directly combined with via connections

Industry

CPC
H05K1/112

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/112directly combined with via connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Coil structure
- Patent number 12,362,084
- Issue date Jul 15, 2025
- Cyntec Co., Ltd.
- Min-Feng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 12,356,556
- Issue date Jul 8, 2025
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 12,309,920
- Issue date May 20, 2025
- Ibiden Co., Ltd.
- Shogo Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter board and manufacturing method therefor, and board card con...
- Patent number 12,309,922
- Issue date May 20, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Lei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Power delivery network noise isolation in a computing device
- Patent number 12,267,946
- Issue date Apr 1, 2025
- QUALCOMM Incorporated
- Jason Gonzalez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board structure
- Patent number 12,256,488
- Issue date Mar 18, 2025
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rapid implementation of high-temperature analog interface electronics
- Patent number 12,256,493
- Issue date Mar 18, 2025
- Ian Getreu
- G01 - MEASURING TESTING
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Probe card device and circuit protection assembly thereof
- Patent number 12,243,703
- Issue date Mar 4, 2025
- Global Unichip Corporation
- Chih-Chieh Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and electronic device including the same
- Patent number 12,237,561
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jongwon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard trace ground via optimization for high-speed signaling
- Patent number 12,238,855
- Issue date Feb 25, 2025
- Dell Products L.P.
- Vijender Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 12,225,661
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer printed circuit board
- Patent number 12,213,254
- Issue date Jan 28, 2025
- JESS-LINK PRODUCTS CO., LTD.
- Yu-Liang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,200,861
- Issue date Jan 14, 2025
- Unimicron Technology Corp.
- Guang-Hwa Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact arrangement and electronic assembly
- Patent number 12,191,242
- Issue date Jan 7, 2025
- Via Technologies, Inc.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,177,974
- Issue date Dec 24, 2024
- LG Innotek Co., Ltd
- Dong Hun Joung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and camera device comprising same
- Patent number 12,144,103
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Do Hyuk Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,120,815
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Auxiliary module for an electrical switching device, and associated...
- Patent number 12,111,358
- Issue date Oct 8, 2024
- Schneider Electric Industries SAS
- Flavien Dorlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,089,330
- Issue date Sep 10, 2024
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board comprising via portions
- Patent number 12,089,329
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of improving wire structure of circuit board and improving w...
- Patent number 12,089,347
- Issue date Sep 10, 2024
- Unimicron Technology Corp.
- Chun Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,082,338
- Issue date Sep 3, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package board, antenna package including the same and image display...
- Patent number 12,040,530
- Issue date Jul 16, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Na Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including shielding member
- Patent number 12,028,975
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Younggwon Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic switch module with oppositely-arranged power switches an...
- Patent number 12,010,799
- Issue date Jun 11, 2024
- BLACK & DECKER INC.
- Joshua M. Lewis
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Printed circuit board
- Patent number 12,004,292
- Issue date Jun 4, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
GRID ARRAY ELECTRICAL CONNECTORS
- Publication number 20250210894
- Publication date Jun 26, 2025
- Intel Corporation
- Arturo PACHON MUNOZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20250203761
- Publication date Jun 19, 2025
- LG Innotek Co., Ltd.
- Duck Hoon PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20250203753
- Publication date Jun 19, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250203774
- Publication date Jun 19, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Deok Hong Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME
- Publication number 20250194006
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- DONGYOON SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250194007
- Publication date Jun 12, 2025
- InnoLux Corporation
- Chia-Chun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA Radio Frequency Module, Substrate for BGA Radio Frequency Modul...
- Publication number 20250185153
- Publication date Jun 5, 2025
- Nippon Telegraph and Telephone Corporation
- Masayuki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CON...
- Publication number 20250168979
- Publication date May 22, 2025
- Suzhou MetaBrain Intelligent Technology Co., Ltd.
- Lei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250159806
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Yongjin Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME
- Publication number 20250149252
- Publication date May 8, 2025
- TDK Corporation
- Daiki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM
- Publication number 20250142725
- Publication date May 1, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Huali ZHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC TIMEPIECE
- Publication number 20250123598
- Publication date Apr 17, 2025
- CASIO COMPUTER CO., LTD.
- Yuta SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250106985
- Publication date Mar 27, 2025
- Innolux Corporation
- Ju-Li Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250107008
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Hu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
- Publication number 20250096089
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Robert Grant SPURNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081353
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250071897
- Publication date Feb 27, 2025
- LG Innotek Co., Ltd.
- Dong Hun JOUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REUSABLE MODULAR SUBSTRATE
- Publication number 20250063657
- Publication date Feb 20, 2025
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240431024
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240422906
- Publication date Dec 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240422905
- Publication date Dec 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20240404978
- Publication date Dec 5, 2024
- Shinko Electric Industries Co., Ltd.
- Masaya Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240397619
- Publication date Nov 28, 2024
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
- Publication number 20240357730
- Publication date Oct 24, 2024
- Harman Becker Automotive Systems GmbH
- Paul-Alexandru BILIGA-NISIPEANU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...
- Publication number 20240304534
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Shu-Wei HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240298406
- Publication date Sep 5, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240298407
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
- Publication number 20240292541
- Publication date Aug 29, 2024
- Black & Decker Inc.
- Joshua M. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDOSCOPE, PRINTED CIRCUIT BOARD OF AN ENDOSCOPE, AND METHOD FOR EL...
- Publication number 20240292524
- Publication date Aug 29, 2024
- OLYMPUS WINTER & IBE GMBH
- Martin WIETERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

directly combined with via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coil structure

Component-incorporated substrate and method for manufacturing same

Wiring substrate

Adapter board and manufacturing method therefor, and board card con...

Conductive structure including copper-phosphorous alloy and a metho...

Power delivery network noise isolation in a computing device

Circuit board structure

Rapid implementation of high-temperature analog interface electronics

Sensor interposer employing castellated through-vias

Probe card device and circuit protection assembly thereof

Circuit board assembly and electronic device including the same

Guard trace ground via optimization for high-speed signaling

Multilayer substrate

Multi-layer printed circuit board

Circuit board structure

Contact arrangement and electronic assembly

Wiring substrate and method for manufacturing wiring substrate

Circuit board

Printed circuit board and camera device comprising same

Multilayer substrate

Auxiliary module for an electrical switching device, and associated...

Circuit board structure and manufacturing method thereof

Wiring substrate

Printed circuit board comprising via portions

Method of improving wire structure of circuit board and improving w...

Printed wiring board

Package board, antenna package including the same and image display...

Electronic device including shielding member

Electronic switch module with oppositely-arranged power switches an...

Printed circuit board

Patents Applicationslast 30 patents

GRID ARRAY ELECTRICAL CONNECTORS

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Thermal Management in Circuit Board Assemblies

PRINTED CIRCUIT BOARD

MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME

ELECTRONIC DEVICE

BGA Radio Frequency Module, Substrate for BGA Radio Frequency Modul...

ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CON...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT BOARD HAVING THE SAME

FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM

ELECTRONIC MODULE AND ELECTRONIC TIMEPIECE

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS

WIRING BOARD AND LAMINATED WIRING BOARD

CIRCUIT BOARD

REUSABLE MODULAR SUBSTRATE

ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...

SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

PRINTED CIRCUIT BOARD

REDUCED BALL GRID ARRAY PAD CAPACITANCE

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...

PRINTED WIRING BOARD

CONNECTING BOARD AND MANUFACTURING METHOD OF THE SAME

ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...

ENDOSCOPE, PRINTED CIRCUIT BOARD OF AN ENDOSCOPE, AND METHOD FOR EL...