directly combined with via connections

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CPC
H05K1/112

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/112directly combined with via connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer printed circuit board
- Patent number 12,213,254
- Issue date Jan 28, 2025
- JESS-LINK PRODUCTS CO., LTD.
- Yu-Liang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact arrangement and electronic assembly
- Patent number 12,191,242
- Issue date Jan 7, 2025
- Via Technologies, Inc.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,177,974
- Issue date Dec 24, 2024
- LG Innotek Co., Ltd
- Dong Hun Joung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and camera device comprising same
- Patent number 12,144,103
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Do Hyuk Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,120,815
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Auxiliary module for an electrical switching device, and associated...
- Patent number 12,111,358
- Issue date Oct 8, 2024
- Schneider Electric Industries SAS
- Flavien Dorlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,089,330
- Issue date Sep 10, 2024
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board comprising via portions
- Patent number 12,089,329
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of improving wire structure of circuit board and improving w...
- Patent number 12,089,347
- Issue date Sep 10, 2024
- Unimicron Technology Corp.
- Chun Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,082,338
- Issue date Sep 3, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package board, antenna package including the same and image display...
- Patent number 12,040,530
- Issue date Jul 16, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Na Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including shielding member
- Patent number 12,028,975
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Younggwon Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic switch module with oppositely-arranged power switches an...
- Patent number 12,010,799
- Issue date Jun 11, 2024
- BLACK & DECKER INC.
- Joshua M. Lewis
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Printed circuit board
- Patent number 12,004,292
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,997,901
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Splicing display screen
- Patent number 11,979,984
- Issue date May 7, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Changming Xiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting structure
- Patent number 11,950,366
- Issue date Apr 2, 2024
- TDK Corporation
- Kazuhiro Hagita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,943,877
- Issue date Mar 26, 2024
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and electronic device including the same
- Patent number 11,943,538
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hwajoong Jung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board
- Patent number 11,917,757
- Issue date Feb 27, 2024
- Murata Manufacturing Co., Ltd.
- Hiroki Maegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management in circuit board assemblies
- Patent number 11,910,520
- Issue date Feb 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,903,128
- Issue date Feb 13, 2024
- Ibiden Co., Ltd.
- Shigeto Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor module including the same
- Patent number 11,903,145
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seung-Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 11,871,524
- Issue date Jan 9, 2024
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240431024
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240422906
- Publication date Dec 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240422905
- Publication date Dec 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20240404978
- Publication date Dec 5, 2024
- Shinko Electric Industries Co., Ltd.
- Masaya Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240397619
- Publication date Nov 28, 2024
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...
- Publication number 20240304534
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Shu-Wei HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240298406
- Publication date Sep 5, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
- Publication number 20240292541
- Publication date Aug 29, 2024
- Black & Decker Inc.
- Joshua M. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDOSCOPE, PRINTED CIRCUIT BOARD OF AN ENDOSCOPE, AND METHOD FOR EL...
- Publication number 20240292524
- Publication date Aug 29, 2024
- OLYMPUS WINTER & IBE GMBH
- Martin WIETERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING...
- Publication number 20240264219
- Publication date Aug 8, 2024
- MPI Corporation
- SHIH-CHING CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...
- Publication number 20240222888
- Publication date Jul 4, 2024
- Huawei Technologies Co., Ltd
- Shuzhao Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT...
- Publication number 20240215163
- Publication date Jun 27, 2024
- Intel Corporation
- Onur OZKAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20240206048
- Publication date Jun 20, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
- Publication number 20240188212
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC DEVICE
- Publication number 20240179831
- Publication date May 30, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY SIGNAL TRANSMISSION DEVICE AND HIGH-FREQUENCY SIGNAL...
- Publication number 20240172360
- Publication date May 23, 2024
- Yamaichi Electronics Co., Ltd.
- Hiroshi TAKAHIRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240172368
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yun Je JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD TH...
- Publication number 20240121896
- Publication date Apr 11, 2024
- Unimicron Technology Corp.
- Chien Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL MODULE AND PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING AN...
- Publication number 20240098899
- Publication date Mar 21, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Subhashini BHARATH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240090140
- Publication date Mar 14, 2024
- FUJIKURA LTD.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATE AND POWER INTEGRATED CIRCUIT
- Publication number 20240074052
- Publication date Feb 29, 2024
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Gao Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20240061537
- Publication date Feb 22, 2024
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...
- Publication number 20240063110
- Publication date Feb 22, 2024
- CHUN-MING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240049388
- Publication date Feb 8, 2024
- Dexcom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

directly combined with via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-layer printed circuit board

Circuit board structure

Contact arrangement and electronic assembly

Wiring substrate and method for manufacturing wiring substrate

Circuit board

Printed circuit board and camera device comprising same

Multilayer substrate

Auxiliary module for an electrical switching device, and associated...

Circuit board structure and manufacturing method thereof

Wiring substrate

Printed circuit board comprising via portions

Method of improving wire structure of circuit board and improving w...

Printed wiring board

Package board, antenna package including the same and image display...

Electronic device including shielding member

Electronic switch module with oppositely-arranged power switches an...

Printed circuit board

Display apparatus having grooved terminals

Chiplets with connection posts

Splicing display screen

Electronic component mounting structure

Sensor interposer employing castellated through-vias

Circuit board structure and manufacturing method thereof

Camera module and electronic device including the same

Circuit board

Thermal management in circuit board assemblies

Wiring substrate

Wiring board and semiconductor module including the same

Manufacturing method of package structure

Component-incorporated substrate and method for manufacturing same

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...

SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

PRINTED CIRCUIT BOARD

REDUCED BALL GRID ARRAY PAD CAPACITANCE

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...

PRINTED WIRING BOARD

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...

ENDOSCOPE, PRINTED CIRCUIT BOARD OF AN ENDOSCOPE, AND METHOD FOR EL...

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING...

CONNECTOR, CONNECTOR PREPARATION METHOD, INTERCONNECTION SYSTEM, AN...

SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT...

Thermal Management in Circuit Board Assemblies

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING

ELECTRONIC MODULE AND ELECTRONIC DEVICE

CHIPLETS WITH CONNECTION POSTS

HIGH-FREQUENCY SIGNAL TRANSMISSION DEVICE AND HIGH-FREQUENCY SIGNAL...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD TH...

ELECTRICAL MODULE AND PRINTED CIRCUIT BOARD ASSEMBLY COMPRISING AN...

COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

INTEGRATED SUBSTRATE AND POWER INTEGRATED CIRCUIT

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS