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last 30 patents
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Patent Grant
Method for manufacturing a semiconductor substrate and device by bo...
Patent number
11,961,765
Issue date
Apr 16, 2024
Mitsubishi Electric Corporation
Shuichi Hiza
C30 - CRYSTAL GROWTH
Information
Patent Grant
Semiconductor apparatuses and methods involving diamond and GaN-bas...
Patent number
11,961,837
Issue date
Apr 16, 2024
The Board of Trustees of the Leland Stanford Junior University
Srabanti Chowdhury
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Composite substrate and method of producing the composite substrate...
Patent number
11,929,294
Issue date
Mar 12, 2024
Nichia Corporation
Masatsugu Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
Patent number
11,923,447
Issue date
Mar 5, 2024
Fujitsu Limited
Junya Yaita
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
Patent number
11,810,845
Issue date
Nov 7, 2023
OSRAM OLED GmbH
Jörg Erich Sorg
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of producing heat dissipation substrate and method of produc...
Patent number
11,799,065
Issue date
Oct 24, 2023
Nichia Corporation
Shoichi Yamada
B22 - CASTING POWDER METALLURGY
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Patent Grant
Method of manufacturing and modularizing assembled thermal manageme...
Patent number
11,702,736
Issue date
Jul 18, 2023
Korea Institute of Science and Technology
Jae Kap Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out interconnect integration processes and structures
Patent number
11,699,651
Issue date
Jul 11, 2023
Applied Materials, Inc.
Richard W. Plavidal
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device, semiconductor device fabrication method, and...
Patent number
11,688,663
Issue date
Jun 27, 2023
Fujitsu Limited
Shirou Ozaki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Composite member
Patent number
11,668,009
Issue date
Jun 6, 2023
Sumitomo Electric Industries, Ltd.
Kengo Goto
B22 - CASTING POWDER METALLURGY
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Patent Grant
Thermally and electrically conductive interconnects
Patent number
11,637,068
Issue date
Apr 25, 2023
GLOBALFOUNDRIES U.S. Inc.
Anthony K. Stamper
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Apparatuses and methods for implementing a sliding thermal interfac...
Patent number
11,626,342
Issue date
Apr 11, 2023
Cerebras Systems Inc.
Jean-Philippe Fricker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and heat distribution devices for thermal management of chi...
Patent number
11,600,548
Issue date
Mar 7, 2023
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Wireless transmitter with improved thermal management
Patent number
11,594,466
Issue date
Feb 28, 2023
Akash Systems, Inc.
Felix Ejeckam
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for producing a 3D semiconductor device and structure includ...
Patent number
11,574,818
Issue date
Feb 7, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,551,992
Issue date
Jan 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jhih-Yang Yan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for forming board assembly with chemical vapor deposition di...
Patent number
11,538,732
Issue date
Dec 27, 2022
Microchip Technology Caldicot Limited
Philip Andrew Swire
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for producing a 3D semiconductor device and structure includ...
Patent number
11,527,416
Issue date
Dec 13, 2022
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wireless communication system with improved thermal performance
Patent number
11,495,515
Issue date
Nov 8, 2022
Akash Systems, Inc.
Tyrone D. Mitchell
G01 - MEASURING TESTING
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Patent Grant
Chemical vapor deposition diamond (CVDD) wires for thermal transport
Patent number
11,488,888
Issue date
Nov 1, 2022
Microchip Technology Caldicot Limited
Philip Andrew Swire
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Thermal interface materials, 3D semiconductor packages and methods...
Patent number
11,482,465
Issue date
Oct 25, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including a diamond substrate and method of ma...
Patent number
11,482,464
Issue date
Oct 25, 2022
Mitsubishi Electric Corporation
Koji Yoshitsugu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selectively-pliable chemical vapor deposition (CVD) diamond or othe...
Patent number
11,476,178
Issue date
Oct 18, 2022
Raytheon Company
David H. Altman
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,430,667
Issue date
Aug 30, 2022
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,430,668
Issue date
Aug 30, 2022
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures and method for growing diamond layers
Patent number
11,348,858
Issue date
May 31, 2022
Imec VZW
Paulius Pobedinskas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-gain stable avalanche photo-diode formed within a first semico...
Patent number
11,282,971
Issue date
Mar 22, 2022
Applied Materials Israel Ltd.
Pavel Margulis
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Heat removal between top and bottom die interface
Patent number
11,276,667
Issue date
Mar 15, 2022
Intel Corporation
Yen Hsiang Chew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management package and method
Patent number
11,257,734
Issue date
Feb 22, 2022
Microchip Technology Inc.
Damian McCann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure
Patent number
11,257,689
Issue date
Feb 22, 2022
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...
Publication number
20240063076
Publication date
Feb 22, 2024
Intel Corporation
Mohammad Enamul Kabir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240063074
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
Publication number
20240063091
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20240047298
Publication date
Feb 8, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER
Publication number
20240047297
Publication date
Feb 8, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A TRANSISTOR WITH A HIGH DEGREE OF ELECTRON MO...
Publication number
20230420542
Publication date
Dec 28, 2023
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Elke MEISSNER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE FEATURES IN THERMALLY CONDUCTIVE MATERIALS
Publication number
20230420333
Publication date
Dec 28, 2023
Akash Systems, Inc.
Daniel FRANCIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIAMOND-METAL COMPOSITE HIGH POWER DEVICE PACKAGES
Publication number
20230352360
Publication date
Nov 2, 2023
MACOM Technology Solutions Holdings, Inc.
Quinn Don Martin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES
Publication number
20230352402
Publication date
Nov 2, 2023
Applied Materials, Inc.
Richard W. Plavidal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
Publication number
20230317545
Publication date
Oct 5, 2023
Intel Corporation
Pilin Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD
Publication number
20230307313
Publication date
Sep 28, 2023
Intel Corporation
Carlton Hanna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROEPITAXIAL STRUCTURE WITH A DIAMOND HEAT SINK
Publication number
20230307249
Publication date
Sep 28, 2023
Maksim Leonidovich ZANAVESKIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION
Publication number
20230290705
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chin LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL MATRIX COMPOSITE LAYERS FOR HEAT DISSIPATION FROM INTEGRATED...
Publication number
20230282542
Publication date
Sep 7, 2023
Intel Corporation
Wenhao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND...
Publication number
20230275001
Publication date
Aug 31, 2023
Fujitsu Limited
Shirou OZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230268243
Publication date
Aug 24, 2023
Huawei Technologies Co., Ltd
Bin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
Publication number
20230253288
Publication date
Aug 10, 2023
Intel Corporation
Abdulafeez Adebiyi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
Publication number
20230230896
Publication date
Jul 20, 2023
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Layer Semiconductor Material Structure and Preparation Method...
Publication number
20230230831
Publication date
Jul 20, 2023
INSTITUTE OF MICROELECTRONICS OF THE CHINES ACADEMY OF SCIENCES
Fengwen MU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAD Based Design of Heterogenous heat spreader
Publication number
20230214570
Publication date
Jul 6, 2023
Phononics Ltd
Shye Shapira
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
DIAMOND COMPOSITE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230170276
Publication date
Jun 1, 2023
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCINCE AND TECHNOLOGY
Takashi MATSUMAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE MATERIAL, HEAT SINK AND SEMICONDUCTOR DEVICE
Publication number
20230167528
Publication date
Jun 1, 2023
Sumitomo Electric Industries, Ltd.
Masatoshi MAJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...
Publication number
20230163043
Publication date
May 25, 2023
Huawei Technologies Co., Ltd
Ran HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIAMOND ENHANCED ADVANCED ICS AND ADVANCED IC PACKAGES
Publication number
20230154825
Publication date
May 18, 2023
nD-HI Technologies Lab,Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEPOSITION OF A THIN FILM NANOCRYSTALLINE DIAMOND ON A SUBSTRATE
Publication number
20230102356
Publication date
Mar 30, 2023
THE BOARD OF REGENTS FOR THE OKLAHOMA AGRICULTURAL AND MECHANICAL COLLEGES
Nirmal Govindaraju
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
NITRIDE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING NITRIDE S...
Publication number
20230083507
Publication date
Mar 16, 2023
Mitsubishi Electric Corporation
Yuki TAKIGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE INCLUD...
Publication number
20230043191
Publication date
Feb 9, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Power Module with Two Different Potting Materials and...
Publication number
20230014380
Publication date
Jan 19, 2023
Hans Hartung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLING OF HIGH POWER DEVICES USING SELECTIVE PATTERNED DIAMOND SUR...
Publication number
20220415671
Publication date
Dec 29, 2022
SOREQ NUCLEAR RESEARCH CENTER
Bruno Sfez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING
Publication number
20220415751
Publication date
Dec 29, 2022
CHUNG-ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
Hyoungsoon LEE
H01 - BASIC ELECTRIC ELEMENTS