FORMI...
Publication number
20240113030
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hiroki Noguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
Publication number
20240112965
Publication date
Apr 4, 2024
International Business Machines Corporation
Chinami Marushima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
Publication number
20240113006
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BR...
Publication number
20240113029
Publication date
Apr 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS
Publication number
20240105625
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Local Interconnect and Chiplet Integration
Publication number
20240105626
Publication date
Mar 28, 2024
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices and Methods of Manufacture
Publication number
20240105627
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
Publication number
20240105655
Publication date
Mar 28, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZAT...
Publication number
20240105688
Publication date
Mar 28, 2024
QUALCOMM Incorporated
Xia LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE
Publication number
20240105690
Publication date
Mar 28, 2024
DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
Pengkai JI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240105662
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Jungho SHIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAG...
Publication number
20240096808
Publication date
Mar 21, 2024
DAI NIPPON PRINTING CO., LTD.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...
Publication number
20240096836
Publication date
Mar 21, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...
Publication number
20240088047
Publication date
Mar 14, 2024
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT SYSTEM-LEVEL PACKAGING STRUCTURE AND PACKAGING METHOD
Publication number
20240088000
Publication date
Mar 14, 2024
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
Publication number
20240088052
Publication date
Mar 14, 2024
Intel Corporation
Bai NIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY F...
Publication number
20240087971
Publication date
Mar 14, 2024
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL INTEGRATION OF DIES IN AN INTEGRATED CIRCUIT DEVICE
Publication number
20240079335
Publication date
Mar 7, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240079336
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Hyun CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING GLASS INTERPOSER STRUCTURE WITH SEL...
Publication number
20240079334
Publication date
Mar 7, 2024
Intel Corporation
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING POWER DELIVERY ROUTED THROUGH A B...
Publication number
20240079337
Publication date
Mar 7, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL PACKAGE ARCHITECTURE WITH FACE DOWN BRIDGE DIES
Publication number
20240071933
Publication date
Feb 29, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS